JPH0312993A - Soldering method in electronic circuit package - Google Patents

Soldering method in electronic circuit package

Info

Publication number
JPH0312993A
JPH0312993A JP14671989A JP14671989A JPH0312993A JP H0312993 A JPH0312993 A JP H0312993A JP 14671989 A JP14671989 A JP 14671989A JP 14671989 A JP14671989 A JP 14671989A JP H0312993 A JPH0312993 A JP H0312993A
Authority
JP
Japan
Prior art keywords
substrate
solder
soldering
lead
tmd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14671989A
Other languages
Japanese (ja)
Inventor
Hiroshi Onishi
寛 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14671989A priority Critical patent/JPH0312993A/en
Publication of JPH0312993A publication Critical patent/JPH0312993A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To make it possible to solder components with a single reflow process by fixing a soldering sheet to the tip of lead projected from the opposite side of a substrate and adding to soldering paste spread on a bonding pad in advance by the same amount when TMD is soldered by way of a through hole on said substrate. CONSTITUTION:Solder paste 4 and a bonding agent 2 are applied to a bonding pad 9 on a substrate 1 where a surface mounting device(SMD) 3 is installed. Then, the substrate 1 is reversed so that soldering paste 4' may be applied to a bonding pad 9' where another SMD 3' is installed. Then, lead components(TMD) 5 are installed to the location pre-coated with the soldering paste 4' from the opposite side. A lead 5a is inserted into a through hole 11, and its tip is projected from the substrate 1 so that a soldering sheet 7 is fixed with the tip of the lead 5a. When the soldering sheet is melted under this condition, the respective soldering paste 4 and 4' is melted so that the components 3, 3' and 5 may be fixed on the substrate 1 and the soldering sheet 7 may be melted as well, thereby filling the through hole 11. It is, therefore, possible to solder the components with a single reflow process.

Description

【発明の詳細な説明】 〔概要〕 基板上に設けられたボンディングパッドに端子を直接半
田付けして取付けるいわゆる表面実装部品（ＳＭＤと略
称する）と、基板を貫通するスルーホールに端子リード
を挿通した状態で半田付けを行ういわゆるリード部品（
ＴＭＤと略称する）とが混在して搭載される電子回路パ
ッケージにおける半田付けの方法に関し、 自動化の容易なりフロ一方式のみで、ＳＭＤとＴＭＤの
両者を同じ基板上に実装することのできる半田付は方法
を提供することを目的とし、基板の第１面上に配置され
たボンディングパッド上に半田ペーストを施与し、該第
１面の反対側の第２面」二にＴＭＤを搭載して、そのリ
ードを前記ボンディングパッドに連携するスルーホール
に挿通し、前記第１面側に突出したリードの先端部に半
田板を止着し、これを同じ基板上に半田ペーストを介し
て搭載されたＳＭＤと共に、リフロー方式の半田付けに
よって固定する構成とする。[Detailed Description of the Invention] [Summary] A so-called surface mount device (abbreviated as SMD) in which a terminal is directly soldered to a bonding pad provided on a board, and a terminal lead is inserted into a through hole that penetrates the board. So-called lead parts (
Regarding the soldering method for electronic circuit packages that are equipped with a mixture of SMD and TMD (abbreviated as TMD), we have developed a soldering method that is easy to automate and allows both SMD and TMD to be mounted on the same board using only one flow method. The present invention aims to provide a method for applying solder paste on bonding pads arranged on a first side of a substrate, and mounting a TMD on a second side opposite to the first side. , the lead is inserted into a through hole linked to the bonding pad, a solder plate is fixed to the tip of the lead protruding toward the first surface, and this is mounted on the same board via solder paste. It is configured to be fixed together with the SMD by reflow soldering.

〔産業上の利用分野〕[Industrial application field]

本発明は、基板上に設けられたボンディングパッドに端
子を直接半田例けして取付けるいわゆる表面実装部品（
ＳＭＩ）と略称する）と、基板を貫通するスルーホール
に端子リードを挿通した状態で半田付けを行ういわゆる
リード部品（ＴＭＤと略称する）とが混在して搭載され
る電子回路パッケージにおける半田付けの方法に関する
。The present invention is a so-called surface mount component (surface mount component) in which terminals are directly soldered to bonding pads provided on a substrate.
SMI (abbreviated as SMI)) and so-called lead components (abbreviated as TMD), which are soldered with terminal leads inserted into through-holes that penetrate the board, are installed in an electronic circuit package. Regarding the method.

〔従来の技術〕[Conventional technology]

従来、ＳＭＤとＴＭＤとを同一の基板上に実装して電子
回路パッケージを形成する場合には、第６図と第７図に
示されたような方式が採用されている。Conventionally, when an electronic circuit package is formed by mounting an SMD and a TMD on the same substrate, a method as shown in FIGS. 6 and 7 has been adopted.

先ず、第６図に示す方式は、基板１の片面上に仮止必用
の接着剤２を介してＳＭＤ３を載せ、更にこの基板１を
反転した状態で、上の面に別のＳＭＤ３’　を半田ペー
スト４を介して搭載する。他の面に先に搭載されたＳＭ
Ｄ３は接着剤２によって基板１上に維持される。この状
態で基板１をリフロー用の加熱装置８に導入して所定の
温度で半田ペースト２を溶融させてＳＭＤ３’　の半田
付けを行う。次に、基板１」二にＴＭＤ５を搭載し、そ
の’）　−ト’　５　ａをスルーホールに挿通して位置
決めし、残ったＳＭＤ３と共に溶融状態の半田槽中に導
入してデイツプ半田量」け６を実施して全部の部品の固
定を完了する。First, in the method shown in FIG. 6, an SMD 3 is placed on one side of a substrate 1 via an adhesive 2 for temporary fixing, and then another SMD 3' is soldered to the upper surface while the substrate 1 is inverted. Load via paste 4. SM mounted on other side first
D3 is maintained on the substrate 1 by adhesive 2. In this state, the substrate 1 is introduced into a heating device 8 for reflow, and the solder paste 2 is melted at a predetermined temperature to solder the SMD 3'. Next, the TMD 5 is mounted on the board 1''2, its ``-'' 5a is inserted into the through hole to position it, and the remaining SMD 3 is introduced into the molten solder bath to determine the amount of dip solder. 6 to complete fixing all parts.

第７図に示す方式は、基板１の片面上に半田ペースト４
と接着剤２を施与し、これにＳＭＤ３を載せる。次いで
、基板１を反転し、上の面に新たに半田ペースト４を施
与して、これに別のＳＭＤ３”を搭載する。そして基板
１をリフロー用加熱装置８に導入して両面から加熱して
半田ペースト２を溶融させて、両方のＳＭＤ３．３”の
半田付けを行う。そして最後に、ＴＭＤ５を搭載して、
スルーホールから反対面に突出したリード５ａに対して
人手による半田付けを行ってこれを固定する。この方式
は、部品がデイツプによる熱に耐えられない場合に適し
ている。The method shown in FIG.
Adhesive 2 is applied and SMD 3 is placed on this. Next, the board 1 is turned over, a new solder paste 4 is applied to the upper surface, and another SMD 3'' is mounted on this.The board 1 is then introduced into the reflow heating device 8 and heated from both sides. Melt the solder paste 2 and solder both SMDs 3.3". And finally, with TMD5 installed,
The leads 5a protruding from the through holes to the opposite side are fixed by manual soldering. This method is suitable when the component cannot withstand the heat caused by the dip.

このように、ＴＭＤの半田付けだけは、簡単なりフロ一
方式が適用されず、デイツプ式又は人手による半田付け
が行われているのは、次の理由による。即ち、ＴＭＤの
場合には、基板上に設けら（３） （４） れたボンディングパッドの上だけでなく、基板のスルー
ホール内にも溶融した半田が入り込んでリードを固定す
る必要があるため、消費される半田量がＳＭＤの場合よ
り多くなる。従って、ＳＭＤ用の半田ペーストをボンデ
ィングパッドのパターンに合わせて自動供給する半田ペ
ースト印刷装置では施与量が不足するので、これを採用
することができないからである。The reason why TMD soldering is not simple or flow-type is applied, but dip-type or manual soldering is performed for the following reason. In other words, in the case of TMD, it is necessary for the molten solder to enter not only the bonding pads provided on the board (3) (4) but also into the through holes of the board to fix the leads. , the amount of solder consumed is larger than in the case of SMD. Therefore, a solder paste printing device that automatically supplies solder paste for SMD according to the pattern of the bonding pad cannot be used because the applied amount is insufficient.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

このように、現在行われている電子回路パッケージにお
ける半田付は方式は、リフロー方式とデイツプ方式又は
手半田方式を併用しているので、工数がかかり、製品の
コストアップの大きな要因となっている。又、デイツプ
方式を併用する場合には、耐熱性の低いＳＭＤをデイツ
プする側の基板面に実装することができない。更に、基
板をリフロー用加熱装置内に導入する必要があるので、
後から搭載するＴＭＤ用のスルーホールやボンディング
パッドが酸化して半田付けがうまく行われない欠点もあ
る。As described above, the current soldering method for electronic circuit packages uses a combination of reflow method, dip method, or manual soldering method, which takes a lot of man-hours and is a major factor in increasing product costs. . Furthermore, when the dip method is used in combination, an SMD with low heat resistance cannot be mounted on the substrate surface on the dip side. Furthermore, since it is necessary to introduce the board into the reflow heating equipment,
Another drawback is that the through-holes and bonding pads for the TMD, which will be mounted later, will oxidize, making it difficult to solder them properly.

本発明は、このような従来技術の問題点を解決し、自動
化の容易なりフロ一方式のみで、ＳＭＤとＴＭＤの両者
を同じ基板上に実装することのできる半田付は方法を提
供することを目的とする。The present invention solves the problems of the prior art and provides a soldering method that is easy to automate and can mount both an SMD and a TMD on the same board using only one process. purpose.

〔課題を解決するための手段〕[Means to solve the problem]

この目的は、基板の第１面上に配置されたボンディング
パッド上に半田ペーストを施与し、該第１面の反対側の
第２面上にＴＭＤを搭載して、そのリードを前記ボンデ
ィングパッドに連携するスルーホールに挿通し、前記第
１面側に突出したリードの先端部に半田板を止着し、こ
れを同じ基板上に半田ペーストを介して搭載されたＳＭ
Ｄと共に、リフロー方式の半田付けによって固定するこ
とを特徴とする電子回路パッケージにおける半田付は方
法によって達成される。The purpose of this is to apply solder paste on the bonding pads arranged on the first surface of the substrate, mount the TMD on the second surface opposite to the first surface, and connect the leads to the bonding pads. A solder plate is fixed to the tip of the lead that is inserted into the through hole associated with the first surface and protrudes toward the first surface side, and this is attached to the SM mounted on the same board via solder paste.
In conjunction with D, soldering in an electronic circuit package characterized by fixation by reflow soldering is achieved by a method.

〔作用〕[Effect]

基板のスルーホールに挿通されて反対面に突出（５） （６） したＴＭＤのリードの先端には、半田板が止着されてい
るので、リフロー用の加熱装置に導入された際には、該
半田板が溶融して、予めホンディングパッド上に施与さ
れていた半田ペーストと共にスルーホールの内部に入り
込むと同時に、リードをボンディングパッド上に接合す
る。即ち、半田板によってスルーホールの内部空間に充
填される半田の量が補充され、充分な固定効果が得られ
る。A solder plate is attached to the tip of the TMD lead that is inserted into the through hole of the board and protrudes from the opposite side (5) (6), so when it is introduced into the reflow heating equipment, The solder plate melts and enters the through hole together with the solder paste previously applied on the bonding pad, simultaneously bonding the lead onto the bonding pad. That is, the solder plate replenishes the amount of solder that fills the internal space of the through hole, thereby providing a sufficient fixing effect.

以下、図面に示す好適実施例に基づいて、本発明を更に
詳細に説明する。Hereinafter, the present invention will be explained in more detail based on preferred embodiments shown in the drawings.

〔実施例〕〔Example〕

第１図は、本発明の方法の原理を示す工程図である。 FIG. 1 is a process diagram showing the principle of the method of the present invention.

この半田付は方法によれば、先ず、基板１の片面に配置
されたボンディングパッド９上に半田ペースト４と接着
剤２を施与し、これにＳＭＤ３を載せる。この時に、後
にＴＭＤ５を搭載する個所のスルーホール１１と連携し
たボンディングパッド１０上にも半田ペースト４゛を施
与しておく。According to this soldering method, first, solder paste 4 and adhesive 2 are applied onto bonding pads 9 arranged on one side of substrate 1, and SMD 3 is placed on this. At this time, solder paste 4' is also applied onto the bonding pads 10 that cooperate with the through holes 11 where the TMD 5 will be mounted later.

次いで、基板１を反転し、上になった方の面に配置され
たボンディングパッド９″　に新たに半田ペースト４を
施与して、これに別のＳＭＤ３’　を搭載する。この段
階までは、ＴＭＤ用の半田ペーストの準備を除いて、前
述の第７図に示す従来方式と実質的に同じである。Next, the substrate 1 is turned over, new solder paste 4 is applied to the bonding pads 9'' placed on the upper side, and another SMD 3' is mounted on this.Up to this stage, This method is substantially the same as the conventional method shown in FIG. 7 described above, except for the preparation of solder paste for TMD.

本発明においては、次にＴＭＤ５を予め半田ペースト４
”を施与しである個所に反対面から搭載し、連携するス
ルーホールにそのリード５ａを挿通し、その先端を半田
ペースト４°を貫通して基板】から突出させる。そして
、予め準備しである小片の半田板７をリード５ａの先端
に止着する。In the present invention, next, TMD5 is applied in advance to solder paste 4.
” and mount it on a certain point from the opposite side, insert the lead 5a into the corresponding through hole, and make the tip penetrate the solder paste 4 degrees and protrude from the board. A small piece of solder plate 7 is fixed to the tip of lead 5a.

この状態の各部品の細部を第２図に示す。Details of each part in this state are shown in FIG.

この状態で基板１をリフロー用加熱装置８に導入し、両
面から熱を加えて半田を溶融させると、第３図に示すよ
うに、各半田ペーストは溶融して各部品３．　３’　、
　　５を基板上に固定し、又、半田板７も溶融してスル
ーホール１１の内部に入り込んでこれを充填する。即ち
、−度の熱処理によって、ＳＭＤとＴＭＤの両者を基板
上に半田付けすることかできる。In this state, the board 1 is introduced into the reflow heating device 8 and heat is applied from both sides to melt the solder. As shown in FIG. 3, each solder paste melts and each component 3. 3',
5 is fixed on the substrate, and the solder plate 7 is also melted and enters the through hole 11 to fill it. That is, both the SMD and TMD can be soldered onto the substrate by heat treatment at -degrees.

前記半田板７は、第４図に示すように、ランドと同形状
で、その中央に適宜な形状・寸法のスリット１２を設け
たものであることが望ましい。このスリット１２にリー
ド５ａの先端を突っ込むことによってスリットは押し開
かれ、摩擦接触によってリードの先端から抜は落ちない
ように保持される。因に、第４図（ａ）に図示のスリッ
トは、リードが円形断面の場合、（ｂ）、　　（Ｃ）に
図示のスリットは、リードが角断面の場合に適している
。As shown in FIG. 4, the solder plate 7 preferably has the same shape as the land and has a slit 12 of an appropriate shape and size in the center thereof. By inserting the tip of the lead 5a into the slit 12, the slit is pushed open, and the friction contact holds the lead so that it does not fall out from the tip. Incidentally, the slit shown in FIG. 4(a) is suitable when the lead has a circular cross section, and the slits shown in FIGS. 4(b) and 4(C) are suitable when the lead has a square cross section.

搭載されるＴＭＤが整然と配列された多数のリードを具
えている場合には、第５図に示すように、半田板７をリ
ード５ａの配列に対応して連続した形状のものとし、こ
れを切り離すことなく、各リードの先端に適用すれば、
作業性を向上させることが可能である。この場合、連結
部７ａの半田は、溶融時に半田の表面張力によってどち
らか一方の側に引きつけられ、短絡することはない。又
、半田板の厚さを調整することにより、供給する半田量
を制御可能である。If the TMD to be mounted has a large number of leads arranged in an orderly manner, the solder plate 7 is made into a continuous shape corresponding to the arrangement of the leads 5a, as shown in FIG. If you apply it to the tip of each lead without
It is possible to improve workability. In this case, the solder in the connecting portion 7a is attracted to either side by the surface tension of the solder when melted, and no short circuit occurs. Furthermore, by adjusting the thickness of the solder plate, the amount of solder supplied can be controlled.

〔発明の効果〕〔Effect of the invention〕

以上詳述したように、本発明によれば、リードを有する
ＴＭＤを基板上のスルーホールを介して半田付けする際
に、基板の反対面から突出したリードの先端に半田板を
止着し、予めボンディングパッド上に他のＳＭＤの場合
と同じ量だけ施与された半田ペーストに対して伺加する
ようにしたので、従来はスルーホール内部に侵入してパ
ッドに対しては不足し勝ちであった半田量が充分となっ
た。これにより、−回のりフロー工程のみで、部品の半
田付けが可能となった。As detailed above, according to the present invention, when a TMD having leads is soldered through a through hole on a substrate, a solder plate is fixed to the tip of the lead protruding from the opposite side of the substrate, Since we added the same amount of solder paste to the bonding pads in advance as in the case of other SMDs, conventionally the solder paste would penetrate inside the through-holes and tend to be insufficient for the pads. The amount of solder was sufficient. This has made it possible to solder parts using only the -turn flow process.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明方法の原理を示す工程図、第２図は、
本発明による準備を経た熱処理前の各部品の細部を示す
基板の断面図、 第３図は、同じく熱処理後の各部品の細部を示す基板の
断面図、 第４図（ａ）〜（Ｃ）は、本発明に使用される（９） （１０） 半田板の形状を示す平面図と裏面図、 第５図（ａ）、　　（ｂ）は、他の形態の半田板を使用
して半田付けの準備されたＴＭＤの断面図、第６図並び
に第７図は、従来の半田付けの原理を示す工程図である
。 １・・・基板、 ２・・・接着剤、 ３．３′・・・ＳＭＤ。 ４・・・半田ペースト、 ５・・・ＴＭＤ。 ７・・・半田板、 ８・・・リフロー加熱装置、 ９．９’、１０・・・ボンディングパッド、１１・・・
スルーホール。 （１１） 特開平 ３ １２９９３　（５） ｊ 従来の半田付は原理を示す工程囚（２）第７図FIG. 1 is a process diagram showing the principle of the method of the present invention, and FIG.
FIG. 3 is a cross-sectional view of the substrate showing details of each component before heat treatment after preparation according to the present invention; FIG. 3 is a cross-sectional view of the substrate showing details of each component after heat treatment; FIGS. 4(a) to (C) (9) (10) Top view and back view showing the shape of the solder plate used in the present invention, Figures 5 (a) and (b) show soldering using other forms of solder plate 6 and 7 are process diagrams showing the principle of conventional soldering. 1...Substrate, 2...Adhesive, 3.3'...SMD. 4...Solder paste, 5...TMD. 7... Soldering plate, 8... Reflow heating device, 9.9', 10... Bonding pad, 11...
Through hole. (11) JP-A-3-12993 (5) j Process diagram showing the principle of conventional soldering (2) Figure 7

Claims (1)

【特許請求の範囲】[Claims] １．　基板（１）の第１面上に配置されたボンディング
パッド（１０）上に半田ペースト（４）を施与し、該第
１面の反対側の第２面上にＴＭＤ（５）を搭載して、そ
のリード（５ａ）を前記ボンディングパッド（１０）に
連携するスルーホール（１１）に挿通し、前記第１面側
に突出したリード（５ａ）の先端部に半田板（７）を止
着し、これを同じ基板（１）上に半田ペースト（４）を
介して搭載されたＳＭＤ（３、３’）と共に、リフロー
方式の半田付けによって固定することを特徴とする電子
回路パッケージにおける半田付け方法。1. Solder paste (4) is applied on the bonding pad (10) arranged on the first surface of the substrate (1), and the TMD (5) is mounted on the second surface opposite to the first surface. Then, insert the lead (5a) into the through hole (11) linked to the bonding pad (10), and fix the solder plate (7) to the tip of the lead (5a) protruding toward the first surface. Soldering in an electronic circuit package characterized in that this is fixed by reflow soldering together with the SMD (3, 3') mounted on the same board (1) via solder paste (4). Method.
JP14671989A 1989-06-12 1989-06-12 Soldering method in electronic circuit package Pending JPH0312993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14671989A JPH0312993A (en) 1989-06-12 1989-06-12 Soldering method in electronic circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14671989A JPH0312993A (en) 1989-06-12 1989-06-12 Soldering method in electronic circuit package

Publications (1)

Publication Number Publication Date
JPH0312993A true JPH0312993A (en) 1991-01-21

Family

ID=15414002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14671989A Pending JPH0312993A (en) 1989-06-12 1989-06-12 Soldering method in electronic circuit package

Country Status (1)

Country Link
JP (1) JPH0312993A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
US5737834A (en) * 1994-09-20 1998-04-14 Blaupunkt-Werke Gmbh Process and apparatus for automatically assembling the tops and bottoms of circuitboards with SMDS
FR2876540A1 (en) * 2004-10-08 2006-04-14 Johnson Controls Tech Co METHOD OF WELDING A COMPONENT CROSSING ON A PRINTED CIRCUIT BOARD AND WELDING RELAY ACCORDING TO THE METHOD
CN102615952A (en) * 2012-04-10 2012-08-01 中国科学院光电技术研究所 Temperature controllable SMT (surface mounting technology) soldering paste printing double-layer mold plate
WO2013121882A1 (en) * 2012-02-17 2013-08-22 Canon Kabushiki Kaisha Circuit board for mounting electronic components

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155904A (en) * 1991-04-03 1992-10-20 Compaq Computer Corporation Reflow and wave soldering techniques for bottom side components
US5737834A (en) * 1994-09-20 1998-04-14 Blaupunkt-Werke Gmbh Process and apparatus for automatically assembling the tops and bottoms of circuitboards with SMDS
FR2876540A1 (en) * 2004-10-08 2006-04-14 Johnson Controls Tech Co METHOD OF WELDING A COMPONENT CROSSING ON A PRINTED CIRCUIT BOARD AND WELDING RELAY ACCORDING TO THE METHOD
EP1646272A3 (en) * 2004-10-08 2008-03-05 Johnson Controls Technology Company Process for soldering a lead-in-hole component on a circuit board and relais to be soldered according to the process
WO2013121882A1 (en) * 2012-02-17 2013-08-22 Canon Kabushiki Kaisha Circuit board for mounting electronic components
US9414488B2 (en) 2012-02-17 2016-08-09 Canon Kabushiki Kaisha Circuit board for mounting electronic components
CN102615952A (en) * 2012-04-10 2012-08-01 中国科学院光电技术研究所 Temperature controllable SMT (surface mounting technology) soldering paste printing double-layer mold plate

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