JP3907180B2 - Solder column mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for mounting a solder column on a CGA ceramic substrate, and more particularly to a solder column mounting apparatus suitable for mounting a solder column on a ceramic substrate again during rework of the CGA.
[0002]
[Prior art]
Electronic components have become multifunctional due to improvements in communication speed of electronic devices and integration of electronic components, and the number of leads has been increasing. Conventionally, there are QFP, SOIC, etc., which have increased the number of leads in electronic components, but more and more multifunctional electronic components have recently been required, and conventional multifunctional electronic components have a large number of leads. It's running out. Therefore, BGA (PBGA, CBGA, TBGA) has been used as an electronic component with a large number of leads. Among them, CCGA (Ceramic Column Grid Array, hereinafter referred to as CGA) is a type that further increases the ability to absorb thermal stress between substrates by changing the connection terminal of CBGA from solder balls to solder columns. In the CGA, a large number of solder columns are installed on a ceramic substrate, and electrical connection between printed circuit boards is performed by the solder columns. This solder column uses high-temperature solder mainly composed of lead.
[0003]
Nearly 1,000 solder columns are mounted on the CGA, and the ceramic substrate and the solder column are soldered with a solder paste (in the case of a wire column). In CGA, a ceramic substrate and a printed circuit board must be accurately connected by a solder column, so that the solder column is mounted vertically on the ceramic substrate.
[0004]
When a solder column is mounted on a ceramic substrate, a solder paste made of ordinary solder or low temperature solder having a melting point lower than that of the solder column is used. When mounting the solder column, apply the solder paste to the pad of the ceramic substrate, place the solder column vertically on the application part, then melt only the solder paste with a heating device such as a reflow furnace, and the ceramic substrate and the solder column And solder. When placing the solder column vertically, insert the solder column into the hole of the mounting jig, place the ceramic substrate on the jig, and heat the ceramic substrate and the jig in the reflow furnace. To do. Thus, when mounting a CGA with a solder column mounted on a printed circuit board, solder paste of ordinary solder or low temperature solder having a melting point lower than that of the solder column is applied to the printed circuit board, and the CGA is applied to the application part. After placing the solder column, only the solder paste is melted and soldered in a reflow oven.
[0005]
By the way, when mounting the CGA on a printed circuit board, the solder column applied to the printed circuit board and the solder column of the CGA are not sufficiently soldered, or the solder paste is not applied to the printed circuit board. If the printed circuit board and the printed circuit board are poorly soldered, the electronic device incorporating the CGA cannot perform its function. Also, since the solder column is a high-temperature solder composed mainly of lead, the solder column is flexible and deforms with a little force or vibration, making it impossible to connect to a predetermined pad on the printed circuit board when mounted on the printed circuit board. As a result, the functions of the electronic device cannot be exhibited.
[0006]
If the CGA and printed circuit board are defective, the CGA is removed from the printed circuit board and another CGA is mounted. The CGA removed from the printed circuit board is discarded because a solder column or solder is attached to the ceramic circuit board and cannot be used as it is.
[0007]
[Problems to be solved by the invention]
The CGA removed from the printed circuit board due to mounting failure has no functional problem at all, and is more expensive than other electronic components, so it is very expensive. Since it is economically problematic to dispose of expensive CGAs that are functionally unaffected in this way, so-called rework has recently been required to reuse CGAs that have been removed due to poor mounting. Yes. An object of the present invention is to provide a solder column mounting apparatus suitable for reworking a CGA removed from a printed circuit board.
[0008]
[Means for Solving the Problems]
Since the present inventors have a solder column used for CGA, it cuts long wire solder straightly at a certain length and has a precision finish with no burrs or sag on the cut surfaces at both ends. The present invention was completed by paying attention to the fact that the solder column does not get caught in the middle when the solder column is moved, or smoothly enters a hole having a slightly larger diameter than the solder column.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is an apparatus for mounting a solder column at a predetermined position of a ceramic substrate of a CGA, and an adsorption part is detachably installed on the upper part of the main body, and the adsorption part includes a row of solder columns of the CGA. Holes that allow easy insertion of solder columns at the same interval are drilled, and the main body with the suction section is the same as the holes in the suction section where the number of suction columns is longer. Grooves that can be moved in the direction are engraved, the lower part of the main body is a housing part that can accommodate a large number of solder columns, the main body is installed so that it can be tilted, and the main body is a vibration device Is a solder column mounting device characterized in that is installed.
[0010]
The solder column mounting device (hereinafter referred to as mounting device) of the present invention inserts a solder column placed in a groove of a main body into a hole of an adsorption portion. The suction part sucks the inside of the hole so that the solder column can be easily inserted into the hole and the solder column does not fall out of the hole of the suction part when the suction part is set up. However, when inserting the solder column in the groove into the hole of the suction part with the groove of the main body and the hole of the suction part aligned, the two solder columns stay at the hole and there is no solder column in the hole. It may become impossible to enter.
[0011]
This is because the two solder columns are about to be sucked into the hole at the hole of the suction portion. That is, the groove is slightly thicker than the diameter of the solder column, and a large number of solder columns enter in the longitudinal direction, but only one solder column enters in the width direction. However, when the solder column is placed on the solder column in the groove and comes close to the hole of the suction part, the hole is in a suction state by the suction device. The solder column on the solder column is about to be sucked into the hole, and the solder column in the groove cannot enter the hole.
[0012]
Therefore, in order to prevent the solder column from getting on the solder column in the groove near the hole, a cover may be installed under the hole. If the cover has an isosceles triangle with a high center, a right triangle with a high side, or a semicircular or semi-elliptical diameter, the solder column on the solder column in the groove moves to both sides or one side of the cover. , Don't go near the hole in the suction part. If the cover is a transparent plate, you can see the movement of the solder column.
[0013]
【Example】
Hereinafter, the mounting apparatus of the present invention will be described with reference to the drawings. 1 is a partial cross-sectional front view of the mounting device of the present invention, FIG. 2 is a cross-sectional side view of the mounting device of the present invention, FIG. 3 is a perspective view with a part of the bracket and cover broken, and FIG. FIG. 5 is an enlarged sectional view, and FIG. 5 is a diagram for explaining a state in which an isosceles triangle cover is installed on the groove of the main body.
[0014]
The surface of the main body 1 of the mounting device is a dent 2 surrounded on all sides, and a fitting part 4 for fitting the suction part 3 is formed on the upper part of the dent. When the suction portion 3 is fitted to the fitting portion, a large number of grooves 6 are engraved in the main body 1 that coincides with the numerous holes 5 of the suction portion. The cross section of the groove 6 is square, U-shaped with a semicircle at the bottom, etc. When the solder column 7 enters the groove, the solder column is completely immersed in the groove, and a part of the solder column is Keep it out of the surface. For example, if the solder column has a diameter of 0.5 mm and the groove has a square cross section, one side of the square is 0.6 mm.
[0015]
At the lower part of the surface of the main body 1, a door-seal-like cover 8 is installed to form a solder column housing portion 9 having a hollow inside. An L-shaped bracket 10 is installed on the upper part of the main body 1, and knock cylinders 11 (one not shown) are fixed to the bracket at two locations. The knock cylinder holds the suction part 3 from the main body 1 when the suction part 3 is fitted to the main body 1 and the main body 1 is inclined so that the suction part 3 is below the horizontal plane. is there.
[0016]
A vibration device 12 is installed above the back surface of the main body 1. The vibration device applies a slight vibration like a vibrator to the main body 1. The back surface of the main body 1 is attached to the rotary actuator 14 via the attachment piece 13. The rotary actuator 14 tilts the upper part from the vertical state slightly below the horizontal plane as shown by the two-dot chain line in FIG.
[0017]
A plurality of holes 5 are formed in the suction portion 3 at the same position as one row of CGA pads (solder column mounting portions) (not shown). The diameter B of the hole 5 is slightly thicker than the diameter H of the solder column 7 as shown in FIG. 4 so that one solder column can be inserted but two cannot be inserted. For example, when the diameter of the solder column is 0.5 mm, the diameter of the hole 5 is set to 0.6 mm. The suction holes 15 that are thinner than the diameter of the solder column are formed at the tips of the holes 5. The suction holes communicate with the suction chamber 16 that is widened. The suction chamber 16 is connected to a suction device (not shown), and when necessary, the suction device is operated to bring the hole 5 leading to the suction chamber into a suction state (arrow).
[0018]
Next, solder column mounting in the mounting apparatus of the present invention having the above-described configuration will be described. First, the main body 1 is set in a vertical state, the suction portion 3 is fitted to the fitting portion 4 of the main body 1, and the suction portion is fixed by two knock cylinders 11. A large number of solder columns 7 are placed in the accommodating portion 9 and the vibration device 12 is operated. Then, as shown by a two-dot chain line in FIG. 2, the main body 1 is inclined by the rotary actuator 14 to a position where the upper part is slightly below the horizontal plane. Then, the solder columns 7... In the housing part 9 move in the direction of the suction part 3 due to the inclination and vibration of the main body. In this way, the solder columns 7 that move in the depressions 2 of the main body enter into a large number of grooves 6 carved in the main body 1, and the solder columns that have entered the grooves are adsorbed by the vibration of the vibration device. Move in the direction of the hole 5. When the solder column 7 comes close to the hole 5 of the suction part 3, the hole 5 is in a sucked state, so that the solder column 7 is easily sucked into the hole 5. At this time, if an isosceles triangular cover 17 is installed at the lower part of the suction part as shown in FIG. 5, the solder column is removed on both sides of the groove so that the two stay at the hole 5 of the suction part 3. Will disappear.
[0019]
If the solder columns 7 are inserted into all the holes 5 of the suction part 3 in this way, the main body 1 is returned to the vertical state by the rotary actuator 14. Then, the knock cylinders 11 and 11 are released, the suction unit 3 is gripped by a moving device (not shown), and removed from the main body 1 as shown by a two-dot chain line in FIG. The suction portion 3 removed from the main body 1 is moved to a mounting jig (not shown) waiting at a predetermined position, and the holes 5 of the suction device are aligned with the holes in one row of the mounting jig. Stop the operation. Then, the solder columns 7 inserted in the holes 5 of the suction part 3 enter the holes of the mounting jig. If a solder column can be inserted into every hole in the mounting jig and the solder column can be inserted into all the holes, a CGA ceramic substrate with a solder paste applied to the pad is placed on the mounting jig, Heat in a reflow oven to solder the ceramic substrate and the solder column.
[0020]
When a solder column was mounted on a CGA ceramic substrate having a total of 961 pads, 31 columns in a row and 31 columns in a row, using the mounting apparatus of the present invention, there was no mounting failure.
[0021]
【The invention's effect】
As described above, the mounting apparatus of the present invention can reliably and accurately mount the solder columns one by one on the CGA ceramic substrate, so that it can rework expensive CGAs that were discarded due to poor mounting of the solder columns. This is an excellent effect in terms of reliability and economy.
[Brief description of the drawings]
FIG. 1 is a partial front sectional view of the mounting device of the present invention. FIG. 2 is a sectional side view of the mounting device of the present invention. FIG. 3 is a perspective view with a part of the bracket and cover broken. Partially enlarged cross-sectional view [Fig. 5] Diagram explaining the state where an isosceles triangle cover is installed on the groove of the main body [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Main body 3 Adsorption part 5 Hole 6 Groove 7 Solder column 9 Storage part 12 Vibration apparatus

Claims (3)

A device for mounting a solder column at a predetermined position of a CGA ceramic substrate, and a suction part is detachably installed on the upper part of the main body, and the suction part is arranged at intervals corresponding to the rows of the CGA solder column. A hole for easy insertion of the solder column is drilled, and the body with the suction part is installed in the same number of holes as the suction part in the main body where the suction part is installed, and the solder column is moved in the longitudinal direction. The lower part of the main body is an accommodating part that can accommodate a large number of solder columns, the main body is tilted, and the main body is equipped with a vibration device. A solder column mounting device characterized by that. 2. The solder column mounting device according to claim 1, wherein a cover capable of removing a solder column that does not enter the groove laterally is installed at a position in contact with the lower portion of the suction portion. The solder column mounting device according to claim 1, wherein an end portion of the suction portion is a suction hole having a diameter smaller than that of the hole, and the suction hole is connected to a suction device.

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