JPS5837167U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5837167U
JPS5837167U JP13032781U JP13032781U JPS5837167U JP S5837167 U JPS5837167 U JP S5837167U JP 13032781 U JP13032781 U JP 13032781U JP 13032781 U JP13032781 U JP 13032781U JP S5837167 U JPS5837167 U JP S5837167U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
soldering
side silk
line width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13032781U
Other languages
Japanese (ja)
Inventor
鮫島 富夫
Original Assignee
日本ビクター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本ビクター株式会社 filed Critical 日本ビクター株式会社
Priority to JP13032781U priority Critical patent/JPS5837167U/en
Publication of JPS5837167U publication Critical patent/JPS5837167U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a、 b、 c及び第2図a、 b、 cは本考
案に係るプリント配線板の説明図、第3図はミスのある
プリント配線板を示す説明図である。 1.6・・・基板、2,7・・・銅箔、3,8・・・ハ
ンダマスキング、4,9・・・ハンダ付は側シルク。
1A, B, C and 2A, B, C are explanatory diagrams of a printed wiring board according to the present invention, and FIG. 3 is an explanatory diagram showing a printed wiring board with a mistake. 1.6... Board, 2,7... Copper foil, 3,8... Solder masking, 4,9... Soldering is side silk.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金型を共用して作る複数種類のプリント配線板において
、回路パターン及びハンダ付は側シルクの特定記号の線
幅を、回路パターンの特定記号の線幅よりハンダ付は側
シルクの特定記号の線幅を細くするかハンダ付は側シル
クの特定記号を中抜きにしたことを特徴とするプリント
配線板。
For multiple types of printed wiring boards that are made using a common mold, the line width of the specific symbol on the side silk for circuit patterns and soldering should be set by the line width of the specific symbol on the side silk for soldering. A printed wiring board characterized by narrowing the width or hollowing out specific symbols on the side silk for soldering.
JP13032781U 1981-09-03 1981-09-03 printed wiring board Pending JPS5837167U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13032781U JPS5837167U (en) 1981-09-03 1981-09-03 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13032781U JPS5837167U (en) 1981-09-03 1981-09-03 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5837167U true JPS5837167U (en) 1983-03-10

Family

ID=29923958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13032781U Pending JPS5837167U (en) 1981-09-03 1981-09-03 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5837167U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100812A1 (en) * 2009-03-02 2010-09-10 株式会社ビッズソリューション Printed circuit board, electronic device, and method of producing printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100812A1 (en) * 2009-03-02 2010-09-10 株式会社ビッズソリューション Printed circuit board, electronic device, and method of producing printed circuit board

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