JPH01321681A - Double-side mounting substrate - Google Patents

Double-side mounting substrate

Info

Publication number
JPH01321681A
JPH01321681A JP15611888A JP15611888A JPH01321681A JP H01321681 A JPH01321681 A JP H01321681A JP 15611888 A JP15611888 A JP 15611888A JP 15611888 A JP15611888 A JP 15611888A JP H01321681 A JPH01321681 A JP H01321681A
Authority
JP
Japan
Prior art keywords
double
holes
packages
mounting board
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15611888A
Other languages
Japanese (ja)
Inventor
Mutsuo Tsuji
睦夫 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15611888A priority Critical patent/JPH01321681A/en
Publication of JPH01321681A publication Critical patent/JPH01321681A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To mount parts such as a package on both surfaces without generating positional displacement by forming through-holes not penetrated to a double-side mounting substrate on both surfaces. CONSTITUTION:A double-side mounting substrate 1 has through-holes 2 not penetrated on both surfaces thereof. Packages 4 to which ICs3 are mounted are positioned onto one surface of the double-side mounting substrate 1 by inserting leads 5 into the through-holes 2 first, soldered by solder 6, and packaged only by the required number, and the substrate 1 is turned over, and a required number of the packages 4 are mounted similarly. Even when solder 6 fixing the packages 4 packaged first is melted when the packages 4 are mounted onto an opposite surface, the packages 4 do not drop by the surface tension of solder 6 because the leads 5 are inserted into the through-holes 2. Since the leads 5 are positioned by the through-holes 2, no positional displacement is generated, and the through-holes 2 are not penetrated, thus no preventing the mounting of the packages 4 onto the opposite surface.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子装置等に使用されるＩＣを実装するため
に用いられる両面実装基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a double-sided mounting board used for mounting ICs used in electronic devices and the like.

〔従来の技術〕[Conventional technology]

従来、この種の両面実装基板はパッケージ等を表面実装
するようになっており、スルーホールはおいていなかっ
た。あるいは、両面実装基板にスルーホールが貫通して
おりパッケージ等を片面実装しかできなかった。Conventionally, this type of double-sided mounting board had a package etc. mounted on the surface and did not have through holes. Alternatively, a double-sided mounting board has through-holes passing through it, making it possible to mount packages and the like only on one side.

第２図は従来の両面実装基板１′の縦断面図であり、Ｉ
Ｃ３を搭載したパッケージ４のリード５を半田６により
固定している。第３図は従来の片面実装基板７の縦断面
図であり、片面実装基板７のスルーホール２にリード５
を挿入し、さらに半田６でリード５を両面実装基板７に
固定している。FIG. 2 is a vertical cross-sectional view of a conventional double-sided mounting board 1', and
Leads 5 of a package 4 on which C3 is mounted are fixed with solder 6. FIG. 3 is a vertical cross-sectional view of a conventional single-sided mounting board 7, in which leads 5 are inserted into through holes 2 of the single-sided mounting board 7.
is inserted, and the leads 5 are further fixed to the double-sided mounting board 7 with solder 6.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述しぬ従来の両面実装基板は表面実装であるため、半
田付は時にパッケージ４等の位置ズレの可能性が高く、
また、スルーホールの貫通した基板では片面実装しかで
きないため、実装密度が落ちるという欠点がある。Since conventional double-sided mounting boards (not mentioned above) are surface mounted, there is a high possibility that the package 4 etc. may be misaligned during soldering.
Furthermore, since a board with through holes can only be mounted on one side, there is a drawback that the mounting density is reduced.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の両面実装基板は、貫通していないスルーホール
が両面に設けられ、この貫通していないスルーホールに
リードを挿入して部品が実装されることを特徴とする。The double-sided mounting board of the present invention is characterized in that non-penetrating through holes are provided on both sides, and components are mounted by inserting leads into the non-penetrating through holes.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.

両面実装基板１は貫通していないスルーホール２を両面
に有している。ＩＣ３を実装したパッケージ４はまず両
面実装基板１の片面に、リード５をスルーホール２に挿
入して位置決めされ、半田６により半田付けされ、必要
数だけ両面実装基板１に実装される。次に、両面実装基
板１を裏返し、反対面に同様にしてパッケージ４が必要
数実装される。The double-sided mounting board 1 has through holes 2 on both sides that do not penetrate through the board. The package 4 with the IC 3 mounted thereon is first positioned on one side of the double-sided mounting board 1 by inserting the lead 5 into the through hole 2, soldering with solder 6, and mounting the required number on the double-sided mounting board 1. Next, the double-sided mounting board 1 is turned over, and the required number of packages 4 are mounted on the opposite side in the same manner.

反対面にパッケージ４を実装する時に最初に実装したパ
ッケージ４を固定している半田６が溶けても、リード５
がスルーホール２にはいっているため、また半田６を表
面張力により、パッケージ４が両面実装基板１から落下
することはない。また、リード５がスルーホール２によ
り位置決めされているため、位置ズレを起こすこともな
い。また、スルーホール２が貫通していないため、反対
面にパッケージ４を実装するのをさまたげない。When mounting the package 4 on the opposite side, even if the solder 6 that fixes the first mounted package 4 melts, the leads 5
Since the solder 6 is inserted into the through hole 2 and the solder 6 has surface tension, the package 4 will not fall from the double-sided mounting board 1. Furthermore, since the leads 5 are positioned by the through holes 2, they will not be misaligned. Further, since the through hole 2 does not pass through, mounting the package 4 on the opposite surface is not hindered.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、両面実装基板に貫通して
いないスルーホールを両面に設けることにより、位置ズ
レを起こすことなくパッケージ等の部品を両面に実装す
ることがでいる。As explained above, according to the present invention, components such as packages can be mounted on both sides of a double-sided mounting board without causing positional displacement by providing through holes that do not penetrate the double-sided mounting board on both sides.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の両面実装基板の縦断面図で
あり、第２図は従来の両面実装基板の縦断面図、第３図
は従来の片面実装基板の縦断面図である。 １．１′・・・両面実装基板、２・・・スルーホール、
３・・・ＩＣ１４・・・パッケージ、５・・・リード、
６・・・半田、７・・・片面実装基板。FIG. 1 is a vertical cross-sectional view of a double-sided mounting board according to an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a conventional double-sided mounting board, and FIG. 3 is a vertical cross-sectional view of a conventional single-sided mounting board. . 1.1'...Double-sided mounting board, 2...Through hole,
3...IC14...Package, 5...Lead,
6...Solder, 7...Single-sided mounting board.

Claims (1)

【特許請求の範囲】[Claims] 貫通していないスルーホールが両面に設けられ、この貫
通していないスルーホールにリードを挿入して部品が実
装されることを特徴とする両面実装基板。A double-sided mounting board characterized in that non-penetrating through holes are provided on both sides, and components are mounted by inserting leads into the non-penetrating through holes.
JP15611888A 1988-06-23 1988-06-23 Double-side mounting substrate Pending JPH01321681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15611888A JPH01321681A (en) 1988-06-23 1988-06-23 Double-side mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15611888A JPH01321681A (en) 1988-06-23 1988-06-23 Double-side mounting substrate

Publications (1)

Publication Number Publication Date
JPH01321681A true JPH01321681A (en) 1989-12-27

Family

ID=15620713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15611888A Pending JPH01321681A (en) 1988-06-23 1988-06-23 Double-side mounting substrate

Country Status (1)

Country Link
JP (1) JPH01321681A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199530A (en) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp Burn-in board
JPH05347466A (en) * 1992-06-15 1993-12-27 Nec Corp Printed circuit board
JPH0878809A (en) * 1994-09-07 1996-03-22 Melco:Kk Printed board and electronic device using thereof
EP1083778A1 (en) * 1999-09-07 2001-03-14 Endress + Hauser GmbH + Co. Process for mounting components on a printed circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217692A (en) * 1984-04-13 1985-10-31 日立マイクロコンピユ−タエンジニアリング株式会社 Circuit substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217692A (en) * 1984-04-13 1985-10-31 日立マイクロコンピユ−タエンジニアリング株式会社 Circuit substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199530A (en) * 1990-11-28 1992-07-20 Mitsubishi Electric Corp Burn-in board
JPH05347466A (en) * 1992-06-15 1993-12-27 Nec Corp Printed circuit board
JPH0878809A (en) * 1994-09-07 1996-03-22 Melco:Kk Printed board and electronic device using thereof
EP1083778A1 (en) * 1999-09-07 2001-03-14 Endress + Hauser GmbH + Co. Process for mounting components on a printed circuit board

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