JPH0846348A - Mounting of component on mixed mounting board - Google Patents

Abstract

PURPOSE:To dispense with a hand work process by a method wherein a land on one surface of a board is covered with a solder paste excluding the center part of the land, a land on the opposite surface to the one surface is covered with the paste including the center part of the land and a component is inserted and heated in a through hole to solder it to the board. CONSTITUTION:A solder paste 5 is printed in such a way as to cover pads 2 on one surface of a and at the same time, the paste 5 is printed on a land 4 excluding the center part of the land 4 and after a surface mounting component 6 is placed on the pads 2, the component 6 is reflow-soldered to the pads 2. Then, this substrate is inverted to print the paste 5 in such a way as to cover pads 2 and at the same time, the paste 5 is printed in such a way as to cover the whole surface of a land 4, a surface mounting component 6 is placed on the pads 2 and an insertion component 8 is inserted in a through hole 3 to reflow-solder to the substrate. Thereby, a soldering of the component 8 is automated and at the same time, the number of processes is reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mixed board component mounting method for mounting a surface mount component and an insert component on a substrate.
In particular, the present invention relates to a component mounting method for a mixed board that does not require a manual work process.

[0002]

2. Description of the Related Art Components mounted on a board include surface mount components and insert components.

The insertion part has leads for electrodes and soldering, and the leads are inserted into the board for soldering. In this case, the board is provided with a hole called a through hole for inserting the lead, and the hole is electrically connected on both sides of the board. Circular hollow patterns called lands are formed around the through holes on both sides of the substrate. At the time of soldering, for example, the solder is poured into the through hole from the surface opposite to the side where the insertion component is inserted.

The surface mount component does not have a lead like an insert component, but is soldered on the side where the component is mounted. In this case, a pattern called a pad for soldering the electrodes of the surface mount component is formed on the substrate. At the time of soldering, solder paste is printed on the pads, surface-mounted components are placed, and then heated by a method called reflow soldering to melt the solder paste for soldering.

A component mounting method for a mixed mounting board on which surface mounting components and insertion components are mounted, in particular, surface mounting components are mounted on both surfaces of the substrate, and insertion components are also mounted on this substrate,
Conventionally, the procedure of FIG. 2 has been used. First, as shown in FIG. 2B, the solder paste 5 is printed so as to cover the pad 2 on one side, as shown in FIG. 2B, on the substrate 1 having the pad 2, the through hole 3 and the land 4 of FIG. Figure 2 (c)
After mounting the surface mount component 6 as shown in FIG. 2, reflow soldering is performed to obtain the state of FIG. Next, the substrate is turned over, the solder paste 5 is printed so as to cover the pad 2 on the opposite surface, as shown in FIG. 2 (e), and the surface mount component 6 is attached as shown in FIG. 2 (f). After the placement, reflow soldering is performed to obtain the state of FIG. Finally, the insertion component 8 is inserted using the through hole 3 and manually soldered using a soldering iron or the like.

[0006]

In the conventional component mounting method for a mixed board, the step of soldering the inserted component is a manual process. Manual soldering requires labor costs, the solder quality tends to be uneven, and the amount of solder used is not constant,
Since it is necessary to secure a work space on the board, the mounting density cannot be increased, and it is necessary to consider the work environment such as exhaust.

Therefore, an object of the present invention is to solve the above-mentioned problems and to provide a component mounting method for a mixed board which eliminates the need for a manual work process.

[0008]

In order to achieve the above object, the present invention forms pads for mounting surface mount components on both sides of a substrate and forms through holes for inserting insert components in the substrate. A land is formed on both sides of the board surrounding the through hole, and the surface mounting component and the insertion component are mounted on this substrate.In the component mounting method of the mixed substrate, the land on one side is covered with solder paste except the center part. ,
The land on the opposite surface is covered with a solder paste including the center part thereof, and the insertion component is inserted into the through hole and heated to solder the insertion component.

Further, pads for mounting surface mount components are formed on both sides of the board, through holes for inserting the insertion parts are formed in the board, and lands are formed on both sides of the board by surrounding the through holes. In a component mounting method for a mixed mounting board in which surface mounting components and insertion components are mounted on this substrate, first, solder paste is printed on one surface of the substrate and a portion excluding the central portion of the land, and the surface mounting components are mounted on the pads. After placing, perform reflow soldering, then
Reflow soldering is performed after solder paste is printed on the pad and the entire land including the center of the land on the opposite surface, the surface mount component is placed on the pad and the through-hole insertion component is inserted.

[0010]

[Operation] The center of the land is a through hole.
Cover this land, including its center, with solder paste,
When heated, part of the melted solder flows into the through holes, and the solder fills the through holes and hardens. When the land is covered with solder paste excluding its center and heated, the melted solder does not flow into the through hole,
Hardens only on the land. Therefore, on at least one surface, the land is covered with the solder paste including the central portion thereof, and by inserting the insertion component into this through hole and heating, a part of the melted solder flows into the through hole, The insert parts will be soldered.

According to the present invention, the land on one surface is covered with the solder paste except for the central portion thereof, the land on the opposite surface is covered with the solder paste including the central portion thereof, and the insertion component is inserted into the through hole. By heating, a part of the melted solder flows into the through hole and fills the space between the lead of the insertion part and the through hole to be solidified. By this method, the inserted component can be soldered without resorting to manual work.

The method of soldering the above-mentioned inserted parts has the same procedure as the method of soldering the surface-mounted parts. Therefore, it is possible to solder the insertion component in parallel with the soldering of the surface-mounted components on both sides.

That is, according to the present invention, first, the solder paste is printed on one surface of the substrate on the pad and the portion other than the central portion of the land. After mounting the surface mount component on the pad, reflow soldering is performed. In this way, the surface mount component is first soldered to one surface of the substrate. In the process up to this point, the reason why printing is performed excluding the central part of the land is, as described above, if the printing is performed including the central part, the through hole is filled during reflow soldering, and the insertion part cannot be inserted later. Because.

In the next step, the solder paste is printed on the opposite surface and the entire land including the center of the land. After mounting the surface mount component on the pad and inserting the insert component in the through hole, reflow soldering is performed.
In this step, the surface mount component is soldered to the opposite surface, and at the same time, the insert component is soldered.

According to this method, the insert parts can be soldered without resorting to manual work, and the soldering of the surface mount parts and the soldering of the insert parts can be made parallel to each other to simplify the process.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIG. 1A, a substrate 1, a pad 2, a through hole 3 and a land 4 are provided. As shown on the right side of FIG. 1A, the land 4 has a circular shape having a hole at its center on the substrate surface, and this center corresponds to the through hole 3.

First, as shown in FIG. 1B, the solder paste 5 is printed so as to cover the pad 2 on one surface, and at the same time, the solder paste is printed except for the central portion of the land 4. The solder paste 5 on the land 4 is shown in FIG.
As noted on the right side of (b), the substrate surface has a donut shape in which the through hole 3 is just hollowed out.

After mounting the surface mount component 6 on the pad 2 as shown in FIG. 1 (c), reflow soldering is performed to obtain the state of FIG. 1 (d). As shown in FIG. 1 (d),
The surface mount component 6 is soldered with the solder 7, and the land 4
Above, the solder 7 hardens without flowing into the through hole 3.

Then, the substrate is turned over, and as shown in FIG. 1E, the solder paste 5 is printed so as to cover the pad 2 on the opposite surface, and at the same time, the entire surface of the land 4 is covered. To print. The solder paste 5 on the land 4 has a circular shape as the outer shape of the land 4 on the surface of the substrate, as shown on the right side of FIG.

As shown in FIG. 1F, the surface mount component 6 is placed on the pad 2 and the insert component 8 is inserted in the through hole 3.
Insert. At this time, the lead 9 of the insertion component 8 sticks through the printed solder paste 5 and is inserted into the through hole 3.

Finally, reflow soldering is performed and the process shown in FIG.
The state is (g). As shown in FIG. 1G, the surface mount component 6 is soldered with the solder 7, and the insert component 8
Are soldered by the solder 7 flowing into the through hole 3.

Comparing the procedure of FIG. 1 with the procedure of FIG.
It can be seen that the soldering of the insert parts is automated and the number of steps is reduced.

In the above embodiment, printing was performed to cover the pads and lands with the solder paste, but coating, sticking or other methods may be used.

In the above embodiment, the surface mount components are mounted on both sides, but the present invention is effective even if mounted on one side. For example, when the surface mount component and the insert component are mounted on the same surface, the process shown in FIG. In this case, it is possible to use a dip tank,
By performing the reflow soldering, the problem peculiar to the dip tank does not occur.

[0026]

The present invention exhibits the following excellent effects.

(1) Since the manual soldering is automated, the labor cost can be reduced and the manufacturing line can be simplified. Moreover, since the surface mount component and the insert component can be soldered at the same time, the process can be simplified.

(2) Since the solder is supplied by printing, the amount of solder used is stable.

(3) It is not necessary to secure a work space on the substrate, and the arrangement pitch of the insertion parts can be narrowed. Therefore, the packaging density can be increased.

[Brief description of drawings]

FIG. 1 is a mounting process diagram showing an embodiment of the present invention.

FIG. 2 is a mounting process diagram showing a conventional example.

[Explanation of symbols]

 1 Board 2 Pad 3 Through Hole 4 Land 5 Solder Paste 6 Surface Mount Component 8 Insert Component

Claims (2)

[Claims] 1. Pads for mounting surface mount components are formed on both sides of a substrate, through holes for inserting insertion components are formed in the substrate, and lands are formed on both sides of the substrate surrounding the through holes. In the component mounting method of the mixed mounting board for mounting the surface mounting component and the insertion component on this substrate,
Cover the land on one side with solder paste except the center part, cover the land on the opposite side with solder paste including the center part, insert the insert part into the through hole and heat the insert part by heating. A component mounting method for a mixed board, comprising: 2. Pads for mounting surface mount components are formed on both sides of a substrate, through holes for inserting insertion components are formed in the substrate, and lands are formed on both sides of the substrate so as to surround the through holes. In the component mounting method of the mixed mounting board for mounting the surface mounting component and the insertion component on this substrate,
First, print solder paste on one side of the board except the center of the pad and land, place surface mount components on the pad, and then perform reflow soldering, and then on the other side, pad and land. Solder paste is printed on the entire land including the center of the board, surface mount parts are placed on the pads, through hole insertion parts are inserted, and then reflow soldering is performed. .