JP2005257377A - Aging board for semiconductor laser - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a new aging board capable of coping with semiconductor lasers of various specifications having the different number, array or the like of electrodes. <P>SOLUTION: When a specification such as the number of electrodes or the array shape of the electrodes in a semiconductor laser 3 which is a test element is changed, a parent base 1 can be used in common by changing sockets corresponding thereto, because the plurality of sockets are mounted detachably on the parent base 1. The socket 2 can be divided into an upper socket 20 and a lower socket 10, and only the upper socket 20 is exchanged properly, which is comparatively severely damaged because the semiconductor laser 3 is frequently mounted or dismounted, and the lower socket 10 can be used continuously for a long period. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an improvement in an aging board for a semiconductor laser that performs an evaluation test by driving a semiconductor laser used for recording and reproducing information on various optical disks such as CD and DVD under predetermined conditions.

As an aging board on which a large number of semiconductor lasers are mounted and driven under a predetermined condition to perform an evaluation test, there is an IC module test board described in Patent Document 1, for example.
In this test board, a plurality of sockets are fixed on a printed circuit board having an edge contact portion at the end, an optical laser diode module (semiconductor laser) is mounted in each socket, and the edge contact portion is attached to the connector of the test apparatus. Is connected to perform the test.

JP-A-10-260220

By the way, this type of semiconductor laser is used for recording / reproducing optical disks in various devices such as AV equipment such as in-vehicle and portable CD players and DVD players, home game machines, and desktop and notebook personal computers. It is designed as a semiconductor laser of various standards with different laser emission amounts, number of electrodes, and arrangement corresponding to each device.
Therefore, a dedicated aging board corresponding to the standard of each semiconductor laser is necessary. With the recent improvement in performance of various devices, the functions of the semiconductor laser incorporated in them have been improved year by year. There is a problem that a new aging board has to be produced each time the standard is changed, and as a result, the cost associated with the development and manufacture of the semiconductor laser increases.

  The present invention has been made in view of such a conventional situation, and an object of the present invention is to provide a novel aging board capable of dealing with semiconductor lasers of various standards having different numbers and arrangements of electrodes. .

In order to achieve the above object, claim 1 of the present invention is an aging board for a semiconductor laser in which a plurality of semiconductor lasers are mounted on a parent substrate, and each semiconductor laser is driven under a predetermined condition to perform an evaluation test. And
The parent base includes a plurality of sockets for mounting the semiconductor lasers,
Each socket is configured to be separable into a lower socket that is detachably attached to the parent base, and an upper socket that is mounted with the semiconductor laser and is detachably attached to the lower socket,
Each of the sockets can be replaced with a change in the standard of the semiconductor laser, and only the upper socket can be replaced in each socket.

According to a second aspect of the present invention, the upper socket has a plurality of contact pins connected to the electrodes of the semiconductor laser, and the lower end portions of the contact pins protruding from the lower surface of the upper socket are removably inserted. A receiving contact pin for external drawing to be provided in the lower socket, and the upper socket is detachably mounted on the lower socket;
Provide the maximum number of connection pins required for driving the semiconductor laser on the mounting part of each socket in the parent base,
The lower socket includes a plurality of linkage pins connected to the connection pins, and a printed circuit board for connecting only linkage pins required for driving the semiconductor laser among the linkage pins to the predetermined receiving contact pins. And

  A third aspect of the present invention is characterized in that the printed circuit board is replaceably attached to the lower socket.

  According to a fourth aspect of the present invention, the connection pin is raised on the parent base, and the linkage pin includes an inverted U-shaped receiving pin that removably receives the connecting pin, and the connection pin and the receiving pin are inserted. The lower socket is formed to be detachably attached to the parent base by being detached.

Since the semiconductor laser aging board according to the present invention is configured as described above, the following effects can be obtained.
(Claim 1)
Multiple sockets are detachably attached to the parent board, so if there is a change in standards such as the number of electrodes of the semiconductor laser, which is the element under test, or the electrode array shape, the socket is replaced with the corresponding socket. By attaching to the base, it is possible to age semiconductor lasers of various standards while sharing the parent base. In addition, since the socket can be divided into an upper socket and a lower socket, and the semiconductor laser is frequently attached and removed, only the relatively severely damaged upper socket is replaced in a timely manner, and the lower socket continues for a long time. Can be used.
Therefore, the manufacturing cost of the relatively expensive parent base is not wasted, and one parent base can be used continuously, and only the relatively severely damaged upper socket can be replaced in a timely manner. Since it can be used continuously, the cost associated with aging of the semiconductor laser can be greatly reduced.

(Claim 2)
The base board has the maximum number of connection pins required for driving the semiconductor laser, and among these connection pins, the connection pins required for driving the semiconductor laser, which is the element under test, are the connection pins of the lower socket, the printed circuit board, and the receiving contact pins. The semiconductor laser can be driven by conducting to a predetermined electrode of the semiconductor laser through the contact pin of the upper socket. Therefore, it is possible to easily cope with an increase or decrease in the number of connection pins required for driving the semiconductor laser, and to make the effect more effective.

(Claim 3)
Since the printed circuit board can be replaced with the lower socket, if there is a change in the number of connection pins required to drive the semiconductor laser that is the element under test, the printed circuit board can be replaced with the corresponding printed circuit board and installed in the lower socket. In addition, aging of various types of semiconductor lasers can be performed while sharing the parent base, the lower socket, and the upper socket.

(Claim 4)
Since the lower socket is detachably attached to the parent base by inserting / removing the connection pin that rises on the base and the receiving pin into which the connection pin is inserted, the above-described effects can be obtained without providing a separate attaching / detaching means. Can do.

Hereinafter, an example of an embodiment of the present invention will be described with reference to FIGS.
The aging board A of this example comprises a parent base 1 made of a rectangular printed base and a large number of sockets 2 mounted on the upper surface of the parent base 1 in vertical and horizontal directions. A certain semiconductor laser 3 is mounted, and a connector 5 of a test apparatus is connected to an edge contact portion 4 provided at an end portion of the parent substrate 1 to perform aging.

The semiconductor laser 3 of this example is an optical laser diode module that reads digital information recorded on a CD or DVD, and four terminals among a plurality of electrodes provided on the lower surface thereof are power supply electrodes 3a. The 14 terminals are other signal electrodes 3b.
The semiconductor laser to be tested on the aging board A of this example is the optical laser diode module, and the power supply electrodes required for driving the semiconductor laser have a maximum of 6 terminals.

On the mounting portion 6 of each socket 2 in the parent substrate 1, connection pins 7 for supplying power necessary for driving the optical laser diode module are formed for the maximum number of six terminals.
The connection pin 7 is disposed so as to protrude on the parent substrate 1, and a lower end portion 7 a of the connection pin 7 protrudes to the lower surface through the parent substrate 1, and a power supply wiring 9 is connected through a conductive fixing member 8 such as solder. ing. The upper end portion 7b rises on the parent base 1 with a predetermined height and is detachably inserted into a linkage pin 12 described later.

  Each socket 2 includes a lower socket 10 that is detachably mounted on each mounting portion 6 of the parent base 1, and an upper socket 20 that is mounted with the semiconductor laser 3 and is detachably mounted on the lower socket 10. It is configured to be splittable.

  A predetermined number of receiving contact pins 11 and linking pins 12 for external drawing are incorporated in the lower socket 10, and a printed circuit board 13 on which the receiving contact pins 11 and the linking pins 12 are erected is a screw 14 or the like on the lower surface. It is detachably attached.

  The receiving contact pin 11 is formed with 14 terminals corresponding to the signal electrode 3 b of the semiconductor laser 3, and the upper end portion 11 a branches into a bifurcated shape and the lower end portion 22 b of the contact pin 22 of the upper socket 20. The lower end 11b penetrates the printed circuit board 13 and protrudes from the lower surface of the lower socket 10.

  The linking pins 12 are formed in six terminals so as to be compatible with the maximum number of electrodes for driving the semiconductor laser targeted in this example, and one end portion 12a of the linking pin 12 penetrates the printed board 13 and protrudes from the lower surface of the lower socket 10. The other end portion is bent downward and the tip is an inverted U-shaped receiving pin 12b, and the upper end portion 7b protruding on the parent base 1 of the connecting pin 7 is removably inserted into the receiving pin 12b. ing.

  The printed circuit board 13 has one end portion 12a of four linkage pins 12 to electrically connect each of the power supply electrodes 3a (four terminals) in the semiconductor laser 3 and the power supply wiring 9 of the parent substrate 1; The lower end portion 11b of the receiving contact pin 11 connected to each power supply electrode 3a is electrically connected by the wiring 13a.

  Each receiving contact pin 11 supported by the printed circuit board 13 is arranged so that a lower end portion 11b thereof is loosely inserted into the opening 1a of the parent substrate 1. Each linkage pin 12 supported by the printed circuit board 13 is arranged so that one end portion 12a thereof is loosely inserted into the opening 1b of the parent base 1, and the upper end portion 7b of each connection pin 7 is inserted into each receiving pin 12b. Has been.

  Further, a boss 15 to be inserted into the positioning hole 1c of the main board 1 is projected from the lower surface corner of the socket body 11, and the lower socket 10 is obtained by inserting and removing the receiving pins 12b and the upper end portions 7b of the connecting pins. Are detachably mounted on the mounting portions 6 of the parent base 1.

The upper socket 20 includes a main body 20a in which a contact pin 22 and a locking member 23 are disposed around a mounting portion 21 of the semiconductor laser 3, and a cover 20b for opening and closing the locking member 23. A predetermined number is incorporated corresponding to each electrode 3a, 3b of the semiconductor laser 3, and its upper end portion 22a is formed in a curved shape that can be bent and deformed so as to be surely in contact with each electrode 3a, 3b.
The lower end portion 22b of each contact pin 22 protrudes below the main body 21 and is removably inserted into the upper end portion 11a of the receiving contact pin 11. By inserting / removing the contact pin lower end portion 22b and the receiving contact pin upper end portion 11a, The upper socket 20 is detachably attached to the lower socket 10.

  The cover 20b is locked to the main body 20a so as to be movable up and down, and is urged upward by a spring 24. When the cover 20b is in the raised position, the cover member 23 is rotated to the closed position to resist the spring 24. When it is lowered, a shaft 25 is provided for rotating the locking member 23 to the open position.

  The locking member 23 is rotatably supported by the support shaft 26 between the closed position and the open position. The semiconductor laser 3 in the mounting portion 21 is locked by the tip 23a at the closed position, and the open position is The tip 23 a is formed so as to be separated from the mounting portion 21 so that the semiconductor laser 3 can be taken in and out.

  Reference numeral 27 denotes a radiating pin provided below the mounting portion 21. The radiating pin 27 has a square-shaped head portion 27 a that contacts the heat radiating plate 3 c on the lower surface of the semiconductor laser 3 at the upper end, and a concave portion 28 provided on the main body 20 a of the upper socket. 27a is locked and attached to the main body 20a, and the portion protruding downward from the main body 20a is loosely inserted into the opening 1a of the parent base 1 through the lower socket 10 and the through holes 29 and 30 of the printed circuit board 13. It has become.

In the semiconductor laser aging board A of the present example having the above-described configuration, a plurality of sockets 2 can be obtained by attaching the lower socket 10 to each attachment portion 6 of the base board 1 and attaching the upper socket 20 to each lower socket 10. Are mounted on the base 1 in a state of being arranged vertically and horizontally.
Then, when the semiconductor laser 3 as the element to be tested is mounted on the upper socket 20 of each socket 2, the four electrodes 3a required for driving the semiconductor laser 3 are contact pins 22, receiving contact pins 11, and printed circuit board 13. Is electrically connected to the power supply wiring 9 of the parent substrate 1 through the wiring 13a, the linking pin 12, and the connection pin 7, and the electric power supplied through the wiring 9, the edge contact portion 4, and the connector 5 is used. Each semiconductor laser 3 comes to be driven.
The aging board A is placed in a thermostatic bath, and each semiconductor laser 3 is driven for a predetermined time to perform an evaluation test.

  When there is a change in the standard such as the number of electrodes of the semiconductor laser as the element under test and the arrangement shape of the electrodes, the printed circuit board 13 is removed from the lower socket 10 and replaced with a printed circuit board according to the standard. Or by removing the lower socket 10 and the upper socket 20 from the main base 1 and replacing them with lower and upper sockets according to the standard and attaching them to each mounting portion 6 of the main base 1. Evaluation tests can be performed.

  Further, when the upper end portion 22a of the contact pin 22 is damaged or solder adheres due to several times of attachment and detachment of the semiconductor laser 3, the lower socket 10 remains as it is, and only the upper socket 20 is replaced. be able to.

  As mentioned above, although one example of the embodiment of the present invention has been described with reference to the drawings, the present invention is not limited to the illustrated example, and various modifications may be made within the scope of the technical idea described in the claims. Needless to say, it is possible to make changes.

It is a perspective view which shows an example of embodiment of the aging board based on this invention, and abbreviate | omits and shows it. The enlarged plan view of the socket in FIG. Sectional drawing which follows the (X)-(X) line | wire of FIG. (A); Sectional view along line (Y)-(Y) in FIG. 2, (B); Sectional view with the lower socket and upper socket removed in (A). The bottom view of a lower socket. The enlarged plan view of the socket mounting part in a main base | substrate. (A): A perspective view showing a lower surface side of a semiconductor laser, (B): A perspective view showing an arrangement relationship of heat radiation pins and contact pins with respect to the semiconductor laser.

Explanation of symbols

A: Aging board 1: Parent board 2: Socket 3: Semiconductor laser 6: Socket mounting part 7: Connection pin 10: Lower socket 11: Receiving contact pin 12: Linking pin 13: Printed circuit board 20: Upper socket 22: Contact pin

Claims (4)

A semiconductor laser aging board in which a plurality of semiconductor lasers are mounted on a parent substrate, and each semiconductor laser is driven under a predetermined condition to perform an evaluation test,
The parent base includes a plurality of sockets for mounting the semiconductor lasers,
Each socket is configured to be separable into a lower socket that is detachably attached to the parent base, and an upper socket that is mounted with the semiconductor laser and is detachably attached to the lower socket,
An aging board for a semiconductor laser, wherein each of the sockets can be replaced with a change in the standard of the semiconductor laser, and only the upper socket can be replaced in each socket. The upper socket has a plurality of contact pins connected to the respective electrodes of the semiconductor laser, and a receiving contact for external drawing in which a lower end portion of each contact pin protruding from the lower surface of the upper socket is detachably inserted. A pin is installed in the lower socket, and the upper socket is detachably mounted on the lower socket,
Provide the maximum number of connection pins required for driving the semiconductor laser on the mounting part of each socket in the parent base,
The lower socket includes a plurality of linkage pins connected to the connection pins, and a printed circuit board for connecting only linkage pins required for driving the semiconductor laser among the linkage pins to the predetermined receiving contact pins. The aging board for a semiconductor laser according to claim 1.   3. The aging board for a semiconductor laser according to claim 2, wherein the printed board is replaceably attached to the lower socket.   The connection pin is raised on the parent base, and the linkage pin includes an inverted U-shaped receiving pin that removably receives the connection pin, and the insertion and removal of the connection pin and the receiving pin allows the lower socket to be 4. The aging board for a semiconductor laser according to claim 2, wherein the aging board is formed so as to be detachably attached to the parent substrate.

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