JPS5853183U - automatic soldering equipment - Google Patents

automatic soldering equipment

Info

Publication number
JPS5853183U
JPS5853183U JP14775681U JP14775681U JPS5853183U JP S5853183 U JPS5853183 U JP S5853183U JP 14775681 U JP14775681 U JP 14775681U JP 14775681 U JP14775681 U JP 14775681U JP S5853183 U JPS5853183 U JP S5853183U
Authority
JP
Japan
Prior art keywords
automatic soldering
soldering equipment
solder surface
guide rail
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14775681U
Other languages
Japanese (ja)
Inventor
政雄 林
村松　秀哲
白石　潔
稔 佐藤
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP14775681U priority Critical patent/JPS5853183U/en
Publication of JPS5853183U publication Critical patent/JPS5853183U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の一実施例によるガイドレール等を示
す斜視図、第２図は同実施例によるガイドレール等を示
す側面図である。 １：はんだ槽、２ニガイドレール、２′　ニガイドレー
ルの波型部、３ニブリント配線板のキャリア、−４ニブ
リント配線板、５：はんだ。FIG. 1 is a perspective view showing a guide rail etc. according to an embodiment of the present invention, and FIG. 2 is a side view showing a guide rail etc. according to the same embodiment. 1: Solder bath, 2 Ni guide rail, 2' corrugated part of Ni guide rail, 3 carrier of Ni blind wiring board, -4 Ni blind wiring board, 5: Solder.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）プリント配線板をはんだの表面に接触させた後、
短時間、該はんだの表面から離脱させ、再度はんだ面に
進入させる手段を有することを特徴とする自動はんだ付
は装置。(1) After bringing the printed wiring board into contact with the solder surface,
An automatic soldering device characterized by having means for causing the solder to separate from the solder surface for a short time and re-enter the solder surface. （２）前記手段が波型に形成したガイドレールから成り
、該ガイドレール上をプリント配線板のキャリアが走行
させられるように構成したことを特徴とする実用新案登
録請求の範囲第１項記載の自動はんだ付は装置。(2) The utility model registration claim 1 is characterized in that the means comprises a wave-shaped guide rail, and the carrier of the printed wiring board is made to run on the guide rail. Automatic soldering equipment.
JP14775681U 1981-10-06 1981-10-06 automatic soldering equipment Pending JPS5853183U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14775681U JPS5853183U (en) 1981-10-06 1981-10-06 automatic soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14775681U JPS5853183U (en) 1981-10-06 1981-10-06 automatic soldering equipment

Publications (1)

Publication Number Publication Date
JPS5853183U true JPS5853183U (en) 1983-04-11

Family

ID=29940601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14775681U Pending JPS5853183U (en) 1981-10-06 1981-10-06 automatic soldering equipment

Country Status (1)

Country Link
JP (1) JPS5853183U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617063A (en) * 1984-06-20 1986-01-13 Alps Electric Co Ltd Soldering method of small-sized electronic parts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543148A (en) * 1977-06-08 1979-01-11 Asahi Chem Ind Co Ltd Thermoplastic elastomeric composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543148A (en) * 1977-06-08 1979-01-11 Asahi Chem Ind Co Ltd Thermoplastic elastomeric composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS617063A (en) * 1984-06-20 1986-01-13 Alps Electric Co Ltd Soldering method of small-sized electronic parts

Similar Documents

Publication Publication Date Title
JPS5853183U (en) automatic soldering equipment
JPS5918488U (en) Board holding structure for electronic equipment
JPS5851472U (en) automatic soldering equipment
JPS5924747U (en) Double-sided adhesive transfer tape
JPS5853182U (en) automatic soldering equipment
JPS58180692U (en) printed board
JPS5853185U (en) automatic soldering equipment
JPS5853181U (en) automatic soldering equipment
JPS5965589U (en) Printed board fixing device
JPS5989595U (en) Printed circuit board mounting device
JPS60124088U (en) printed wiring device
JPS58166962U (en) Solder bath oxide removal equipment
JPS5839074U (en) automatic soldering equipment
JPS58177968U (en) Solder deep carrier for printed circuit boards
JPS5818388U (en) Wiring board holding device
JPS58175687U (en) Printed circuit board holding mechanism
JPS5989578U (en) Parts mounting structure
JPS5874344U (en) semiconductor equipment
JPS5858375U (en) automatic soldering equipment
JPS6139999U (en) Subcarrier for automatic component placement equipment
JPS60149185U (en) Flat cable holding device
JPS5853184U (en) automatic soldering equipment
JPS5893979U (en) Light emitting diode positioning structure
JPS6046955U (en) Preheater for automatic soldering equipment
JPS5972764U (en) Printed board component mounting board