JPH0222145Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an automatic solder supply device that automatically supplies solder bars to a solder bath of an automatic soldering device.

[Prior Art] Since an automatic soldering device sequentially solders a large number of printed circuit boards, the molten solder in the solder bath adheres to the printed circuit boards and gradually decreases. When the amount of molten solder in the solder tank decreases, the printed circuit board cannot make sufficient contact with the molten solder, leaving unsoldered parts, or it cannot make contact with the molten solder, resulting in defective soldering in which no solder sticks. Therefore, the solder bath must always contain molten solder up to a predetermined position.

Conventionally, in order to ensure that molten solder in a solder tank is at a predetermined position, various automatic solder supply devices have been proposed in which a liquid level detection device is installed in the solder tank and the solder is supplied according to a command from the device. For example, Utility Model Publication No. 39-29652 uses a method in which a solder bar is pushed out sideways one by one from a stocker containing a large number of solder bars in response to commands from a liquid level detection device, and the solder bars are dropped into a solder bath. In devices such as this device in which a bar of solder is dropped from a relatively high place, the force of the drop causes the molten solder in the solder bath to scatter or ripple. If molten solder scatters, it may adhere to printed circuit boards running on automatic soldering equipment, causing short circuits between conductors or damaging electronic components that are sensitive to heat. If the molten solder hits someone, there is a risk of burns. In addition, when a solder stick falls, even if the molten solder does not scatter, if the surface of the molten solder ripples, and when the printed circuit board is in contact with the molten solder, the molten solder may cover the top surface of the printed circuit board, causing unnecessary damage. When solder adheres to the solder area or when the printed circuit board exits the solder bath, the waves may cause icicles or bridging at the soldered area.

Various devices have been proposed in which the solder bar is fed vertically from above in order to prevent the solder from scattering or rippling when the solder bar is supplied to the solder bath. (Unexamined Japanese Patent Publication 1983)
-122665, 58-95893). However, with a device that feeds solder bars vertically, even if the solder bar is immersed in molten solder, the solder bar does not melt immediately and remains standing on the surface of the molten solder. The parts get in the way of the printed circuit board that is traveling one after another. Therefore, in order to prevent the solder sticks rising on the surface of the molten solder liquid from interfering with the movement of the printed circuit board, the solder bath should be enlarged and extended beyond the running area of the printed circuit board. It is necessary to supply solder, but increasing the size of the solder tank means that a large amount of expensive solder must be used, which is not desirable from an economical standpoint or from the standpoint of installation space. Considering these disadvantages, it is desirable to have an apparatus that feeds solder bars horizontally.

[Purpose of the invention] Although the solder bar is fed horizontally into the solder bath, this invention not only does not interfere with the running printed circuit board, but also prevents the molten solder in the solder bath from scattering or rippling. Our objective is to provide an automatic solder supply device that never fails.

[Structure of the invention] The present invention was developed based on the fact that when a solid is dropped into a liquid, if the solid is dropped close to the liquid surface, the liquid will not scatter or the liquid surface will ripple greatly. Completed.

The device of the present invention takes out solder bars stacked on a stocker one by one, holds them in a solder bar holder installed on a solder tank, and releases them just above the surface of the molten solder. It is.

[Example] The present invention will be explained below based on the drawings.

The automatic solder supply device of this invention is stocker 1.
0, a take-out device 20, a solder bar holder 30, and a moving device 40, and the stocker 10
is an elongated box that allows a large number of solder bars B to be stacked in a row. As shown in Figures 1 and 3, the stocker is open on the side so that a large number of solder rods can be inserted into it. Further, openings 11 and 12 are formed in the lower portions of both sides of the stocker. The opening 11 is designed so that a pushing piece 24 of a later-described extraction device 20 can easily enter therein, and the opening 12 is designed so that a solder bar in the stocker can be pulled out laterally.

The take-out device 20 takes out the solder bars B from the stocker 10 one by one in response to commands from a liquid level detection device of a solder tank (not shown), and in the embodiment shown, an air cylinder is used. A push-out piece 24 is installed on the plunger 22 of the air cylinder 21 via a mounting piece 23. The push-out piece 24 is adapted to slide on the base 25 as indicated by arrow A and enter the opening 11 of the stocker 10.

The solder rod holder 30 holds each solder rod extruded from the opening 12 of the stocker by an extrusion device, and a pair of holding parts 31, 31 hold both ends of the solder rod. As shown in FIG. 1, the holding portion has a U-shaped open portion facing toward the opening 12 of the stocker. The approximate center of the holding part is rotatably supported by a hanging piece 33 installed at the end of the hanging plate 32, and the other end of the holding part is supported by a sliding rod 34.
It is rotatably connected to the lower end of. A spring 35 is installed above the opening of the holding part and the hanging plate 32, and the holding part is always biased by the spring so that it is horizontal. A stopper 36 is installed at the upper end of the sliding rod 34, and is adapted to slide up and down into a hole in a mounting base 41 in which a moving device 40, which will be described later, is installed. The stopper 36 is installed at a position slightly before the bottom dead center of the plunger so that it is stopped by the mounting base.

The moving device 40 is installed on a mounting base 41 on which the top cover of the stocker 10 is extended, and in the embodiment, a plunger 42 is installed on an air cylinder 4 that moves up and down.
3 was used. The center of the above-mentioned hanging plate 32 is fixed to the tip of the plunger 42, and as the plunger moves up and down, the hanging plate also moves up and down. Reference numeral 44 denotes guide rods fixed to both ends of the long hanging plate 32 in order to keep it horizontal and move up and down smoothly. It is something that moves.

Next, the operating state of the device of the present invention having the above configuration will be explained.

When the amount of molten solder in the solder tank decreases as the printed circuit boards are soldered one after another, the air cylinder 21, which is an extrusion device, moves the plunger 22 forward in response to a command from a liquid level detection device (not shown) installed in the solder tank. extrude Then the mounting piece 23
The extrusion piece 2 installed on the plunger 22 via
4 enters the opening 11 of the stopper 10 and pushes out only one solder bar B in the stocker from the other opening 12. The solder bar extruded by the extrusion piece 24 is held by the holding portion 31 of the solder bar holder 30 whose opening is aligned with the opening 12 . When the solder bar is held by the holding part, the moving device 40 is activated, and the air cylinder 43 is moved by the plunger 42.
When the holder comes directly above the molten solder S in the solder bath as shown in FIG. A movably connected holding part 3
1 rotates and gently releases the solder bar B into the molten solder S. If the downward movement of the holder by the moving device is performed in accordance with the gaps between the printed circuit boards that are successively running, it is possible to supply solder bars without interfering with the running of the printed circuit boards.

[Effects of the invention] The automatic solder supply device of the invention can hold the solder rod horizontally and gently discharge it just above the surface of the molten solder, so there is no possibility of the molten solder scattering and causing burns to people or molten solder. It will never ripple and adversely affect the soldering of the printed circuit board. In addition, since the automatic solder supply device of the present invention has a structure in which the holder holding the solder bar is moved by the moving device, when supplying the solder to the solder bath,
If it is applied to the gap between the running printed circuit boards, it will not interfere with the running of the printed circuit boards, and there is no need to make a special solder tank large and provide a solder supply section, so there are considerations such as the amount of solder input and the installation area. It can be said that it is excellent.

[Brief explanation of the drawing]

FIG. 1 is a side view of an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. 3 is a side view illustrating the state of supply of solder rods. 10...Stocker, 20...Takeout device, 3
0... Solder bar holder, 40... Moving device, B...
... Solder bar, S... Molten solder.

Claims (1)

[Scope of utility model registration request] A stocker that stores a large number of solder bars, a take-out device that takes out the solder bars in the stocker one by one based on a command from a liquid level detection device, a solder bar that horizontally holds the solder bars taken out from the stocker, and a solder bar that is held. An automatic solder supply comprising: a stick solder holder capable of quietly discharging solder; and a moving device that transports the holder from above to near the solder liquid level in a solder bath without interfering with running of a printed circuit board. Device.