JPH10260220A - Board for testing ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board for testing an IC module that can be shared by various kinds of IC module performance testing devices and can test the performance of the IC module with a large measurement capacity by forming the measurement terminal of the maximum number of the electrodes of the element to be inspected of the IC module being placed at a socket that is fixed to a printed circuit board. SOLUTION: Edge contact parts 3 and 4 are formed at both parts of a printed circuit board 1. Pins 5 and 6 corresponding to the number of electrodes of the element to be inspected of an IC module being placed at a socket 2 that is fixed to the printed circuit board 1 are distributed and formed at the both edge contact parts, thus constituting a board for testing the IC module so that the number of IC modules to be placed at the printed circuit board 1 of an IC module to be tested is increased and a plurality of different IC module performance tests can be made with a high testing efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC module test board, and more particularly, to a plurality of IC module performance test apparatuses having different numbers of elements or diodes to be tested of an IC module mounted in a socket. IC
The present invention relates to a module test board. Further, the present invention provides an IC that can be used for both a burn-in tester and an auto power control tester while maintaining the number of sockets for mounting a surface mountable optical laser diode module at a number that can be tested by a burn-in tester.
The present invention relates to a module test board.

[0002]

2. Description of the Related Art There are a burn-in tester (hereinafter, referred to as a "BT test device") and an automatic power control tester (hereinafter, referred to as an "APC test device") as devices for screening a laser diode module in a high-temperature environment. The BT test equipment uses SMT light L
This is a device that applies a constant voltage to an LD (laser diode) of a D module and measures fluctuations in VI characteristics. A test using this device is called a BT test. The APC test device is a device that measures the fluctuation of the LD drive current by controlling the monitor current to be constant.
Test.

FIGS. 4 and 5 show these BTs, respectively.
1 shows a conventional burn-in board used in a test apparatus and an APC test apparatus. This burn-in board has a printed circuit board 101. A plurality of sockets 101 for mounting a surface mountable optical laser diode module (hereinafter, referred to as “SMT optical LD module”) are fixed to the printed circuit board 102. An edge contact portion (terminal portion) 103 is formed at one end of the printed circuit board 102. The edge contact portion 103 can be connected to a connector 104 of a BT test device and an APC test device. The edge contact portion 103 has a 43 pin with 86 pins formed as a standard product.
Since there is a pin double type, a standard product will be described below as an example for convenience.

The BT test apparatus uses a total of 32 pins: 16 pins for operation monitoring, 8 pins for burn-in board number recognition, and 8 pins for ground. The remaining 54 pins are connected to the LD anode (hereinafter referred to as “L”) of the SMT optical LD module.
D anode) and a cathode (hereinafter referred to as “LD cathode”). Since each SMT optical LD module has one LD, the maximum number of sockets that can be fixed to this conventional burn-in board is 27. However, since one lot of the socket 101 that can be fixed to the printed circuit board is usually set to ten or a multiple thereof, in this case, the fixed number is 20 as shown in FIG.
become.

On the other hand, an APC test apparatus is also used for operation monitoring,
The same number of pins as in the BT test are used for burn-in board number recognition and grounding. However, for each SMT optical LD module, four of the LD anode and LD cathode of one LD and the anode (hereinafter referred to as “PD anode”) and cathode (hereinafter referred to as “PD cathode”) of one PD (photodiode) are used. There are three electrodes.
Therefore, the maximum number of sockets 1 fixed to the burn-in board is thirteen. However, because of the number of one lot, the number of sockets 101 that can be mounted on the burn-in board is shown in FIG.
As shown in FIG. 2, the number of the BT test is reduced to ten, which is half of the case of the BT test.

Therefore, in this conventional example, the BT test can be performed on 20 SMT optical LD modules each time.
In the case of the APC test, the test can be performed only for 10 SMT optical LD modules each time. Therefore, after performing the BT test, if the APC test is to be performed, the SMT optical LD
Half the number of modules installed on the burn-in board is 10
You have to carry out transshipment to reduce to individual pieces. Therefore, the BT test and the APC
When the tests are performed sequentially, the test efficiency is significantly reduced.

On the other hand, as a burn-in board of the prior art, there is one disclosed in Japanese Patent Application Laid-Open No. 5-102261. This burn-in board is composed of two boards, a component board and a wiring board. By using wiring boards having different wirings, various types of IC modules can be tested by the same IC test module performance test apparatus. Therefore, it cannot be used for different types of IC module testing equipment.
The purpose is completely different from the present invention.

[0008]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an IC module test board which can be used in common for a plurality of types of IC module performance test apparatuses.

[0009]

In order to solve the above problems, an IC module test board according to the present invention comprises:
A printed circuit board, a plurality of sockets fixed to the printed circuit board for mounting the IC module, a plurality of terminals formed on at least two edges of the printed circuit board;
It is constituted by pins formed on these terminals for connection to the corresponding electrodes of the device under test of the module.

An IC module test board according to the present invention also includes a printed circuit board and a plurality of sockets fixed to the printed circuit board for mounting a surface mountable optical laser diode module having a laser diode and a photodiode. A terminal portion formed at both ends of the printed circuit board, a pin formed at one of these terminal portions and connected to the electrode of the laser diode, and a pin formed at the other of the terminal portions and connected to the electrode of the photodiode. , Burn-in tester and auto control tester.

[0011] The IC module test board according to the present invention further includes a printed board, a plurality of sockets arranged on the printed board, to which an IC module to be tested is mounted, and a socket arranged on the board. A plurality of first pins connected to a first terminal of each of the corresponding sockets and formed so as to be connectable to a first test apparatus; and A second pin connected to a second terminal of each of the corresponding sockets and configured to be connectable to a second test device for the second test.

An IC module test board according to the present invention further comprises: a printed circuit board; a plurality of sockets arranged on the printed circuit board, on which an optical laser module to be tested including a laser diode and a photodiode is mounted; It is arranged on the printed circuit board and is formed at each terminal where the anode and cathode of the laser diode of each socket are connected for burn-in test and auto power control test of optical laser module, and can be connected to burn-in tester and auto power control tester A plurality of formed common test pins are arranged on a printed circuit board and connected to each terminal to which an anode and a cathode of a photodiode of each socket are connected for an auto power control test of an optical laser module. Composed of a plurality of automatic power control test pins which are connectable to form the connector on the trawl tester.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention when an IC module test board according to the present invention is used as a burn-in board will be described with reference to FIGS. This burn-in board is used for sequentially performing a BT test and an APC test on a SMT optical LD module using a BT test device and an APC test device as performance test devices.

Referring to FIG. 1, reference numeral 1 denotes a rectangular printed board on which a plurality of sockets 2 are fixed by high-temperature solder. Long and narrow rectangular edge contact portions (terminal portions) 3 and 4 are formed at both ends of the printed board 1 so as to protrude. These edge contact portions 3, 4
Is a pin-double type, and has pins 5 and 6 (only some of these pins are shown in the figure for simplicity) on both sides. Here, a standard 43-pin double (86 pins) is used as the edge contact portions 3 and 4.
I will explain it.

On the other hand, in the edge contact portion 3, a total of 32 pins are used, out of 86 pins 5, 16 pins for operation monitoring, 8 pins for burn-in board number recognition, and 8 pins for ground. To the remaining 54 pins 5,
By connecting the LD anode (laser diode anode) and the LD cathode (laser diode cathode) of the SMT optical LD module, 27 sockets 2 can be fixed to the printed circuit board 1. However, since the number of lots of the socket 2 is usually 10 or a multiple thereof, twenty sockets 2 are fixed to the printed circuit board 1 using 40 pins 5.

The other edge contact portion 4 has an SMT
The PD anode (photodiode anode) and the PD cathode (photodiode cathode) of the optical LD module are connected. When 20 sockets 2 are fixed to the printed circuit board 1, the number of these PD electrodes is 40, so the edge contact portion 4 only needs 40 pins 6. Therefore, all of the PD electrodes can be connected to the edge contact portion 4.

As described above, all of the LD electrodes and PD electrodes from the twenty sockets 2 fixed to the printed circuit board 1 can be connected to the corresponding edge contact portions 3 and 4. Therefore, while the number of sockets 1 fixed to the printed circuit board 1 is maintained at 20, the BT test of the SMT optical LD module and the APC
The test can be performed continuously.

The edge contact portion 3 is provided with a PD electrode connector 7 of an ST test device and an LD electrode connector 7 of an APC test device (separately provided in corresponding test devices,
For convenience, indicated by the same reference numbers). The edge contact portion 4 is a PPC dedicated to the APC test apparatus.
Connect to D electrode connector 8.

FIGS. 2 and 3 show a method of connecting the burn-in board according to the embodiment of the present invention to a BT test apparatus and an APC test apparatus, respectively. Here, socket 2 is 1
Are shown, but in the embodiment of the present invention, 2
0 are fixed. SM attached to this socket 2
The LD anode 10 and the LD cathode 11 of the T-light LD module 9 are connected to the pins 5 of the one edge contact part 3 by the printed wiring 12 formed on the printed circuit board 1. The PD anode 13 and the PD cathode 14 of the SMT optical LD module 9 mounted on the socket 2 are connected to the pins 6 of the other edge contact portion 4 by the printed circuit board 1.
Are connected by another printed wiring 15 formed at the same time.

The edge contact portion 3 of the burn-in board according to the embodiment of the present invention is mounted on the burn-in board by connecting it to an LD electrode connector (first connector) 7 of a BT test apparatus as shown in FIG. The BT test is performed on all the SMT optical LD modules that have been set. Subsequently, as shown in FIG. 3, the edge contact portion 3 is connected to the LD electrode connector (second connector) 7 of the APC test apparatus. At the same time, PD of APC test equipment
The edge contact portion 4 is connected to the electrode connector (third connector) 8. Thus, the APC test of all the SMT optical LD modules subjected to the BT test is performed.

Therefore, in the burn-in board of the present embodiment, the APC test can be performed without reducing the number of sockets 2 that can be fixed to the conventional burn-in board for the BT test. . As a result, the test efficiency was greatly increased. That is, in the embodiment of the present invention, the number of sockets 2 that can be mounted is increased from 10 times the conventional number to 20 times, and the processing capacity of the APC test apparatus is doubled as compared with the conventional case. In addition, the burn-in board according to the embodiment of the present invention has no components to be removed, added, or replaced during the test, so that the socket portion is less deteriorated in a high-temperature environment and the durability is improved.

Although the above description has been made using a standard 43-pin double edge contact portion, an arbitrary number of pins can be selected according to the number of sockets fixed to the printed circuit board. The test object may be an element of another IC module. In this case, a performance test apparatus used for testing the element under test of the other IC module is used. Therefore, the subject of the present invention is not limited to the burn-in board, and can be applied to an IC module test board that can be shared for testing various IC modules with various IC module characteristic test devices.

Further, the edge contact portion (terminal portion)
Not only at both ends of the printed board, but also at one edge of the board and edges on both sides or one side thereof, or may be formed on all four edges. In this case, it is necessary that the number of pins necessary for the test be distributed to all the edge contact portions in accordance with the number of sockets fixed to the printed circuit board of the IC module test board.

[0024]

The IC module test board of the present invention is formed by forming edge contact portions (terminal portions) on a plurality of edges thereof and distributing and arranging a required number of pins on these edge contact portions. . For this purpose, a plurality of different types of IC module testing apparatuses are provided with the IC of the present invention.
When the module test board is shared, more sockets can be fixed and used than in the conventional case. Therefore,
There is an effect that the test efficiency can be improved. In addition, since there is no part to be removed, added, or replaced during the test under a high temperature environment, there is also an effect that the deterioration of the socket portion is small and the durability is increased.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a burn-in board according to the present invention.

FIG. 2 is a diagram showing a method of connecting the burn-in board of FIG. 1 to a BT test device.

FIG. 3 is a diagram showing a method of connecting the burn-in board of FIG. 1 to an APC test apparatus.

FIG. 4 is a perspective view of a conventional burn-in board for a BT test.

FIG. 5 is a perspective view of a conventional burn-in board for APC test.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Socket 3, 4 Edge contact part 5, 6 pin 7 Connector for LD electrode 8 PD electrode connector of APC test equipment 9 SMT optical LD module 10 LD anode 11 LD cathode 12 Printed wiring 13 PD anode 14 PD cathode 15 Print wiring

Claims (6)

[Claims] A printed circuit board; a plurality of sockets fixed to the printed circuit board for mounting an IC module; a plurality of terminals formed on at least two edges of the printed circuit board; An IC module test board, comprising: pins formed on the plurality of terminals for connection to corresponding electrodes of the device under test; and shared by a plurality of types of IC module characteristic testing devices. 2. The IC module test board according to claim 1, wherein the plurality of terminals are formed at edges of both ends of the printed circuit board. 3. A printed circuit board, a plurality of sockets fixed to the printed circuit board for mounting a surface mountable optical laser diode module having a laser diode and a photodiode, and formed at both ends of the printed circuit board. A terminal portion; a pin formed on one of the terminals and connected to the electrode of the laser diode; and a pin formed on the other of the terminals and connected to the electrode of the photodiode. An IC module test board shared with a power control tester. 4. The one terminal is connected to a first connector for the burn-in tester and a second connector for the auto power control tester, and the other terminal is a third connector for the auto power control tester.
4. The IC module test board according to claim 3, wherein the board is connected to the connector of (1). 5. A printed circuit board, a plurality of sockets arranged on the printed circuit board, to which an IC module to be tested is mounted, and a plurality of sockets arranged on the printed circuit board for a first test of the IC module A plurality of first pins connected to a first terminal of each of the sockets to be connected and formed to be connectable to a first test device; and a second pin arranged on the printed circuit board for a second test of the IC module. A plurality of second pins connected to the second terminals of each of the corresponding sockets and formed to be connectable to the second test device. 6. A printed circuit board, a plurality of sockets arranged on the printed circuit board, to which an optical laser module to be tested including a laser diode and a photodiode is mounted, and a plurality of sockets arranged on the printed circuit board, A plurality of shared test pins formed at each terminal to which an anode and a cathode of the laser diode of each socket are connected for a burn-in test and an auto power control test, and formed to be connectable to a burn-in tester and an auto power control tester; The auto power control tester is arranged on the printed circuit board and connected to each terminal to which the anode and cathode of the photodiode are connected in each socket for an auto power control test of the optical laser module. An IC module test board, comprising: a plurality of auto power control test pins formed so as to be connectable to a connector.