JPS583300A - Soldering method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention provides a soldering method.

The conventional soldering method is to lower the advancing printed wiring board, immerse its lower surface in the molten solder surface, and then raise it while moving it forward to separate it from the molten solder surface.
I'm doing K.

However, the pigeonhole, in which a chip component without lead wires is glued to the bottom surface of a printed wiring board, and the electrodes at both ends of the chip component are soldered to the pattern of the printed wiring board, cannot be used with the conventional soldering method described above. In this method, when soldering the electrode portion at the rear end of the chip component, gas pools are likely to form, and there is a risk of poor soldering.

The present invention was made in view of these points, and the purpose of the present invention is to remove gas pools from soldering at both ends of a chip component. The soldering method involves moving the lower surface of the solder forward while immersing it in the molten solder surface, and then retreating while dipping the solder surface.

Next, one embodiment of the present invention will be explained based on I@III.

A conveying means for conveying the printed wiring board (2) by lowering and raising it in an inclined manner is provided above the kneading tank (1) installed in a fixed position. This printed wiring board (2)K has the lead wires of the electronic components (3) inserted from above, and an adhesive (4)k is attached to the bottom surface of the printed wiring board (2).
Therefore, the chip component (5) is bonded.

The printed wiring board (21) conveying means movably places a carrier (not shown) holding the printed wiring board (2) on vertically moving rails (not shown) on both sides of the solder tank, and also moves it vertically on a feeding cheno (not shown). You can charge the money freely.

'Then, the printed wiring board (2) is placed in the solder bath (1).
When the printed wiring board (2) is transported horizontally to one end along the transport path (7) at a constant height, lower the vertical movement rail from the forward side and continue to feed the feed chain forward to lower the printed wiring board (2) forward. The printed wiring board (1) is loaded into the solder oval (1) in an inclined state, and then the vertical movement rail is gradually lowered horizontally and the feed chain is continued to be fed forward, and the printed wiring board (5) to which the chip component (5) is bonded is transported. 2) The lower surface of S scale solder It (81K) is advanced while being dipped horizontally, thereby bonding the electrode part (9) at the front end of the chip component (5) and the corresponding prinny wiring board (2).
At the same time, firmly solder the electrode part (9) at the front end to remove the gas pool that is generated as the printed wiring board (2) moves forward. The soldering is forced out of the part aυ by the molten solder colliding with the part αυ.

Subsequently, the forward side of the vertically movable rail is slightly raised, and the printed wiring board (2) v is slightly forwardly upwardly inclined 111K, and is once stopped. At this time, the rear end of the printed wiring board (!) is kept in contact with the melted solder surface (81).

Next, the vertical movement rail is driven in the opposite direction to the above operation, and the feed chain is sent backwards to remove the printed wiring board (
11 is moved on the return trip along the same trajectory as in the above-mentioned outbound trip.

That is, the lower surface of the printed wiring board (21) is returned so that it is immersed horizontally in the S-scale solder surface (8), and is retreated while being immersed. a error and the corresponding printed wiring board I[I
Make sure to solder the electrode part (I) on the rear end of the pattern (3), and remove the gas pool that has formed on the electrode part (I) as the printed wiring board (2) moves back. collides with part a4 *m The soldering is expelled from part αΦ.

Next, the printed wiring board (wound) is moved back along the same trajectory as the forward path using the vertically moving rail h and the feed chino, returning to the position indicated by the solid line, and the vertically moving rail is fixed in position at position e to print the text. Wiring base 1 [(2) to transport path (c) Kf8
move horizontally.

According to the present invention, the lower surface of the printed wiring board to which the chip components are bonded is moved forward while being dipped into the SS solder surface, and then moved back while being dipped, so that both ends of the chip components are When soldering the parts, the gas pockets generated at the parts can be expelled by the molten solder K, especially at the rear end of the chip parts, which could not be removed by conventional soldering methods. Soldering can reliably eliminate 11ml of gas in the area.

[Brief explanation of the drawing]

FIG. 21 is a sectional view showing an embodiment of the soldering method of the present invention, and FIG. 2 is an enlarged sectional view of the bonded portion of the chip component. (2)...Printed wiring board, (5)...Chip parts,
(3)・Self solder side. June 80, 1980 Inventor Takeshi 1) Kota Patent applicant Kinsha Yumura Manufacturing Co., Ltd.

Claims (1)

[Claims] (1) A soldering method characterized by moving the lower surface of a printed wiring board to which a chip component is bonded forward while immersing it in the molten S solder surface, and then moving it back while being immersed.