JPS5868065U - automatic soldering equipment - Google Patents

automatic soldering equipment

Info

Publication number
JPS5868065U
JPS5868065U JP16124181U JP16124181U JPS5868065U JP S5868065 U JPS5868065 U JP S5868065U JP 16124181 U JP16124181 U JP 16124181U JP 16124181 U JP16124181 U JP 16124181U JP S5868065 U JPS5868065 U JP S5868065U
Authority
JP
Japan
Prior art keywords
solder
automatic soldering
soldering equipment
tank
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16124181U
Other languages
Japanese (ja)
Inventor
白石　潔
稔 佐藤
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP16124181U priority Critical patent/JPS5868065U/en
Publication of JPS5868065U publication Critical patent/JPS5868065U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図及び第３図は、本考案の一実施例を示す
概念図である。 １・・・プリント配線板、２・・・はんだ槽、３・・・
はんだ吹き上げ装置、４・・・はんだ。FIG. 1, FIG. 2, and FIG. 3 are conceptual diagrams showing one embodiment of the present invention. 1...Printed wiring board, 2...Solder bath, 3...
Solder blowing device, 4...solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] はんだ槽上力に所定の間隔を隔てて定置したプリント配
線板に、はんだ槽内に設けたはんだ吹き上げ装置から吹
き上げたはんだの量を除々に増しながら、プリント配線
板のはんだ付けを行なうように構成したことを特徴とす
る自動はんだ付は装置。The solder tank is configured to solder printed wiring boards placed at predetermined intervals in a soldering tank while gradually increasing the amount of solder blown up from a solder blowing device installed in the solder tank. Automatic soldering equipment.
JP16124181U 1981-10-30 1981-10-30 automatic soldering equipment Pending JPS5868065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16124181U JPS5868065U (en) 1981-10-30 1981-10-30 automatic soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16124181U JPS5868065U (en) 1981-10-30 1981-10-30 automatic soldering equipment

Publications (1)

Publication Number Publication Date
JPS5868065U true JPS5868065U (en) 1983-05-09

Family

ID=29953617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16124181U Pending JPS5868065U (en) 1981-10-30 1981-10-30 automatic soldering equipment

Country Status (1)

Country Link
JP (1) JPS5868065U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816887U (en) * 1971-07-03 1973-02-26
JPS4827953U (en) * 1971-08-09 1973-04-04
JPS4837031B1 (en) * 1965-11-12 1973-11-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837031B1 (en) * 1965-11-12 1973-11-08
JPS4816887U (en) * 1971-07-03 1973-02-26
JPS4827953U (en) * 1971-08-09 1973-04-04

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