JPH04199530A - Burn-in board - Google Patents

Burn-in board

Info

Publication number
JPH04199530A
JPH04199530A JP33537390A JP33537390A JPH04199530A JP H04199530 A JPH04199530 A JP H04199530A JP 33537390 A JP33537390 A JP 33537390A JP 33537390 A JP33537390 A JP 33537390A JP H04199530 A JPH04199530 A JP H04199530A
Authority
JP
Japan
Prior art keywords
burn
board
sockets
socket
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33537390A
Other languages
Japanese (ja)
Inventor
Iwao Sakai
巌 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP33537390A priority Critical patent/JPH04199530A/en
Publication of JPH04199530A publication Critical patent/JPH04199530A/en
Pending legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To increase the mounting density of sockets per burn-in board and to reduce the unit price of a burn-in board per socket by mounting IC socket on both sides of the burn-in board. CONSTITUTION:Signals generated by a burn-in device are transmitted through a connector 7 to sockets 5 mounted on both sides of a double-sided burn-in board 1, the signals are given to ICs inserted into the sockets 5, and burn-in is done. Namely, the IC sockets 5 are mounted on both sides of the burn-in board 1, and besides pole braces 2 are provided to protect the sockets 5 at time of inserting or extracting the ICs. Owing to this, the number of sockets mounted per burn-in board can be increased, and the price of the burn-in board 1 per socket can be made cheaper.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ＩＣをバーンインするバーンインポートに
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to burn import for burning in ICs.

〔従来の技術〕[Conventional technology]

第２図（ａ）、（ｂ）、（ｃ）は従来のバーンインボー
ドを示す図であり、同図（ａ）は平面図、同図（ｂ）は
ｎ−ｎ線断面図、同図（Ｃ）は側面図である。FIGS. 2(a), 2(b), and 2(c) are views showing a conventional burn-in board, in which FIG. 2(a) is a plan view, FIG. 2(b) is a sectional view taken along line nn, C) is a side view.

図において、（４）はバーンインボード、（５）はこの
バーンインボード（４）に搭載されたＩＣソケット、（
６）はバーンイン装置からの信号を伝達するためのコネ
クタである。In the figure, (4) is a burn-in board, (5) is an IC socket mounted on this burn-in board (4), (
6) is a connector for transmitting signals from the burn-in device.

次に動作について説明する。バーンインボード装置より
発生された信号は、コネクタ（６）を介してバーンイン
ポート（４）上のソケッ）−（５）まで伝達され、上記
ソケット（５）に挿入さｉたＩＣに信号が与えられて、
バーンインが行われる。Next, the operation will be explained. The signal generated by the burn-in board device is transmitted to the socket (5) on the burn import (4) via the connector (6), and the signal is given to the IC inserted into the socket (5). hand,
Burn-in takes place.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のバーンインボードは以上のように構成されている
ので、１枚のバーンインボードにてバーンインすること
のできるＩＣの数は表面に搭載できるソケットの数に限
られているなどの問題点かあった。Conventional burn-in boards are configured as described above, but there are problems such as the number of ICs that can be burned in on one burn-in board is limited to the number of sockets that can be mounted on the surface. .

この発明は以上のような問題点を解消するためになされ
たものて、バーンインボード１枚あたりのＩＣの搭載数
を増すことかできるとともに、バーンインポートのソケ
ット１個あたりの価格を安くすることかてきるバーンイ
ンボードを得ることを目的とする。This invention was made to solve the above-mentioned problems, and it is possible to increase the number of ICs mounted on one burn-in board, and to reduce the price per burn-in socket. The aim is to obtain a burn-in board that can be used.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るバーンインボードは、■Ｃソゲットをバ
ーンインボードの両面に搭載するとともに、ＩＣの挿入
・抜き取り時にソケットを保護する為の支柱を設けたも
のである。The burn-in board according to the present invention has ■C sogets mounted on both sides of the burn-in board, and is provided with a support for protecting the socket when inserting or removing an IC.

（作用） この発明におけるバーンインポートは、ＩＣソケットを
バーンインボードの両面に搭載することにより、バーン
インボード１枚あたりのソケットの実装密度を上げソケ
ット当りのバーンインボード単価を下げバーンイン工程
におけるテストコストを下げる。(Function) The burn import in this invention increases the mounting density of sockets per burn-in board by mounting IC sockets on both sides of the burn-in board, lowers the burn-in board unit price per socket, and lowers the test cost in the burn-in process. .

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第１
図において、（１）はソケット両面搭載型バーンインポ
ート、（２）はソケットを保護する為の支柱、（３）は
上下のソケットに信号を伝達するパターン配線である。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is a burn import with sockets mounted on both sides, (2) is a support to protect the socket, and (3) is a pattern wiring that transmits signals to the upper and lower sockets.

バーンイン装置より発生された信号はコネクタ（７）を
介してソケット両面搭載型バーンインボード（１）トの
両面に搭載されたソケット（５）まで伝達され、上記ソ
ケット（５）に挿入されたＩＣに信号か与えられてバー
ンインか行われる。The signal generated by the burn-in device is transmitted via the connector (7) to the socket (5) mounted on both sides of the socket double-sided burn-in board (1), and is transmitted to the IC inserted in the socket (5). A signal is given and burn-in is performed.

この時、バーンインボード（１）の上面に搭載するソケ
ット（５）と下面に搭載するソケット（５）は、ソケッ
トの幅の半分たけ互いにずらした位置に搭載し、このこ
とにより上下のソケットに同一信号を配線バタン（３）
で伝達することを可能としている。At this time, the socket (5) mounted on the top surface of the burn-in board (1) and the socket (5) mounted on the bottom surface are mounted at positions shifted from each other by half the width of the socket, so that the upper and lower sockets are the same. Wire the signal (3)
It makes it possible to communicate with

（発明の効果〕 以上のように、この発明によれば、ＩＣソケットをバー
ンインボードの両面に搭載する。ように構成したので、
バーンインボード１枚あたりのソケットの搭載数を増や
し、バーンインポートのソケット当りの価格を安価にす
ることができる効果かある。(Effects of the Invention) As described above, according to the present invention, IC sockets are mounted on both sides of the burn-in board.
This has the effect of increasing the number of sockets mounted on each burn-in board and lowering the price per burn-in socket.

ゲット両面実装型バーンインボードを示す図であり、同
図（ａ）は平面図、同図（ｂ）はＩ−Ｉ線断面図、同図
（Ｃ）は側面図である。第２図（ａ）〜（Ｃ）は従来の
バーンインボードを示す図であり、同図（ａ）は平面図
、同図（ｂ）は■−ｎ線断面図、同図（Ｃ）は側面図で
ある。1 is a diagram showing a get double-sided mounting type burn-in board, in which (a) is a plan view, (b) is a sectional view taken along the line I-I, and (c) is a side view. Figures 2 (a) to (C) are views showing a conventional burn-in board, where (a) is a plan view, (b) is a sectional view taken along the line ■-n, and (C) is a side view. It is a diagram.

図において、（１）はソケット両面実装型バーンインボ
ード、（２）は支柱、（３）は配線パターン、（４）は
バーンインポート、（５）はＩＣソケット、（６）はコ
ネクタである。In the figure, (1) is a socket double-sided mounting type burn-in board, (2) is a support, (3) is a wiring pattern, (4) is a burn import, (5) is an IC socket, and (6) is a connector.

なお、図中、同一符号は同一、又は相当部分を示す。In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] ＩＣをバーンインするバーンインボードにおいて、ボー
ドの両面にＩＣソケットを搭載したことを特徴とするバ
ーンインボード。A burn-in board for burning in ICs, which is characterized by having IC sockets mounted on both sides of the board.
JP33537390A 1990-11-28 1990-11-28 Burn-in board Pending JPH04199530A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33537390A JPH04199530A (en) 1990-11-28 1990-11-28 Burn-in board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33537390A JPH04199530A (en) 1990-11-28 1990-11-28 Burn-in board

Publications (1)

Publication Number Publication Date
JPH04199530A true JPH04199530A (en) 1992-07-20

Family

ID=18287815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33537390A Pending JPH04199530A (en) 1990-11-28 1990-11-28 Burn-in board

Country Status (1)

Country Link
JP (1) JPH04199530A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112379191A (en) * 2020-10-13 2021-02-19 航天科工防御技术研究试验中心 Burn-in test device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317474B2 (en) * 1985-02-28 1988-04-13 Tokyo Juki Industrial Co Ltd
JPS63293480A (en) * 1987-05-27 1988-11-30 Hitachi Ltd Burn-in test device
JPS647785B2 (en) * 1982-07-28 1989-02-10 Aloka
JPH01321681A (en) * 1988-06-23 1989-12-27 Nec Corp Double-side mounting substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647785B2 (en) * 1982-07-28 1989-02-10 Aloka
JPS6317474B2 (en) * 1985-02-28 1988-04-13 Tokyo Juki Industrial Co Ltd
JPS63293480A (en) * 1987-05-27 1988-11-30 Hitachi Ltd Burn-in test device
JPH01321681A (en) * 1988-06-23 1989-12-27 Nec Corp Double-side mounting substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112379191A (en) * 2020-10-13 2021-02-19 航天科工防御技术研究试验中心 Burn-in test device

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