JPS5837167U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5837167U JPS5837167U JP13032781U JP13032781U JPS5837167U JP S5837167 U JPS5837167 U JP S5837167U JP 13032781 U JP13032781 U JP 13032781U JP 13032781 U JP13032781 U JP 13032781U JP S5837167 U JPS5837167 U JP S5837167U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- soldering
- side silk
- line width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 b、 c及び第2図a、 b、 cは本考
案に係るプリント配線板の説明図、第3図はミスのある
プリント配線板を示す説明図である。
1.6・・・基板、2,7・・・銅箔、3,8・・・ハ
ンダマスキング、4,9・・・ハンダ付は側シルク。1A, B, C and 2A, B, C are explanatory diagrams of a printed wiring board according to the present invention, and FIG. 3 is an explanatory diagram showing a printed wiring board with a mistake. 1.6... Board, 2,7... Copper foil, 3,8... Solder masking, 4,9... Soldering is side silk.
Claims (1)
、回路パターン及びハンダ付は側シルクの特定記号の線
幅を、回路パターンの特定記号の線幅よりハンダ付は側
シルクの特定記号の線幅を細くするかハンダ付は側シル
クの特定記号を中抜きにしたことを特徴とするプリント
配線板。For multiple types of printed wiring boards that are made using a common mold, the line width of the specific symbol on the side silk for circuit patterns and soldering should be set by the line width of the specific symbol on the side silk for soldering. A printed wiring board characterized by narrowing the width or hollowing out specific symbols on the side silk for soldering.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13032781U JPS5837167U (en) | 1981-09-03 | 1981-09-03 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13032781U JPS5837167U (en) | 1981-09-03 | 1981-09-03 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5837167U true JPS5837167U (en) | 1983-03-10 |
Family
ID=29923958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13032781U Pending JPS5837167U (en) | 1981-09-03 | 1981-09-03 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5837167U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010100812A1 (en) * | 2009-03-02 | 2010-09-10 | 株式会社ビッズソリューション | Printed circuit board, electronic device, and method of producing printed circuit board |
-
1981
- 1981-09-03 JP JP13032781U patent/JPS5837167U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010100812A1 (en) * | 2009-03-02 | 2010-09-10 | 株式会社ビッズソリューション | Printed circuit board, electronic device, and method of producing printed circuit board |
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