JPH0217949B2 - - Google Patents
Info
- Publication number
- JPH0217949B2 JPH0217949B2 JP3780484A JP3780484A JPH0217949B2 JP H0217949 B2 JPH0217949 B2 JP H0217949B2 JP 3780484 A JP3780484 A JP 3780484A JP 3780484 A JP3780484 A JP 3780484A JP H0217949 B2 JPH0217949 B2 JP H0217949B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- component
- circuit board
- printed circuit
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 9
- 239000011651 chromium Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明はリードを有する部品をプリント基板に
取付ける方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method of attaching a component having leads to a printed circuit board.
(b) 従来技術と問題点
リードを有する部品をプリント基板に取付ける
には、これまで一般的には、第１図ａに部分的な
断面図を示すように、部品１のリード２をスルー
ホール４に挿入した状態ではんだ５により部品１
をプリント板３に取付けていた。(b) Prior art and problems In order to attach a component with leads to a printed circuit board, it has generally been the case that the lead 2 of component 1 is inserted through a through hole, as shown in a partial cross-sectional view in Figure 1a. Part 1 is inserted into Part 4 by solder 5.
was attached to printed board 3.
しかしながらこのような取付け方では、部品の
大きさが限られたなかでリード数を多くなると隣
接するリードの間隔が小さくなり位置合わせの余
裕を見込んだ大きな径のスルーホールが設けにく
くなり、多数のリードを多数のスルーホールに同
時に挿入することが難しくなつてくる。 However, with this mounting method, when the number of leads increases while the size of the component is limited, the spacing between adjacent leads becomes smaller, making it difficult to provide large-diameter through-holes with allowances for alignment. It is becoming difficult to insert the through holes into many through holes at the same time.
そこでこの問題を解決するために、第１図ｂに
示すように部品１のリード２をスルーホール４の
パツド部６（スルーホールからはずれた領域でも
よい）に当接し、はんだ５で固着する方法が提案
されている。 Therefore, in order to solve this problem, as shown in FIG. is proposed.
この方法では、パツド部６にはんだを置く必要
があるが、従来はパツド部に対応した開孔を有す
るテンプレート状の治具を用い、この開孔部内に
はんだボールを入れ、加熱することによりパツド
部にはんだを置いていた。しかし、この方法では
基板上に治具を置き、振動を加えて開孔部内には
んだボールを入れ、加熱するという具合に工程が
多い欠点があつた。 In this method, it is necessary to place solder on the pad part 6, but conventionally, a template-like jig with an opening corresponding to the pad part is used, a solder ball is placed in the opening part, and the pad is heated. There was solder in the room. However, this method had the disadvantage that it required many steps, such as placing a jig on the substrate, applying vibration, inserting the solder ball into the opening, and heating it.
(c) 発明の目的
本発明の目的は、従来のこのような欠点を解消
し、パツド部に容易にはんだを残して部品を取付
けることのできる方法を提供することにある。(c) Object of the Invention The object of the present invention is to provide a method of solving the above-mentioned drawbacks of the conventional method and of attaching components by easily leaving solder on the pad portion.
(d) 発明の構成
上記目的を達成するための本発明は、リードを
有する部品をプリント基板に取付ける方法におい
て、該リードの一部を他の部分よりはんだが熱に
よつて脱落しやすい状態にし、リード表面にはん
だを被着した後、加熱して該一部上のはんだを該
プリント基板のパツド上に脱落させ、該パツド上
のはんだにより該部品を該プリント基板に固着す
ることを特徴とする。(d) Structure of the Invention In order to achieve the above object, the present invention provides a method for attaching a component having leads to a printed circuit board, in which a part of the lead is made in a state where solder is more likely to fall off due to heat than other parts. , after applying solder to the surface of the lead, the solder on a portion of the lead is heated to drop onto a pad of the printed circuit board, and the component is fixed to the printed circuit board by the solder on the pad. do.
(e) 発明の実施例
以下、本発明の一実施例を、図面を用いて説明
する。(e) Embodiment of the invention An embodiment of the invention will be described below with reference to the drawings.
第２図は、本発明の一実施例を示す工程順図で
ある。 FIG. 2 is a process flow diagram showing an embodiment of the present invention.
まず第２図ａに示すように部品１のリード（鉄
−ニツケル合金、長さ１〜２mm）２の先端から
0.5mmより上の部分に厚さ２〜3μｍのクロム（Cr）
層２１を被着し、次いで全面に厚さ１〜2μｍの
金（Au）層２２を被着する。 First, as shown in Figure 2a, start from the tip of lead 2 of component 1 (iron-nickel alloy, length 1-2 mm).
Chromium (Cr) with a thickness of 2 to 3 μm above 0.5 mm
A layer 21 is applied, followed by a gold (Au) layer 22 with a thickness of 1 to 2 μm over the entire surface.
次に第２図ｂに示すように温度220〜230℃では
んだ５をリード全面につける。 Next, as shown in FIG. 2b, solder 5 is applied to the entire surface of the leads at a temperature of 220 to 230°C.
次にリードの先端第２図ｃに示すようにプリン
ト基板３のパツド部６に当接させた状態で250℃
程度に加熱する。 Next, as shown in FIG.
Heat to moderate temperature.
この熱処理により金層２２ははんだ５内に溶け
込み、はんだ５とリードの下地が接触する。 Through this heat treatment, the gold layer 22 melts into the solder 5, and the solder 5 and the base of the lead come into contact.
この際、はんだ５とリード素材の鉄−ニツケル
合金とはぬれ性が良いのでリード２の先端部には
んだが残るが、はんだ５とクロム層２１のぬれ性
は良くないため、この部分のはんだ５はパツド部
６上に脱落する。 At this time, the solder 5 and the lead material iron-nickel alloy have good wettability, so some solder remains at the tip of the lead 2, but the wettability between the solder 5 and the chromium layer 21 is not good, so the solder 5 in this part falls onto the pad portion 6.
この脱落したはんだにより、リード２はパツド
部６に固着され、部品１がプリント基板３に取付
けられる。 With this dropped solder, the leads 2 are fixed to the pad portions 6, and the component 1 is attached to the printed circuit board 3.
(f) 発明の効果
以上説明した通り、本発明によればパツド上に
容易にはんだを乗せることができるのでプリント
基板への部品の取付けを容易に行うことができ
る。(f) Effects of the Invention As explained above, according to the present invention, solder can be easily placed on the pads, so parts can be easily attached to the printed circuit board.
第１図は部品のプリント基板への取付け方を説
明する図、第２図は本発明の一実施例を示す図で
ある。
図において、１は部品、２はリード、３はプリ
ント基板、５ははんだ、６はパツド部、２１はク
ロム層、２２は金層を示す。
FIG. 1 is a diagram for explaining how to attach components to a printed circuit board, and FIG. 2 is a diagram showing an embodiment of the present invention. In the figure, 1 is a component, 2 is a lead, 3 is a printed circuit board, 5 is solder, 6 is a pad portion, 21 is a chromium layer, and 22 is a gold layer.
Claims (1)
る方法において、該リードの一部を他の部分より
はんだが熱によつて脱落しやすい状態にし、リー
ド表面にはんだを被着した後、加熱して該一部上
のはんだを該プリント基板のパツド上に脱落さ
せ、該パツド上のはんだにより該部品を該プリン
ト基板に固着することを特徴とする部品取付け方
法。1. In a method of attaching a component having leads to a printed circuit board, a part of the lead is made in a state where the solder is more likely to fall off due to heat than other parts, the solder is applied to the surface of the lead, and then the part is heated to 1. A method for attaching a component, comprising dropping solder on the component onto a pad of the printed circuit board, and fixing the component to the printed circuit board using the solder on the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3780484A JPS60182796A (en) | 1984-02-29 | 1984-02-29 | Method of mounting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3780484A JPS60182796A (en) | 1984-02-29 | 1984-02-29 | Method of mounting component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60182796A JPS60182796A (en) | 1985-09-18 |
| JPH0217949B2 true JPH0217949B2 (en) | 1990-04-24 |
Family
ID=12507696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3780484A Granted JPS60182796A (en) | 1984-02-29 | 1984-02-29 | Method of mounting component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60182796A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0448266B1 (en) * | 1990-03-23 | 1996-06-05 | Motorola, Inc. | Surface mountable semiconductor device having self loaded solder joints |
| JP3202221B2 (en) * | 1990-11-22 | 2001-08-27 | 日本たばこ産業株式会社 | Cigarette manufacturing method and apparatus |
-
1984
- 1984-02-29 JP JP3780484A patent/JPS60182796A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60182796A (en) | 1985-09-18 |
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