JP4726426B2 - Aging board for semiconductor laser - Google Patents

Description

  The present invention relates to an improvement in an aging board for a semiconductor laser that performs an evaluation test by driving a semiconductor laser used for recording and reproducing information on various optical disks such as CD and DVD under predetermined conditions.

As an aging board on which a large number of semiconductor lasers are mounted and driven under a predetermined condition to perform an evaluation test, there is an IC module test board described in Patent Document 1, for example.
In this test board, a plurality of sockets are fixed on a printed circuit board having an edge contact portion at the end, an optical laser diode module (semiconductor laser) is mounted in each socket, and the edge contact portion is attached to the connector of the test apparatus. Is connected to perform the test.

JP-A-10-260220

By the way, this type of semiconductor laser is used for recording / reproducing optical disks in various devices such as AV equipment such as in-vehicle and portable CD players and DVD players, home game machines, and desktop and notebook personal computers. It is designed as a semiconductor laser of various standards with different laser emission amounts, number of electrodes, and arrangement corresponding to each device.
Therefore, a dedicated aging board corresponding to the standard of each semiconductor laser is necessary. With the recent improvement in performance of various devices, the functions of the semiconductor laser incorporated in them have been improved year by year. There is a problem that a new aging board has to be produced each time the standard is changed, and as a result, the cost associated with the development and manufacture of the semiconductor laser increases.

In order to solve such a problem, it is conceivable that the sockets are detachably attached to the wiring board so that the sockets can be exchanged as the standard of the semiconductor laser is changed.
However, when configured in this manner, heat at the time of driving the semiconductor laser is accumulated in the densely populated locations of the sockets, which may adversely affect the evaluation test and the semiconductor laser.

In order to solve such a problem, the applicant of the present application allows the lower end side of the radiating pin provided in each socket to pass through the wiring board and protrude to the lower surface side, and to lower the lower end portion of the radiating pin, Proposed to contact the metal bottom plate fixed to the lower surface of the wiring board via a heat dissipation member (specifically, an elastic member that urges the heat dissipation pin upward) to improve the heat dissipation effect by the metal bottom plate. Filed earlier (Japanese Patent Application No. 2004-69035).
However, according to the configuration as described above, the semiconductor laser mounted in the socket may be pushed up by the heat radiating member and the heat radiating pin, and the laser emission position may be shifted. There was a possibility that variations would occur and accurate test results could not be obtained.

  The present invention has been made in view of such conventional circumstances, and the intended process is compatible with various types of semiconductor lasers having different numbers and arrangements of electrodes, and is excellent in heat dissipation efficiency during testing. Another object of the present invention is to provide a novel aging board capable of obtaining an accurate test result without variation in the reference plane for the laser light receiving unit in the semiconductor laser evaluation test.

In order to achieve the above object, the present invention is an aging board for a semiconductor laser in which a plurality of sockets to which a semiconductor laser is mounted are mounted on a wiring board, and an evaluation test is performed by driving each semiconductor laser under a predetermined condition. And
Interposing a metal plate for heat dissipation between the wiring board and the plurality of sockets,
The sockets are detachably attached to the metal plate for heat dissipation, and the upper end portion is in contact with the heat dissipation surface of the semiconductor laser, and the lower end portion is connected to the metal plate for heat dissipation. While providing a heat dissipation member to contact,
The heat-dissipating metal plate is co when positioned at the wiring board and spacing, and implanted the relay contact pins electrically connected to the respective contact pin of each socket to the wiring of the wiring board ,
The laser emission reference surface for the light receiving unit when performing the evaluation test of the semiconductor laser mounted in each socket is set on the upper surface of the metal plate for heat dissipation.

According to such a configuration, since a plurality of sockets are detachably provided, if there is a change in standards such as the number of electrodes of the semiconductor laser, which is the element under test, or the electrode array shape, the socket should be replaced with a corresponding one. Thus, aging of various types of semiconductor lasers can be performed while sharing the wiring board.
In addition, the heat generated when the semiconductor laser is driven can be released to the metal board for heat dissipation via the heat dissipation member, so that even when a large number of sockets are densely mounted on the wiring board, a predetermined heat dissipation effect is exhibited. In addition, the influence on the evaluation test and the semiconductor laser can be reduced.
Also, since the lower end of the heat radiating member is brought into contact with the heat radiating metal plate and the laser emission reference surface is set on the upper surface of the heat radiating metal plate, the laser emission reference surface of the semiconductor laser mounted in each socket may be displaced. There is no fear, and an accurate evaluation test can be performed.

It is preferable that the lower end portion of the heat dissipation member is detachably fixed to the metal plate for heat dissipation.
In the case of such a configuration, the effect can be made more effective.

For each mounting unit region of each socket in the wiring pattern formed on the wiring board, the maximum number of terminal portions required for driving the semiconductor laser is provided, and the relay contact pins are connected to each terminal portion,
A first contact pin for connecting each contact pin in each socket to each electrode of a semiconductor laser mounted in the socket, and an external lead for connecting the first contact pin to the relay contact pin Formed from a second contact pin;
Each socket preferably includes a printed circuit board for connecting only the first contact pins required for driving the semiconductor laser mounted in the socket to the second contact pins.

In this case, it is possible to easily cope with a change in standard such as the number of electrodes of the semiconductor laser and the arrangement shape of the electrodes by the printed board.
Further, when the printed circuit board is replaceably attached to the socket, it is possible to easily cope with a change in standards such as the number of electrodes of the semiconductor laser and the electrode arrangement shape only by changing the printed circuit board.

  Since the aging board for a semiconductor laser according to the present invention is configured as described above, the manufacturing cost of a relatively expensive wiring board is not wasted, and one wiring board can be used continuously. Costs associated with laser aging can be greatly reduced. In addition, since the laser emission reference surface is set on the upper surface of the heat radiating metal plate, a more accurate evaluation test can be performed without fear of variations among the sockets.

  In addition, since it is possible to easily cope with the increase or decrease in the number of terminal portions required for driving a semiconductor laser, it is possible to age a plurality of types of semiconductor lasers having different standards such as the number of electrodes and the electrode arrangement shape. Play.

Hereinafter, an example of an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the aging board A of this example has a predetermined shape between a wiring board 1 made of a rectangular printed board and a wiring board 1 on the upper surface of the wiring board 1 by fixing means 2 such as screws. And a plurality of sockets 4 arranged in a vertical and horizontal manner on the upper surface of the metal plate 3, and each of the sockets 4 includes a semiconductor laser a which is an element to be tested. Aging is performed by connecting the connector 6 of the test apparatus to the edge contact portion 5 provided at the end of the wiring board 1. Each socket 4 is detachably fixed to the metal plate 3 for heat dissipation by fixing means 7 such as screws.

The semiconductor laser a of this example is an optical laser diode module that reads digital information recorded on a CD or DVD. As shown in FIG. 5, the required number (a figure of a plurality of electrodes provided on the lower surface) In the example shown, four terminals are power supply electrodes a-1, and the other required number of terminals are other signal electrodes a-2. A heat radiating surface a-3 is provided at the approximate center of the lower surface.
The semiconductor laser to be tested on the aging board A of this example is the optical laser diode module, and the power supply electrodes required for driving this type of semiconductor laser have a maximum of six terminals. Therefore, in this example, the maximum number of power supply terminal portions 8 required for driving the optical laser diode module is provided for each mounting unit region of each socket 4 in the wiring pattern formed on the wiring board 1. 6 terminal portions are formed, and relay contact pins 9 are connected to the respective terminal portions 8.

  The required number of contact pins 9 for relaying are provided in the metal plate 3 so as to be compatible with the maximum number of electrodes for driving the semiconductor laser targeted in this example, that is, 6 are implanted in the metal plate 3. As shown in FIG. 3, the upper end portion has an insertion portion 9a into which a lower end portion 13b of a second contact pin 13 to be described later is removably inserted, and the lower end portion 9b is inserted into the wiring board 1 and the wiring pattern It is electrically connected to a predetermined terminal portion 8.

  On the other hand, each of the sockets 4 is configured such that the semiconductor laser a is detachably attached to a semiconductor laser mounting portion 10 that is recessed substantially at the center of the upper surface thereof. A first contact pin 11 that is in contact with and electrically connected to each of the electrodes a-1 and a-2 is disposed, and a heat radiating member 12 is disposed so as to be surrounded by the first contact pin 11. Yes.

  Each first contact pin 11 is incorporated in a predetermined number corresponding to each electrode a-1, a-2 of the semiconductor laser a, and its upper end portion 11a is bent so as to surely contact each electrode a-1, a-2. It is formed in a deformable curved shape.

The heat dissipating member 12 is made of a material having excellent heat dissipating properties, and the upper end portion 12a of the heat dissipating member 12 is in contact with the heat dissipating surface a-3 on the lower surface of the semiconductor laser a while the lower end portion 12b It is formed so as to contact the metal plate 3.
Further, the lower end portion 12b of the heat radiating member is detachably fixed to the metal plate 3 by a fixing member 18 such as a screw, whereby the heat at the time of driving the semiconductor laser a is released to the metal plate 3 by the heat radiating member 12. At the same time, a reference plane L for laser emission when the semiconductor laser a is driven is set on the upper surface of the metal plate 3.

  In addition, a predetermined number of second lead pins 13 for external extraction for electrically connecting the first contact pins 11 to the relay contact pins 9 are incorporated in each socket 4, and the second A printed circuit board 14 that electrically connects the contact pins 13 and the first contact pins 11 is detachably provided.

The required number of the second contact pins 13 is provided corresponding to each terminal portion 8 of the wiring pattern formed on the wiring board 1, and as shown in FIG. It is electrically connected to the lower end portion 11b of the first contact pin 11 at an appropriate position via the wiring pattern 14a formed on the upper side.
3 and 4, the lower end portion 13b of the second contact pin 13 protrudes from the lower surface of the socket 4 and can be freely inserted into and removed from the insertion portion 9a formed at the upper end portion of the relay contact pin 9. Plugged in.

  Of the first contact pins 11, the printed circuit board 14 is only required for driving the semiconductor laser a mounted on the mounting portion 10, that is, in this example, four connected to the power supply electrode a- 1. A wiring pattern 14a for connecting only the first contact pin 11 to the predetermined second contact pin 13 is provided, and the cavity 15 formed in the socket 4 can be replaced by a fixing means such as a screw. It is attached to.

  The socket 4 includes the required number of first contact pins 11 and second contact pins 13, the heat radiating member 12, the printed circuit board 14, and the locking member 16 for locking the semiconductor laser a mounted on the mounting portion 10. And a cover 4b for opening and closing the locking member 16.

  The cover 4b is locked up and down with respect to the main body 4a and is urged upward by a spring 4c. When the cover 4b is in the raised position, the locking member 16 is rotated to the closed position to resist the spring 4c. A shaft 4d is provided for rotating the locking member 16 to the open position when lowered.

  In the aging board A for semiconductor laser of the present example having the above-described configuration, the first contact pins 11 become the printed circuit board 14, the second contact pins 13, and the relay contacts if the respective sockets 4 are attached to predetermined positions of the metal board 3. Conduction is made through a pin 9 to a predetermined terminal portion 8 on the wiring board 1. When the semiconductor laser a, which is the element under test, is mounted on the mounting portion 10 of each socket 4, the required number of electrodes a-1 required for driving the semiconductor laser a are connected to the wiring board 1 via the first contact pins 11. Each semiconductor laser a is driven by the electric power supplied through the wiring pattern of the wiring board 1, the edge contact portion 5, and the connector 6. The aging board A is placed in a thermostatic chamber, and each semiconductor laser a is driven for a predetermined time to perform an evaluation test.

The heat at the time of driving the semiconductor laser a is efficiently radiated from the metal board 3 through the heat radiation surface a-3 and the heat radiation member 12. Therefore, even in the socket 4 in which the heat dissipation efficiency may be lowered because it is in the central area arranged densely in the vertical and horizontal directions, a predetermined heat dissipation effect can be obtained without adversely affecting the evaluation test and the semiconductor laser a. Aging with high reliability can be performed.
Further, since the laser emission reference plane L in each socket 4 is set on the upper surface of the metal plate 3, there is no possibility that the laser emission reference plane of the semiconductor laser a mounted in each socket 4 will be displaced, and it is accurate. Evaluation tests can be performed.

  If there is a change in the standard such as the number of electrodes of the semiconductor laser that is the element under test or the electrode array shape, the printed circuit board 14 is removed from the socket 4 and replaced with a printed circuit board that conforms to the standard. By doing so, the above-described evaluation test can be performed.

  Further, when the upper end portion 11a of the first contact pin 11 is damaged or the solder adheres due to the attachment or removal of the semiconductor laser a several times, only the socket 4 can be replaced.

  As mentioned above, although one example of the embodiment of the present invention has been described with reference to the drawings, the present invention is not limited to the illustrated example, and various modifications may be made within the scope of the technical idea described in the claims. Needless to say, it is possible to make changes.

It is a perspective view which shows an example of embodiment of the aging board based on this invention, and abbreviate | omits and shows it. The enlarged plan view of the socket in FIG. Sectional drawing which follows the (X)-(X) line | wire of FIG. Sectional drawing which follows the (Y)-(Y) line | wire of FIG. (A): Perspective view showing arrangement relationship of semiconductor laser, first contact pin, and heat radiating member, (B): Perspective view showing lower surface of semiconductor laser. The enlarged plan view of a printed circuit board.

Explanation of symbols

A: Aging board 1: Wiring board 3: Metal plate for heat dissipation 4: Socket 9: Contact pin for relay 10: Mounting portion of semiconductor laser 11: First contact pin 12: Heat dissipation member 13: Second contact pin 14: Printed circuit board 18: Fixing means L: Laser emission reference plane a: Semiconductor laser

Claims (4)

A semiconductor laser aging board that mounts a plurality of sockets on which a semiconductor laser is mounted on a wiring board, drives each semiconductor laser under a predetermined condition, and performs an evaluation test,
Interposing a metal plate for heat dissipation between the wiring board and the plurality of sockets,
The sockets are detachably attached to the metal plate for heat dissipation, and the upper end portion is in contact with the heat dissipation surface of the semiconductor laser, and the lower end portion is connected to the metal plate for heat dissipation. While providing a heat dissipation member to contact,
The heat-dissipating metal plate is co when positioned at the wiring board and spacing, and implanted the relay contact pins electrically connected to the respective contact pin of each socket to the wiring of the wiring board ,
An aging board for a semiconductor laser, characterized in that a laser emission reference surface for a light receiving unit when performing an evaluation test of the semiconductor laser mounted in each socket is set on an upper surface of the metal plate for heat dissipation. 2. The aging board for a semiconductor laser according to claim 1, wherein a lower end portion of the heat radiating member is detachably fixed to the metal plate for heat dissipation. For each mounting unit region of each socket in the wiring pattern formed on the wiring board, the maximum number of terminal portions required for driving the semiconductor laser is provided, and the relay contact pins are connected to each terminal portion,
A first contact pin for connecting each contact pin in each socket to each electrode of a semiconductor laser mounted in the socket, and an external lead for connecting the first contact pin to the relay contact pin Formed from a second contact pin;
Each of the sockets includes a printed circuit board for connecting only one of the first contact pins required for driving the semiconductor laser mounted in the socket to the second contact pin. The aging board for a semiconductor laser according to claim 1 or 2.   4. The aging board for a semiconductor laser according to claim 3, wherein the printed circuit board is replaceably attached to the socket.

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