JP4348215B2 - Aging board for semiconductor laser - Google Patents

Description

  The present invention relates to an improvement in an aging board for a semiconductor laser that performs an evaluation test by driving a semiconductor laser used for recording and reproducing information on various optical disks such as CD and DVD under predetermined conditions.

As an aging board on which a large number of semiconductor lasers are mounted and driven under a predetermined condition to perform an evaluation test, there is an IC module test board described in Patent Document 1, for example.
In this test board, a plurality of sockets are fixed on a printed circuit board having an edge contact portion at the end, an optical laser diode module (semiconductor laser) is mounted in each socket, and the edge contact portion is attached to the connector of the test apparatus. Is connected to perform the test.

JP-A-10-260220

By the way, this type of semiconductor laser is used for recording / reproducing optical disks in various devices such as AV equipment such as in-vehicle and portable CD players and DVD players, home game machines, and desktop and notebook personal computers. It is designed as a semiconductor laser of various standards with different laser emission amounts, number of electrodes, and arrangement corresponding to each device.
Therefore, a dedicated aging board corresponding to the standard of each semiconductor laser is necessary. With the recent improvement in performance of various devices, the functions of the semiconductor laser incorporated in them have been improved year by year. There is a problem that a new aging board has to be produced each time the standard is changed, and as a result, the cost associated with the development and manufacture of the semiconductor laser increases.

In order to solve such a problem, it is conceivable that the sockets are detachably attached to a parent base so that the sockets can be exchanged in accordance with a change in the standard of the semiconductor laser.
However, when configured in this manner, heat at the time of driving the semiconductor laser is accumulated in the densely populated locations of the sockets, which may adversely affect the evaluation test and the semiconductor laser.

  The present invention has been made in view of such conventional circumstances, and the object of the present invention is that it can be applied to semiconductor lasers of various standards with different numbers and arrangements of electrodes, and has excellent heat dissipation efficiency during testing. Another object of the present invention is to provide a new aging board that can be easily replaced.

In order to achieve the above object, claim 1 of the present invention is an aging board for a semiconductor laser in which a plurality of semiconductor lasers are mounted on a parent substrate, and each semiconductor laser is driven under a predetermined condition to perform an evaluation test. And
The parent base includes a plurality of sockets for mounting the semiconductor lasers,
Each socket is detachably formed into a lower socket that is detachably attached to the parent base, and an upper socket that is mounted with the semiconductor laser and is detachably attached to the lower socket,
Each socket is replaceable with a change in the standard of the semiconductor laser, and only the upper socket is replaceable in each socket.
Provided below the semiconductor laser mounting portion of the upper socket is a heat dissipation pin whose upper end is in contact with the heat sink of the semiconductor laser and whose lower end penetrates the lower socket and protrudes from the lower surface of the parent base.
A heat dissipating member made of an elastic member that contacts a metal bottom plate fixed to the lower surface of the parent base and urges the heat dissipating pin upward is detachably fitted to the lower end of the heat dissipating pin. And

  According to a second aspect of the present invention, the heat dissipating member is a leaf spring.

  According to a third aspect of the present invention, a locked portion is formed on a side surface of the upper socket, and a locking portion is provided in the lower socket so as to be elastically engaged with the locked portion in a freely detachable manner. The engagement between the locking portion and the locked portion is formed so as to be releasable by an operation from above the socket.

  According to a fourth aspect of the present invention, the locked portion includes a locked surface provided in a middle portion of a vertical groove that is recessed in the left and right sides of the upper socket, and the locking portion is formed on the left and right sides of the lower socket. The left and right locking projections are deformed outward by left and right clamping rods inserted from above into the vertical groove, and the engagement between the locking projections and the locked surface is released. In addition, the upper socket is sandwiched between the left and right clamping rods so that the upper socket can be removed.

5. The upper socket according to claim 1, wherein the upper socket has a plurality of contact pins connected to the electrodes of the semiconductor laser, and the lower end portions of the contact pins protruding from the lower surface of the upper socket are detachably inserted. A receiving contact pin for external drawing to be provided in the lower socket, and the upper socket is detachably mounted on the lower socket;
Provide the maximum number of connection pins required for driving the semiconductor laser on the mounting part of each socket in the parent base,
The lower socket preferably includes a plurality of linkage pins connected to the connection pins, and a printed circuit board that connects only linkage pins required for driving the semiconductor laser among the linkage pins to the predetermined receiving contact pins. .

Since the semiconductor laser aging board according to the present invention is configured as described above, the following effects can be obtained.
(Claim 1)
Multiple sockets are detachably attached to the parent board, so if there is a change in standards such as the number of electrodes of the semiconductor laser, which is the element under test, or the electrode array shape, the socket is replaced with the corresponding socket. By attaching to the base, it is possible to age semiconductor lasers of various standards while sharing the parent base. In addition, since the socket can be divided into an upper socket and a lower socket, and the semiconductor laser is frequently attached and removed, only the relatively severely damaged upper socket is replaced in a timely manner, and the lower socket continues for a long time. Can be used.
Therefore, the manufacturing cost of the relatively expensive parent base is not wasted, and one parent base can be used continuously, and only the relatively severely damaged upper socket can be replaced in a timely manner. Since it can be used continuously, the cost associated with aging of the semiconductor laser can be greatly reduced.
In addition, since the heat at the time of driving the semiconductor laser can be released to the metal bottom plate on the lower surface of the main board via the heat radiating pins and heat radiating members, it is a case where a large number of sockets are densely mounted on the main board. In addition, it was possible to provide a highly reliable aging board that exerts a predetermined heat dissipation effect and has no possibility of adversely affecting the evaluation test and the semiconductor laser.
In addition, since the heat dissipation member is detachably fitted to the lower end of the heat dissipation pin, when replacing the upper socket, if the upper socket is pulled away from the lower socket, the heat dissipation member will automatically hit the main board and be released from the heat dissipation pin. Drop off. Therefore, the heat dissipation effect can be obtained without complicating the trouble of replacing the socket.
Furthermore, since the heat radiating member urges the heat radiating pin upward, the contact reliability between the heat radiating plate on the lower surface of the semiconductor laser mounted on the upper socket and the heat radiating pin is improved, and the heat radiating effect can be obtained more reliably.

(Claim 2)
Since the heat dissipating member is made of a leaf spring, for example, the above-mentioned effect can be obtained at a lower cost compared to the case where the heat dissipating member is formed with a spring, for example.

(Claim 3)
Since the upper socket is securely held with respect to the lower socket by the engagement of the locking portion and the locked portion, and the engagement state can be released by operation from the upper side of the socket, a large number of sockets are placed on the parent base. Even in the case of dense mounting, the above-described effects can be reliably obtained.

(Claim 4)
If the left and right clamping rods are inserted into the left and right vertical grooves of the upper socket from above, the left and right latching protrusions are deformed outward to disengage from the locked surface, and the upper socket is clamped by the left and right clamping rods. Thus, the upper socket can be removed from the lower socket.
Therefore, it is possible to mount a large number of sockets in a dense manner on the parent base while narrowing the space between adjacent sockets to a narrow dimension that allows the right and left clamping rods to be inserted.

Further, in the first to fourth aspects, the upper socket has a plurality of contact pins connected to the respective electrodes of the semiconductor laser, and the lower end portions of the contact pins protruding from the lower surface of the upper socket are removably inserted. A receiving contact pin for external drawing to be provided in the lower socket, and the upper socket is detachably mounted on the lower socket;
Provide the maximum number of connection pins required for driving the semiconductor laser on the mounting part of each socket in the parent base,
The lower socket includes a plurality of linkage pins connected to the connection pins, and a printed circuit board that connects only the linkage pins required for driving the semiconductor laser among the linkage pins to the predetermined receiving contact pins. In this case, the following effects are obtained.
That is, the parent board has the maximum number of connection pins required for driving the semiconductor laser, and among these connection pins, the connection pins required for driving the semiconductor laser, which is the element under test, are connected to the connection pins, the printed circuit board, and the receiving socket of the lower socket. The semiconductor laser can be driven by conducting to a predetermined electrode of the semiconductor laser through the contact pin and the contact pin of the upper socket. Therefore, it is possible to easily cope with an increase or decrease in the number of connection pins required for driving the semiconductor laser.

Hereinafter, an example of an embodiment of the present invention will be described with reference to FIGS.
The aging board A of this example includes a parent base 1 composed of a rectangular printed base, a large number of sockets 2 arranged in a vertical and horizontal manner on the upper surface of the parent base 1, and fixing means 3 such as screws. And a metal bottom plate 4 fixed with a predetermined gap therebetween, and a semiconductor laser a which is an element to be tested is attached to each socket 2 and an edge contact provided at an end of the parent substrate 1 Aging is performed by connecting the connector 5 of the test apparatus to the part 1a.

The semiconductor laser a in this example is an optical laser diode module that reads digital information recorded on a CD or DVD, and four terminals among a plurality of electrodes provided on the lower surface thereof are power supply electrodes a-1, The other 14 terminals are other signal electrodes a-2.
The semiconductor laser to be tested on the aging board A of this example is the optical laser diode module, and the power supply electrodes required for driving the semiconductor laser have a maximum of 6 terminals.

On the mounting portion 6 of each socket 2 in the parent substrate 1, connection pins 7 for supplying power necessary for driving the optical laser diode module are formed for the maximum number of six terminals.
The connection pin 7 is disposed so as to protrude on the parent substrate 1, and a lower end portion 7 a of the connection pin 7 protrudes to the lower surface through the parent substrate 1, and a power supply wiring 9 is connected through a conductive fixing member 8 such as solder. ing. The upper end portion 7b rises on the parent base 1 with a predetermined height and is detachably inserted into a linkage pin 12 described later.

  Each socket 2 includes a lower socket 10 that is detachably mounted on each mounting portion 6 of the parent base 1 and an upper socket 20 that is mounted with the semiconductor laser a and is detachably mounted on the lower socket 10. The upper and lower sockets 10 and 20 are configured to be separable, and are engaged with a locking projection 42 and a locked surface 41, which will be described later, so that the mounted state can be released.

  A predetermined number of receiving contact pins 11 and linking pins 12 for external drawing are incorporated in the lower socket 10, and a printed circuit board 13 on which the receiving contact pins 11 and the linking pins 12 are erected is a screw 14 or the like on the lower surface. It is detachably attached.

  The receiving contact pin 11 is formed with 14 terminals corresponding to the signal electrode a-2 of the semiconductor laser a, and the upper end portion 11a branches into a bifurcated shape and the lower end of the contact pin 22 of the upper socket 20 The portion 22b is removably inserted, and the lower end portion 11b penetrates the printed board 13 and protrudes from the lower surface of the lower socket 10.

  The linking pins 12 are formed in six terminals so as to be compatible with the maximum number of electrodes for driving the semiconductor laser targeted in this example, and one end portion 12a of the linking pin 12 penetrates the printed board 13 and protrudes from the lower surface of the lower socket 10. The other end portion is bent downward and the tip is an inverted U-shaped receiving pin 12b, and the upper end portion 7b protruding on the parent base 1 of the connecting pin 7 is removably inserted into the receiving pin 12b. ing.

  On the printed circuit board 13, one end 12 a of four linkage pins 12 is connected to each power supply electrode a- 1 (four terminals) in the semiconductor laser a and the power supply wiring 9 of the parent substrate 1. The lower end portion 11b of the receiving contact pin 11 connected to each of the power supply electrodes a-1 is electrically connected by the wiring 13a.

  Each receiving contact pin 11 supported by the printed circuit board 13 is arranged so that a lower end portion 11b thereof is loosely inserted into the opening 1a of the parent substrate 1. Each linkage pin 12 supported by the printed circuit board 13 is arranged so that one end portion 12a thereof is loosely inserted into the opening 1b of the parent base 1, and the upper end portion 7b of each connection pin 7 is inserted into each receiving pin 12b. Has been.

  Further, a boss 15 to be inserted into the positioning hole 1c of the main board 1 is projected from the lower surface corner of the socket body 11, and the lower socket 10 is obtained by inserting and removing the receiving pins 12b and the upper end portions 7b of the connecting pins. Are detachably mounted on the mounting portions 6 of the parent base 1.

The upper socket 20 includes a main body 20a in which a contact pin 22 and a locking member 23 are disposed around a mounting portion 21 of the semiconductor laser a, and a cover 20b for opening and closing the locking member 23. A predetermined number of electrodes are incorporated corresponding to the electrodes a-1 and a-2 of the semiconductor laser a, and the upper end portion 22a is formed in a curved shape that can be bent and deformed so as to surely contact the electrodes a-1 and a-2. Has been.
The lower end portion 22b of each contact pin 22 protrudes below the main body 21 and is removably inserted into the upper end portion 11a of the receiving contact pin 11. By inserting and removing the contact pin lower end portion 22b and the receiving contact pin upper end portion 11a, The upper socket 20 is detachably attached to the lower socket 10.

  The cover 20b is locked to the main body 20a so as to be movable up and down, and is urged upward by a spring 24. When the cover 20b is in the raised position, the cover member 23 is rotated to the closed position to resist the spring 24. When it is lowered, a shaft 25 is provided for rotating the locking member 23 to the open position.

  The locking member 23 is rotatably supported by the support shaft 26 between the closed position and the open position, and locks the semiconductor laser a in the mounting portion 21 by the tip 23a at the closed position, and at the open position, The tip 23a is formed to be separated from the mounting portion 21 so that the semiconductor laser a can be taken in and out.

  Reference numeral 27 denotes a radiating pin provided below the mounting portion 21, which has a square-shaped head portion 27 a that contacts the radiating plate a- 3 on the lower surface of the semiconductor laser a at the upper end, and a recess 28 provided in the main body 20 a of the upper socket. The head portion 27a is locked and attached to the main body 20a. The portion projecting downward from the main body 20a is loosely inserted into the lower socket 10 and the through holes 29 and 30 of the printed circuit board 13, and the lower end portion 27b is the parent base. 1 is loosely inserted into the opening 1a.

A heat radiating member 31 that comes into contact with the metal bottom plate 4 fixed to the lower surface of the parent base 1 is detachably fitted to the lower end portion 27 b of the heat radiating pin 27.
The heat dissipating member 31 is a plate spring made of a desired metal curved in a substantially U shape. With the lower side portion 31 a in contact with the bottom plate 4, the end portion of the upper side portion 31 b is directly below the lower end portion of the heat radiating pin 27. The lower end portion 27b of the radiating pin 27 is detachably fitted to the fitting portion 31c provided integrally with the end portion of the upper side portion 31b, and is attached to the radiating pin 27. The heat at the time of driving the semiconductor laser a is released to the bottom plate 4 in contact with the bottom plate 4 and the heat radiating pins 27 are urged upward to securely connect the heat radiating pins 27 and the semiconductor laser heat radiating plate a-3. It is formed so that it may contact.

A vertical groove 40 extending from the lower surface of the main body 20a to the upper surface of the cover 20b is recessed on both the left and right sides of the upper socket 20, and a locked surface 41 projects from the region of the main body 20a in the vertical groove 40. ing.
Further, on both the left and right sides of the lower socket 10, locking protrusions 42 inserted into the vertical grooves 40 are provided, and the locking protrusions 42 are elastically detachable at the upper end of the locking surface 41. The projection 43 to be engaged is provided.

  Then, the engagement between the locking projections 42 and the locked surface 41 releasably locks the mounted state of the upper and lower sockets 10 and 20, and the jig 50 removes the upper socket 20. Is possible.

  The jig 50 includes convex portions 52 at the lower ends of the left and right clamping rods 51 that can be inserted into the left and right vertical grooves 40 from above, and push the convex portions 43 outward to push the left and right locking projections 42. The left and right locking protrusions 42 are deformed outward by the holding hooks 51 to release the engagement between the locking protrusions 42 and the locked surface 41, and the upper socket 20 is held between the left and right holding hooks 51 to lower the lower sockets. 10 so that it can be removed.

In the semiconductor laser aging board A of the present example having the above-described configuration, a plurality of sockets 2 can be obtained by attaching the lower socket 10 to each attachment portion 6 of the base board 1 and attaching the upper socket 20 to each lower socket 10. Are mounted on the base 1 in a state of being arranged vertically and horizontally.
Then, when the semiconductor laser a, which is an element under test, is mounted on the upper socket 20 of each socket 2, the four electrodes a-1 required for driving the semiconductor laser a are contact pins 22, receiving contact pins 11, prints. It is electrically connected to the power supply wiring 9 of the parent substrate 1 through the wiring 13 a of the substrate 13, the linkage pin 12, and the connection pin 7, and is supplied through the wiring 9, the edge contact portion 4, and the connector 5. Each semiconductor laser a is driven by the electric power. The aging board A is placed in a thermostatic chamber, and each semiconductor laser a is driven for a predetermined time to perform an evaluation test.

  The heat at the time of driving the semiconductor laser a is efficiently radiated from the bottom plate 4 through the radiating plate a-3, the radiating pins 27, and the radiating member 31. Therefore, even in the socket 2 where the heat radiation efficiency may be lowered because it is located in the central area densely arranged in the vertical and horizontal directions, a predetermined heat radiation effect can be obtained without adversely affecting the evaluation test and the semiconductor laser a. Aging with high reliability can be performed.

  When there is a change in the standard such as the number of electrodes of the semiconductor laser as the element under test and the arrangement shape of the electrodes, the printed circuit board 13 is removed from the lower socket 10 and replaced with a printed circuit board according to the standard. Or by removing the lower socket 10 and the upper socket 20 from the main base 1 and replacing them with lower and upper sockets according to the standard and attaching them to the respective mounting portions 6 of the main base 1. Evaluation tests can be performed.

  Further, when the upper end portion 22a of the contact pin 22 is damaged or the solder adheres due to the attachment and removal of the semiconductor laser a several times, the lower socket 10 remains unchanged and only the upper socket 20 is replaced. be able to.

The removal of the upper socket 20 can be easily performed using the above-described jig 50 (see FIGS. 8A to 8B). Therefore, it is possible to mount a large number of sockets in a dense manner on the parent base, while narrowing the gap S between the adjacent sockets 2 to a narrow dimension into which the left and right clamping rods 51 can be inserted.
Needless to say, when the upper socket 20 is removed, the heat radiating member 31 hits the parent base 1 and automatically falls off the heat radiating pins 27.

  As mentioned above, although one example of the embodiment of the present invention has been described with reference to the drawings, the present invention is not limited to the illustrated example, and various modifications may be made within the scope of the technical idea described in the claims. Needless to say, it is possible to make changes.

It is a perspective view which shows an example of embodiment of the aging board based on this invention, and abbreviate | omits and shows it. The enlarged plan view of the socket in FIG. Sectional drawing which follows the (X)-(X) line | wire of FIG. Sectional drawing which follows the (Y)-(Y) line | wire of FIG. The bottom view of a lower socket. The enlarged plan view of the socket mounting part in a main base | substrate. (A): Perspective view showing arrangement relationship of semiconductor laser, contact pin, heat dissipation pin, heat dissipation member, (B): Perspective view showing lower surface side of semiconductor laser. The expanded sectional view of the principal part which shows the state which removes an upper socket.

Explanation of symbols

A: Aging board 1: Parent base 2: Socket 4: Metal bottom plate 6: Socket mounting part 10: Lower socket 20: Upper socket 27: Heat radiation pin 31: Heat radiation member 40: Vertical groove 41: Locked surface (covered) Locking part)
42: Locking protrusion (locking part)
50: Jig 51: Holding rod a: Semiconductor laser

Claims (4)

A semiconductor laser aging board in which a plurality of semiconductor lasers are mounted on a parent substrate, and each semiconductor laser is driven under a predetermined condition to perform an evaluation test,
The parent base includes a plurality of sockets for mounting the semiconductor lasers,
Each socket is detachably formed into a lower socket that is detachably attached to the parent base, and an upper socket that is mounted with the semiconductor laser and is detachably attached to the lower socket,
Each socket is replaceable with a change in the standard of the semiconductor laser, and only the upper socket is replaceable in each socket.
Provided below the semiconductor laser mounting portion of the upper socket is a heat dissipation pin whose upper end is in contact with the heat sink of the semiconductor laser and whose lower end penetrates the lower socket and protrudes from the lower surface of the parent base.
A heat dissipating member made of an elastic member that contacts a metal bottom plate fixed to the lower surface of the parent base and urges the heat dissipating pin upward is detachably fitted to the lower end of the heat dissipating pin. Aging board for semiconductor laser. Aging board semiconductor laser according to claim 1, wherein said heat radiating member is characterized by comprising a leaf spring. A locking portion is formed on a side surface of the upper socket, and a locking portion is provided in the lower socket so as to be elastically engaged with the locking portion. the engagement of the locking portion, claim 1 or 2 of the semiconductor laser for aging board according to any one characterized by being releasably formed by the operation from the socket upper. The locked portion is formed by a locked surface provided in a middle portion of a vertical groove that is recessed on the left and right sides of the upper socket, and the locking portion is raised on the left and right sides of the lower socket. The left and right locking projections are deformed outward by left and right clamping rods inserted from above into the vertical groove, and the engagement between the locking projections and the locked surface is released, and the upper socket is 4. An aging board for a semiconductor laser according to claim 3 , wherein the aging board is formed so that the upper socket can be removed by being sandwiched between right and left clamping rods.

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