JPS62152153A - Method for fixing lead pin in circuit board - Google Patents
Method for fixing lead pin in circuit boardInfo
- Publication number
- JPS62152153A JPS62152153A JP29758785A JP29758785A JPS62152153A JP S62152153 A JPS62152153 A JP S62152153A JP 29758785 A JP29758785 A JP 29758785A JP 29758785 A JP29758785 A JP 29758785A JP S62152153 A JPS62152153 A JP S62152153A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead pin
- solder
- lead
- fixing jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本願は、ＩＣチップを搭載した回路基板に、ｊ３番ノる
リードピンの固着方法の発明に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present application relates to an invention of a method for fixing a lead pin numbered J3 to a circuit board on which an IC chip is mounted.
（従来の技術とその問題点）
現在、回路Ｊｊ！叛に於けるリードピンの固着方法は、
第７図に示す如く、回路基板（ａ）のスルホール部（ｂ
）にリードピン（Ｃ）を強制圧入して、該リードピンの
脚杆部（ｃｌ）上方に圧潰形成された当接部（Ｃ２）で
仮止めした後、リードピン（Ｃ）の拡大頭部（ｄ）周縁
及びスルホール部（ｂ）の下側開口部（ｂｌ）を半田付
けして固着していた。(Conventional technology and its problems) Currently, circuit Jj! The method of fixing the lead pin in the rebellion is as follows:
As shown in FIG. 7, the through-hole portion (b) of the circuit board (a)
), and after temporarily fixing it at the contact part (C2) which is crushed and formed above the leg rod part (cl) of the lead pin, the enlarged head part (d) of the lead pin (C) is The peripheral edge and the lower opening (bl) of the through-hole portion (b) were fixed by soldering.
ところが、この方法は、拡大頭部（ｄ）及び前記当接部
（Ｃ２）を備えたリードピン（Ｃ）を一本ずつ成形しな
ければならず、さらに回路基板（ａ＞へのリードピン（
Ｃ）の固着作業も仮止め工程と半田付は工程が夫々別工
程で行われているため、作業能率が悪かった。However, in this method, the lead pins (C) each having the enlarged head (d) and the contact portion (C2) must be molded one by one, and the lead pins (C) to the circuit board (a>) must be molded one by one.
In the fixing work (C), the temporary fixing process and the soldering process were performed in separate processes, resulting in poor work efficiency.
また、前記かしめによる強制圧入方法は、リードピン（
Ｃ）の当接部（Ｃ２）がスルホール内のメツ２１層（ｅ
）を破壊するため導電不良を起１等の問題があった。In addition, the forcible press-fitting method using caulking described above uses lead pins (
The contact part (C2) of C) is connected to the 21st layer (e
), leading to poor conductivity and other problems.
（発明が解決しようとする技術的課題）以上の問題を解
決しようとする本発明の技術的課題は、回路基板に於【
」るリードピンの固着方法の能率化を図ると共に、信頼
性の高い回路基板を提供するこ、とである。(Technical Problem to be Solved by the Invention) The technical problem to be solved by the present invention is to solve the above problems.
An object of the present invention is to improve the efficiency of a method for fixing lead pins and provide a highly reliable circuit board.
（技術的課題を達成するための技術的手段）以上の技術
的課題を達成Ｍ−るための本発明の技術的手段は、固定
冶具に保持された多数のリードピンを、回路基板のスル
ホール部に挿入して下降させると共に、該リードピンの
先端をＴｍに当接させ、該半田を加熱溶解して固着する
ことである。(Technical Means for Achieving the Technical Problem) The technical means of the present invention for achieving the above-mentioned technical problem is to attach a large number of lead pins held in a fixing jig to a through-hole portion of a circuit board. While inserting and lowering the lead pin, the tip of the lead pin is brought into contact with Tm, and the solder is heated and melted to be fixed.
（作用）
而して、上記方法によれば、固定冶具に保持された多数
のリードピンは、該固定冶具の下降にＪ二り回路基板の
スルホール部に挿入されると共に、該スルホール部内を
Ｆ降してその先端が半田に当接される。(Function) According to the above method, the large number of lead pins held by the fixing jig are inserted into the through holes of the circuit board when the fixing jig is lowered, and the lead pins are inserted into the through holes of the circuit board when the fixing jig is lowered. Then, its tip is brought into contact with the solder.
そして、該リードピンの先端が半田に当接されると同時
に、固定治具の下降が停止し、該半田が加熱溶解されて
リードピンとスルホール部内周との間に形成された間隙
を毛細管現象により上Ｗして該間隙内に充填凝固され、
リードピンを回路基板に固着する。At the same time that the tip of the lead pin comes into contact with the solder, the fixing jig stops descending, and the solder is heated and melted to fill the gap formed between the lead pin and the inner periphery of the through-hole part by capillary action. W to fill and solidify the gap,
Secure the lead pins to the circuit board.
（発明の効果）
本発明は以上の様な方法にしたことにより下記の効果を
有する。(Effects of the Invention) By employing the method described above, the present invention has the following effects.
■ 回路基板に於けるスルボールへのリードピンの仮止
め工程及び半田付は工程を連続作業で行うことができる
と共に、リードピンを一度に全部固着することができる
のでリードピンの固着方法の作業能率を高めることがＣ
きる。■ Temporarily fixing and soldering the lead pins to the through balls on the circuit board can be performed continuously, and all the lead pins can be fixed at once, improving the work efficiency of the lead pin fixing method. is C
Wear.
■ 回路基板にお（）るスルホール部への仮止めを固定
冶具で行うことにより、スルホール部内のメッキ層が破
壊されないため、導電性が良く信頼性の高い回路基板を
提供することができる。(2) By temporarily fixing the through-holes on the circuit board using a fixing jig, the plating layer inside the through-holes will not be destroyed, making it possible to provide a circuit board with good conductivity and high reliability.
（実施例） 以下、本発明の一実施例を図面により説明する。(Example) An embodiment of the present invention will be described below with reference to the drawings.
図中（Ａ＞はリードピンの固着装置であり、固定治具（
１）と該固定冶具（１）の下方に配置された発熱具（２
）とにより形成され、これら固定冶具（１）と発熱具（
２）との間に回路基板（３）が配置される。In the figure (A> is the lead pin fixing device, and the fixing jig (
1) and a heating device (2) placed below the fixing jig (1).
), and these fixing jig (1) and heating tool (
A circuit board (3) is placed between the two.
固定冶具（１〉は上下スライド可能に設けられると共に
、その下面にリードピン（４）を保持するための保持部
（５）が回路基板（３）に開穿されたスルホール部（６
）の数と同数設けられる。The fixing jig (1) is provided so as to be able to slide up and down, and has a through-hole part (6) drilled in the circuit board (3) with a holding part (5) for holding the lead pin (4) on its lower surface.
) are provided in the same number as the number of
該保持部（５）は、リードピン（４）の径よりもわずか
に大径な挿入孔（５ａ）と、該挿入孔（５ａ）の上面に
設りた電磁石（５ｂ）とによりなり、該電磁石（５ｂ）
でリードピン（４）の端部を吸着して垂直状に保持せし
める。The holding part (5) consists of an insertion hole (5a) having a diameter slightly larger than the diameter of the lead pin (4), and an electromagnet (5b) provided on the upper surface of the insertion hole (5a). (5b)
The end of the lead pin (4) is sucked and held vertically.
また該挿入孔（５ａ）の深さは、挿入されたリードピン
をその内周面で支えることが出来る程度の乙のにする。Further, the depth of the insertion hole (5a) is set to a depth that allows the inserted lead pin to be supported by its inner peripheral surface.
発熱具（２）は前記固定冶具（１）に対応して上下スラ
イド可能に設けられると共に、その」−面に固定治具〈
１）の保持部（５）と対応する半１］］（７）の載置部
（８）が該保持部（５）と回教凹設される。The heating tool (2) is provided so as to be able to slide up and down corresponding to the fixing jig (1), and the fixing jig
The holding part (8) of half 1] (7) corresponding to the holding part (5) of 1) is recessed with the holding part (5).
該載置部（８）は半円形状に形成され、その下部に設け
た電熱ヒーター（図示せＩ＃″）により半１０を溶解可
能な温度に加熱される。The placing portion (8) is formed in a semicircular shape, and is heated to a temperature at which the half 10 can be melted by an electric heater (I#'' shown in the figure) provided at the bottom thereof.
半田（９）はボール状に形成された４−６半田を使用し
、Ｉ）Ｘ置部（８）の加熱により液状に溶解されて、前
記スルホール部内周とリードピン（４）との間隙（１０
）に充填されてリードピン（４）を固着する。The solder (9) is a ball-shaped 4-6 solder, which is melted into a liquid state by heating in the I)X placement part (8) and fills the gap (10
) to fix the lead pin (4).
回路基板（３）はセラミック、ガラス、プラスチックで
成形された基板に平面円形の取付孔が多数開穿され、そ
の内面に導電性の高い銅メッキ、金メッキ等が施されて
スルホール部（６）が形成され、また上面にはその中央
部にＩＣデツプを搭載するための凹部（１１）が形成さ
れると共に、スルボール部（６）に固着されるり一ドピ
ン（４）とＩＣチップとを連結する導細線がプリントさ
れている。The circuit board (3) is made of ceramic, glass, or plastic and has a large number of planar circular mounting holes.The inner surface of the circuit board is plated with highly conductive copper or gold to form through-hole portions (6). A recess (11) for mounting an IC chip is formed in the center of the upper surface, and a conductor is fixed to the through ball part (6) to connect the dowel pin (4) and the IC chip. Printed with thin lines.
而して、該回路基板（３）は前記固定冶具（１）の保持
部（５）の中心軸にスルホール部（６）の中心を一致さ
Ｖて配置Ｌ？する。Then, the circuit board (3) is placed so that the center of the through-hole part (6) coincides with the central axis of the holding part (5) of the fixing jig (1). do.
また、上記加熱、貝（２）は第４図、第５図に示す如く
、上面に回路基板（３）のスルホール部（６）と同数の
突起部（１２）を突設し、該突起部（１２）を加熱する
ことにより半田（９）を溶解してリードピン（４）を固
着する方法らにえられる。Further, as shown in FIGS. 4 and 5, the heating shell (2) has protrusions (12) of the same number as the through-holes (6) of the circuit board (3) protruding from the upper surface. A method for fixing the lead pin (4) by melting the solder (9) by heating the solder (12) can be obtained.
この場合、半田（９）はあらかじめ回路１ｉ（３）のス
ルホール部（６）の下側開口部に印刷スポツティング等
により付着させておく。In this case, the solder (9) is previously attached to the lower opening of the through-hole portion (6) of the circuit 1i (3) by printing spotting or the like.
次に、図示する工程図に従って本発明のり一ドピンの固
着方法について説明する。Next, a method for fixing a glued pin according to the present invention will be explained according to the illustrated process diagram.
まず、回路基板（３）をそのスルホール部（６）の中心
が保持部（５）の中心軸に合致するように配置すると共
に、発熱具（２）の全ての載置部（８）にボール状の半
田（９）を載置し、かつ固定冶具（１）の保持部（５）
に適宜長さに形成されたリードピン（４）をｆｆ１１石
（５ｂ）で垂直状に保持する。First, place the circuit board (3) so that the center of its through-hole part (6) coincides with the central axis of the holding part (5), and place the balls on all the mounting parts (8) of the heating device (2). The shaped solder (9) is placed on the holding part (5) of the fixing jig (1).
A lead pin (4) formed to an appropriate length is held vertically with an ff11 stone (5b).
そして、固定治具（１）が下降されてリードピン（４）
がスルボール部（６）へ挿入され、発熱具（２）の載置
部（８）に載置された半「１（９）或いは回路基板（３
）の下側開口部（６ａ）に（＝Ｉ着された半田（９）に
当接される。Then, the fixing jig (1) is lowered and the lead pin (4)
is inserted into the through ball part (6), and the semi-circuit board (9) or circuit board (3) placed on the mounting part (8) of the heating device (2) is
) is brought into contact with the solder (9) applied to the lower opening (6a) of (=I).
この際、半［ｆｌ（９）が載置部（８）にＭ、冒される
場合は、発熱具（２）を半田（９）の先端部がスルボー
ル部（６）の下側開口部（６ａ）に当接される位置に保
持せしめ、半ＩＢ（９）が回路基板（３）にお（）るス
ルホール部（６）の下側間口部（６ａ）に付着されてい
る場合は、発熱具（２）を突起部（１２）が半田（９）
に当接させた（ひ置に保持せしめる。At this time, if the solder (9) is damaged by the placement part (8), the tip of the solder (9) should be inserted into the lower opening (6) of the through ball part (6). 6a), and if the half IB (9) is attached to the lower opening (6a) of the through hole (6) on the circuit board (3), heat generation will occur. The protrusion (12) of the tool (2) is soldered (9)
(hold it in place)
而して、以上のような状態で載置部（８）及び突起部（
１２）を電熱ヒーターで加熱して半田（９）を液状に溶
解させてリードピン（４）とスルホール部（６）内周と
の間に形成される間隙（６ｂ）に毛細管現象により上昇
させる。Therefore, in the above state, the placing part (8) and the protrusion (
12) is heated with an electric heater to dissolve the solder (9) into a liquid state, and the solder (9) is caused to rise into the gap (6b) formed between the lead pin (4) and the inner periphery of the through-hole portion (6) by capillary action.
そして、該間隙（６ｂ）に充填された半田（９）が凝固
してから電磁石（５ｂ）を切って、固定治具（１）を上
昇させると共に、発熱具（２）を下降させる。Then, after the solder (9) filled in the gap (6b) solidifies, the electromagnet (5b) is turned off, the fixing jig (1) is raised, and the heat generating tool (2) is lowered.
図面第１図乃至第３図は発熱具における載置部に半田が
載置された場合の本発明の工程図、第４図乃至第６図は
回路基板におけるマウント部の下側開口部に半田を付着
させた場合の本発明の工程図、第７図は従来例を示す断
面図である。
尚、図中
（１）：固定治具 （３）：回路基板（４）：リード
ピン （６）：スルホール部（９）二半田
を夫々示ず。Figures 1 to 3 are process diagrams of the present invention in which solder is placed on the placement part of the heat generating device, and Figures 4 to 6 are the process diagrams of the present invention in which solder is placed on the lower opening of the mounting part of the circuit board. FIG. 7 is a cross-sectional view showing a conventional example. In the figure, (1): fixing jig (3): circuit board (4): lead pin (6): through-hole part (9) and two solders are not shown.
Claims (1)
スルホール部に挿入して下降させると共に、該リードピ
ンの先端を半田に当接させ、該半田を加熱溶解して固着
する回路基板におけるリードピンの固着方法。A large number of lead pins held in a fixing jig are inserted into the through holes of the circuit board and lowered, and the tips of the lead pins are brought into contact with solder, and the solder is heated and melted to fix the lead pins on the circuit board. Fixation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29758785A JPS62152153A (en) | 1985-12-25 | 1985-12-25 | Method for fixing lead pin in circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29758785A JPS62152153A (en) | 1985-12-25 | 1985-12-25 | Method for fixing lead pin in circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62152153A true JPS62152153A (en) | 1987-07-07 |
Family
ID=17848481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29758785A Pending JPS62152153A (en) | 1985-12-25 | 1985-12-25 | Method for fixing lead pin in circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62152153A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320056A (en) * | 1991-03-21 | 1992-11-10 | Internatl Business Mach Corp <Ibm> | Substrate soldering method using reducing atmosphere and soldering template |
| JP2000195983A (en) * | 1998-12-24 | 2000-07-14 | Ngk Spark Plug Co Ltd | Substrate made of resin |
| CN117655453A (en) * | 2024-02-01 | 2024-03-08 | 德州欧瑞电子通信设备制造有限公司 | Automatic welding equipment for electronic components of integrated circuit board |
-
1985
- 1985-12-25 JP JP29758785A patent/JPS62152153A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320056A (en) * | 1991-03-21 | 1992-11-10 | Internatl Business Mach Corp <Ibm> | Substrate soldering method using reducing atmosphere and soldering template |
| JP2000195983A (en) * | 1998-12-24 | 2000-07-14 | Ngk Spark Plug Co Ltd | Substrate made of resin |
| CN117655453A (en) * | 2024-02-01 | 2024-03-08 | 德州欧瑞电子通信设备制造有限公司 | Automatic welding equipment for electronic components of integrated circuit board |
| CN117655453B (en) * | 2024-02-01 | 2024-04-09 | 德州欧瑞电子通信设备制造有限公司 | Automatic welding equipment for electronic components of integrated circuit board |
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| JPH0223644A (en) | Manufacture of mounting board equipped with conduction pin | |
| JPH0584038B2 (en) |