CN112379191A - Burn-in test device - Google Patents
Burn-in test device Download PDFInfo
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- CN112379191A CN112379191A CN202011091019.3A CN202011091019A CN112379191A CN 112379191 A CN112379191 A CN 112379191A CN 202011091019 A CN202011091019 A CN 202011091019A CN 112379191 A CN112379191 A CN 112379191A
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- circuit board
- printed circuit
- socket
- burn
- aging
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- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 230000032683 aging Effects 0.000 claims abstract description 54
- 230000008054 signal transmission Effects 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
One or more embodiments of the present description provide a burn-in test apparatus, the apparatus comprising: a printed circuit board comprising first and second opposing surfaces; the first surface is provided with a first socket, and the second surface is provided with a second socket; the printed circuit board is also provided with a golden finger which can be inserted into an external aging box; based on the same inventive concept, one or more embodiments provided in the present specification further include: the circuit board comprises a first printed circuit board and a second printed circuit board, wherein the first printed circuit board and the second printed circuit board are arranged in an overlapped mode; a first socket is arranged on the surface of one side, away from the second printed circuit board, of the first printed circuit board; a second socket is arranged on the surface of one side, away from the first printed circuit board, of the second printed circuit board; one of the first printed circuit board and the second printed circuit board is further provided with a golden finger which can be inserted into an external aging box.
Description
Technical Field
One or more embodiments of this description relate to components and parts reliability technical field, especially relate to a burn-in test device.
Background
The dynamic burn-in test is a mode consistently adopted for quality control, and is used for screening the service life and reliability of a device by applying various stresses to the device within a specified time and simulating most failure modes which may occur in the operation of the device.
The mainstream mode of the dynamic burn-in at present is to plug a burn-in board inserted with a component to be tested into a corresponding slot of a burn-in box providing environmental stress conditions required by a test through a gold finger for electric signal transmission, and to control the characteristics of signal frequency, amplitude and the like in the burn-in board through a software program according to the requirements of the component.
The dynamic aging experiment has the characteristics of long test period and large occupied resource, and is designed for the existing aging board as shown in figure 1, wherein each device socket can only be used as one aging station; limited by the aging station on the aging plate, the aging experiment has the condition that busy hour resources are insufficient to influence the task period for a long time. Although the purchasing equipment can meet the task requirements in a short period, the problems of large occupied space, low input-output ratio, insufficient equipment utilization rate and the like are brought.
Disclosure of Invention
In view of the above, an object of one or more embodiments of the present disclosure is to provide a burn-in test apparatus, so as to solve the problem that a burn-in station of a burn-in device is insufficient in resources during busy hours, and the device consumes space and budget.
In view of the above, one or more embodiments of the present disclosure provide a burn-in test apparatus including: a printed circuit board comprising first and second opposing surfaces; the first surface is provided with a first socket, and the second surface is provided with a second socket; the printed circuit board is also provided with a golden finger which can be plugged into an external aging box.
Based on the same inventive concept, one or more embodiments of the present specification further provide a burn-in test apparatus, including: the circuit board comprises a first printed circuit board and a second printed circuit board, wherein the first printed circuit board and the second printed circuit board are arranged in an overlapped mode; a first socket is arranged on the surface of one side, away from the second printed circuit board, of the first printed circuit board; a second socket is arranged on the surface of one side, away from the first printed circuit board, of the second printed circuit board; one of the first printed circuit board and the second printed circuit board is further provided with a golden finger which can be inserted into an external aging box.
The aging test device provided by one or more embodiments of the specification comprehensively considers technical equipment, heat dissipation, power and manufacturing cost to expand an aging station of an aging test, so that the expanded aging station is balanced in resource utilization, manufacturing cost and efficiency, the efficiency of the original dynamic aging test is improved on the basis of not increasing aging equipment, the stability of an aging board is remarkably improved, and the functional feasibility of the double-sided aging board is verified.
Drawings
In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, the drawings that are needed in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only one or more embodiments of the present specification, and that other drawings may be obtained by those skilled in the art without inventive effort from these drawings.
FIG. 1 is a schematic side view of a conventional mainstream refining plate;
FIG. 2 is a schematic side view of a single PCB implementation of a dual sided burn-in board configuration in one or more embodiments of the present disclosure;
FIG. 3 is a schematic side view of a two-sided burn-in board configuration implemented with two PCBs in one or more embodiments of the present disclosure;
Detailed Description
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
It is to be noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present specification should have the ordinary meaning as understood by those of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in one or more embodiments of the specification is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
As described in the background section, it is difficult for the existing dynamic burn-in experimental schemes to meet the capacity requirements of the experimental task. In the process of implementing the present disclosure, the applicant finds that the existing dynamic aging experiment capacity is limited for a long time in the following problems: the dynamic aging experiment period is long, the occupied resources are large, and the phenomenon that the number of aging stations is insufficient is obviously displayed in busy hours. Referring to fig. 1, the conventional burn-in board design is adopted, wherein each device socket can only be used as a burn-in station, the design of the positions and the number of the burn-in board sockets can be seen, the number of the burn-in stations is directly influenced, and the design of the up-down symmetrical structure of even layers is adopted due to the circuit structure design of the conventional mainstream PCB, for example, 2 layers, 4 layers, 6 layers, 8 layers and the like, so that the burn-in board design of the single-layer socket only uses one surface of the symmetrical circuit structure of the PCB, and the rest of the circuit resources of the PCB is formed on the other surface of the symmetrical circuit structure to a certain extent.
In view of the above, one or more embodiments of the present disclosure provide a device for implementing a double-sided burn-in board, which employs double-sided expansion of sockets on the burn-in board to multiply the burn-in stations, and specifically, as shown in fig. 2 and 3, the device sockets on the single-sided burn-in board in fig. 1 are expanded to be symmetrically distributed along the horizontal line in fig. 2 and 3. Furthermore, fastening pieces, such as screws and nuts, welding, positioning pins and the like, are used for fastening the socket on the PCB; and the connecting piece is used, which can be in the forms of a lead, a contact pin, a spring pin and the like, to connect the socket and the PCB so as to complete the signal transmission between the PCB and the golden finger. And furthermore, a golden finger is configured at one end of the PCB and used as a corresponding slot which is inserted into the aging box, so that the signal characteristics in the double-sided aging board can be controlled and monitored.
In practical verification, the device for implementing the double-sided aging board provided by one or more embodiments of the present disclosure comprehensively considers process equipment, heat dissipation, power and manufacturing cost to expand the aging station of the aging experiment, so that the expanded aging station is balanced in resource utilization, manufacturing cost and efficiency, and for different implementation schemes, on the basis of not increasing aging equipment, the efficiency of the original dynamic aging experiment is improved by 80% to 120%, and the reliability of the aging board is also improved.
Hereinafter, an implementation apparatus of one or more embodiments of the present specification will be described in detail by specific embodiments.
Referring to fig. 2, a burn-in test apparatus according to an embodiment of the present disclosure includes: a printed circuit board comprising first and second opposing surfaces; the first surface is provided with a first socket, and the second surface is provided with a second socket; the printed circuit board is also provided with a golden finger which can be plugged into an external aging box.
In the technical solution of this embodiment, the original single-sided aging board provided with 150 aging sockets in fig. 1 is extended to the double-sided aging board device provided with 300 device sockets as shown in fig. 2; the types and shapes of the first socket and the second socket are not specifically limited in this embodiment, and may be universal device sockets or customized device sockets, and different types of device sockets may be selected according to specific implementation requirements.
The first socket and the second socket are relatively fixed on the printed circuit board through fastening screws penetrating through the first socket and the second socket, so that the first socket and the second socket are symmetrically distributed around the printed circuit board.
The first socket and the first surface are connected with each other, the second socket and the second surface are connected with each other, spring pins for signal transmission are respectively arranged on the connecting surfaces of the first socket and the first surface and the second socket and the second surface, and the spring pins are abutted to circuits in the printed circuit board.
One or more embodiments of the present disclosure are directed to the reliability of operation of a double-sided aging board at high temperatures of 85 degrees. A more stable and feasible fastening and connection is preferred: the traditional mode of fastening a common screw nut and welding a contact pin to connect signals is changed into a mode of positioning and fastening a lock and a positioning pin together by the screw nut and abutting a spring pin to connect the signals. The screw nut pair lock is used as a fastening screw, the first socket and the second socket in pair are symmetrically fastened and penetrate through the PCB, and the PCB is fastened between the sockets in pair. In the signal connection mode, the embodiment uses pogo pins, one end of each pogo pin is fixed on the socket, and the other end of each pogo pin is abutted to the circuit on the surface of the PCB in a manner of spring pressure abutment, wherein each set of paired device sockets is provided with 4 pogo pins, each socket in one set is respectively provided with two pogo pins for signal transmission, and the unreliability of the welding point of the pogo pin manner under the condition of high temperature of 85 degrees is avoided due to the signal connection mode of the pogo pins.
The golden finger is fixed at one end of the printed circuit board and used for transmitting signals to the aging box.
Golden finger one end with control signal transmission extremely two-sided ageing board, wherein include: signal characteristics such as voltage, amplitude, frequency, signal return detection time, aging time, frequency, temperature and the like; and the temperature information in the monitoring aging board and the return detection signals of various characteristics are collected through the same path.
Therefore, the technical scheme of the embodiment realizes 100% increase of the aging station. However, the percentage increase of the burn-in station is not specifically limited herein since different sizes of custom receptacles may result from different specific requirements.
Based on the same inventive concept, one or more embodiments of the present specification further provide a burn-in test apparatus.
Referring to fig. 3, the aging test apparatus includes: the circuit board comprises a first printed circuit board and a second printed circuit board, wherein the first printed circuit board and the second printed circuit board are arranged in an overlapped mode; a first socket is arranged on the surface of one side, away from the second printed circuit board, of the first printed circuit board; a second socket is arranged on the surface of one side, away from the first printed circuit board, of the second printed circuit board; one of the first printed circuit board and the second printed circuit board is further provided with a golden finger which can be inserted into an external aging box.
In the technical solution of this embodiment, the original single-sided aging board provided with 150 aging sockets in fig. 1 is expanded to the double-sided aging board device provided with 300 device sockets as shown in fig. 3; the types and shapes of the first socket and the second socket are not particularly limited, and the first socket and the second socket may be universal device sockets or customized device sockets, and different types of device sockets may be selected according to specific implementation requirements.
The first socket and the second socket are symmetrically distributed about a central line between the first printed circuit board and the second printed circuit board.
Referring to fig. 3, the first socket is fixed to the first surface of the first printed circuit board by a fastening screw; the second socket is fixed on the second surface of the second printed circuit board by fastening screws.
The first socket and the first surface of the interface, and the second socket and the second surface of the interface, respectively provided with the signal transmission connecting piece, the connecting piece includes: a wire, a pin, and a pogo pin; the connecting piece is connected with the circuits on the first surface and the second surface.
The first printed circuit board and the second printed circuit board are provided with fastening screws penetrating through the first printed circuit board and the second printed circuit board; and a conducting wire for transmitting signals is arranged between the first printed circuit board and the second circuit board and connected with each other.
In view of the reliability of the double-sided aging board working at a high temperature of 85 ℃, one or more embodiments of the present disclosure preferably provide a more stable and feasible socket fastening and connecting manner: the traditional mode of fastening a common screw nut and welding a contact pin to connect signals is changed into a mode of positioning and fastening a lock and a positioning pin together by the screw nut and abutting a spring pin to connect the signals. The screw nut pair lock is used as a fastening screw, the first socket and the second socket in pair are symmetrically fastened and penetrate through the PCB, and the PCB is fastened between the sockets in pair. In the signal connection mode, the embodiment uses pogo pins, one end of each pogo pin is fixed on the socket, and the other end of each pogo pin is abutted to the circuit on the surface of the PCB in a manner of spring pressure abutment, wherein each set of paired device sockets is provided with 4 pogo pins, each socket in one set is respectively provided with two pogo pins for signal transmission, and the unreliability of the welding point of the pogo pin manner under the condition of high temperature of 85 degrees is avoided due to the signal connection mode of the pogo pins.
The golden finger is fixed at one end of at least one of the first printed circuit board and the second printed circuit board and used for transmitting signals to the aging box.
Golden finger one end with control signal transmission extremely two-sided ageing board, wherein include: signal characteristics such as voltage, amplitude, frequency, signal return detection time, aging time, frequency, temperature and the like; and the temperature information in the monitoring aging board and the return detection signals of various characteristics are collected through the same path.
Therefore, according to the technical scheme of the embodiment, the aging station is increased by 86.7%. However, the percentage increase of the burn-in station is not specifically limited herein since different sizes of custom receptacles may result from different specific requirements.
In experimental verification, the burn-in test apparatus provided in one or more embodiments of the present specification includes that an original single-sided burn-in board with 150 burn-in stations is used, a double-sided burn-in board which is designed by being extended by using an embodiment of the present specification is used for 300 burn-in stations, 50 devices are used, verification is performed on a wws120000 platform of a dynamic burn-in device, a MAX233 chip is selected, 5V power is supplied through the double-sided burn-in board according to a GJB548B-2005 method 1015.1, a Q/WE 511. sub. 2015, and a Q/QJB 103.1A-103.15A-2010, a square wave with an amplitude of 5V and a frequency of 0.5KHz is provided at a signal input end, and after 10 times of high-temperature dynamic burn-in experiments at 168 hours and 85 degrees each time, results of monitoring device output signals every 2 hours are shown in table 1:
TABLE 1 two-sided aging board testing table
It can be seen that, the burn-in test device provided in one or more embodiments of the present disclosure comprehensively considers process equipment, heat dissipation, power and manufacturing cost to expand the burn-in station of the burn-in test, so that the expanded burn-in station is balanced among resource utilization, manufacturing cost and efficiency, the efficiency of the original dynamic burn-in test is improved by 80% to 120% on the basis of not increasing burn-in equipment, the stability of the burn-in board is also significantly improved, and the functional feasibility of the double-sided burn-in board is verified.
In addition, those skilled in the art will appreciate that the above-described apparatus may also include only those components necessary to implement the embodiments of the present description, and not necessarily all of the components shown in the figures.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the spirit of the present disclosure, features from the above embodiments or from different embodiments may also be combined, steps may be implemented in any order, and there are many other variations of different aspects of one or more embodiments of the present description as described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures, for simplicity of illustration and discussion, and so as not to obscure one or more embodiments of the disclosure. Furthermore, devices may be shown in block diagram form in order to avoid obscuring the understanding of one or more embodiments of the present description, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the one or more embodiments of the present description are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that one or more embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description.
It is intended that the one or more embodiments of the present specification embrace all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of one or more embodiments of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (10)
1. A burn-in test apparatus, comprising: a printed circuit board comprising first and second opposing surfaces; the first surface is provided with a first socket, and the second surface is provided with a second socket; the printed circuit board is also provided with a golden finger which can be plugged into an external aging box.
2. The apparatus of claim 1, wherein the first and second sockets are fixed to the printed circuit board by a fastening screw passing through the first and second sockets, so that the first and second sockets are symmetrically distributed about the printed circuit board.
3. The apparatus of claim 1, wherein the interface of the first socket and the first surface and the interface of the second socket and the second surface are respectively provided with spring pins for signal transmission, and the spring pins are abutted with the circuit in the printed circuit board.
4. The apparatus of claim 1, wherein the gold finger is affixed to an end of the printed circuit board for transmitting signals to the burn-in chamber.
5. A burn-in test apparatus, comprising: the circuit board comprises a first printed circuit board and a second printed circuit board, wherein the first printed circuit board and the second printed circuit board are arranged in an overlapped mode; a first socket is arranged on the surface of one side, away from the second printed circuit board, of the first printed circuit board; a second socket is arranged on the surface of one side, away from the first printed circuit board, of the second printed circuit board; one of the first printed circuit board and the second printed circuit board is further provided with a golden finger which can be inserted into an external aging box.
6. The apparatus of claim 5, wherein the first and second sockets are symmetrically disposed about a centerline of the first and second printed circuit boards.
7. The apparatus of claim 5, wherein the first socket is secured to the first printed circuit board by a fastening screw; the second socket is fixed to the second printed circuit board by a fastening screw.
8. The apparatus of claim 5, wherein the interface of the first socket with the first printed circuit board and the interface of the second socket with the second printed circuit board are each provided with a connector for signal transmission, the connectors interfacing with circuitry on the first and second surfaces.
9. The apparatus of claim 5, wherein the first and second printed circuit boards are provided with fastening screws penetrating therethrough; and a conducting wire for transmitting signals is arranged between the first printed circuit board and the second circuit board and connected with each other.
10. The apparatus of claim 5, wherein said gold finger is affixed to an end of at least one of said first printed circuit board and said second printed circuit board for transmitting signals to said burn-in chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011091019.3A CN112379191A (en) | 2020-10-13 | 2020-10-13 | Burn-in test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011091019.3A CN112379191A (en) | 2020-10-13 | 2020-10-13 | Burn-in test device |
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| Publication Number | Publication Date |
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| CN112379191A true CN112379191A (en) | 2021-02-19 |
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| CN202011091019.3A Pending CN112379191A (en) | 2020-10-13 | 2020-10-13 | Burn-in test device |
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| US4947545A (en) * | 1987-06-01 | 1990-08-14 | Reliability Incorporated | Automated burn-in system |
| JPH03190258A (en) * | 1989-12-20 | 1991-08-20 | Hitachi Ltd | Board for burn-in device |
| JPH04181793A (en) * | 1990-11-16 | 1992-06-29 | Fujitsu Miyagi Electron:Kk | Burn-in printed board |
| JPH04199530A (en) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | Burn-in board |
| US5200885A (en) * | 1990-04-26 | 1993-04-06 | Micro Control Company | Double burn-in board assembly |
| JPH10260220A (en) * | 1997-03-21 | 1998-09-29 | Nec Eng Ltd | Board for testing ic module |
| CN1512556A (en) * | 2002-12-27 | 2004-07-14 | 威宇科技测试封装（上海）有限公司 | Contactor for detecting ball grid array package chip in semiconductor |
| CN205693975U (en) * | 2016-06-09 | 2016-11-16 | 长沙欣高电子科技有限公司 | The dismountable double-side printed-wiring board of a kind of combination |
| CN106896244A (en) * | 2017-04-12 | 2017-06-27 | 江苏伊施德创新科技有限公司 | Ageing fixture and the method that contact condition and the test of ageing result are done using the fixture |
| CN108072832A (en) * | 2018-01-26 | 2018-05-25 | 深圳市布谷鸟科技有限公司 | A kind of test fixture of the pcb board with stamp hole |
| CN108427019A (en) * | 2018-03-09 | 2018-08-21 | 昆山翰辉电子科技有限公司 | Jig for board failure detection |
| CN208224312U (en) * | 2018-04-27 | 2018-12-11 | 江苏伊施德创新科技有限公司 | A kind of batch ageing fixture for capacitor |
| CN110058146A (en) * | 2019-05-22 | 2019-07-26 | 西安太乙电子有限公司 | It is a kind of to change the mold general aging test device and its operating method |
-
2020
- 2020-10-13 CN CN202011091019.3A patent/CN112379191A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4947545A (en) * | 1987-06-01 | 1990-08-14 | Reliability Incorporated | Automated burn-in system |
| JPH03190258A (en) * | 1989-12-20 | 1991-08-20 | Hitachi Ltd | Board for burn-in device |
| US5200885A (en) * | 1990-04-26 | 1993-04-06 | Micro Control Company | Double burn-in board assembly |
| JPH04181793A (en) * | 1990-11-16 | 1992-06-29 | Fujitsu Miyagi Electron:Kk | Burn-in printed board |
| JPH04199530A (en) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | Burn-in board |
| JPH10260220A (en) * | 1997-03-21 | 1998-09-29 | Nec Eng Ltd | Board for testing ic module |
| CN1512556A (en) * | 2002-12-27 | 2004-07-14 | 威宇科技测试封装（上海）有限公司 | Contactor for detecting ball grid array package chip in semiconductor |
| CN205693975U (en) * | 2016-06-09 | 2016-11-16 | 长沙欣高电子科技有限公司 | The dismountable double-side printed-wiring board of a kind of combination |
| CN106896244A (en) * | 2017-04-12 | 2017-06-27 | 江苏伊施德创新科技有限公司 | Ageing fixture and the method that contact condition and the test of ageing result are done using the fixture |
| CN108072832A (en) * | 2018-01-26 | 2018-05-25 | 深圳市布谷鸟科技有限公司 | A kind of test fixture of the pcb board with stamp hole |
| CN108427019A (en) * | 2018-03-09 | 2018-08-21 | 昆山翰辉电子科技有限公司 | Jig for board failure detection |
| CN208224312U (en) * | 2018-04-27 | 2018-12-11 | 江苏伊施德创新科技有限公司 | A kind of batch ageing fixture for capacitor |
| CN110058146A (en) * | 2019-05-22 | 2019-07-26 | 西安太乙电子有限公司 | It is a kind of to change the mold general aging test device and its operating method |
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