JPH04103193A - Soldering method of insertion mounting component - Google Patents
Soldering method of insertion mounting componentInfo
- Publication number
- JPH04103193A JPH04103193A JP22210790A JP22210790A JPH04103193A JP H04103193 A JPH04103193 A JP H04103193A JP 22210790 A JP22210790 A JP 22210790A JP 22210790 A JP22210790 A JP 22210790A JP H04103193 A JPH04103193 A JP H04103193A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- type component
- mount type
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000003780 insertion Methods 0.000 title claims abstract description 43
- 230000037431 insertion Effects 0.000 title claims abstract description 43
- 238000005476 soldering Methods 0.000 title claims abstract description 34
- 229910000679 solder Inorganic materials 0.000 claims abstract description 105
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 17
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000006071 cream Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
挿入実装型部品はんだ付け方法に関し、いわゆるはんだ
面に狭ピツチ表面実装型部品を配置できるとともに、は
んだ面の表面実装型部品を接着剤で仮固定せずに済むよ
うにすることを目的とし、
挿入実装型部品をプリント配線板に実装する挿入実装型
部品のはんだ付け方法において、□挿入実装型部品のリ
ードにソルダーバンプを形成した後、プリント配線板に
搭載し、リフロー方式により前記ソルダーバンプを溶解
させて挿入実装型部品をはんだ付けする構成とし、表面
実装構造プリント配線板ユニットに適用する場合には、
実装面あるいははんだ面もしくは実装・はんだ両面の表
面実装型部品のリフロー方式はんだ付けと同時に前記ソ
ルダーバンプを溶解させて挿入実装型部品をリフロー方
式によりはんだ付けする構成とした。[Detailed Description of the Invention] [Summary] Regarding the method for soldering insertion-mounted components, it is possible to arrange narrow pitch surface-mounted components on the so-called solder surface, and also to avoid temporarily fixing the surface-mounted components on the solder surface with adhesive. In the soldering method for insertion-mounted components, in which insertion-mounted components are mounted on a printed wiring board, solder bumps are formed on the leads of the insertion-mounted components, and then the components are mounted on the printed wiring board. However, when the solder bumps are melted using a reflow method and the insertion mounting type components are soldered, and when applied to a surface mount structure printed wiring board unit,
At the same time as reflow soldering of surface mount type components on the mounting surface, solder surface, or both mounting and soldering surfaces, the solder bumps are melted and insertion mount type components are soldered by reflow method.
本発明は、挿入実装型部品のはんだ付け方法に関し、特
に、表面実装構造プリント配線板ユニ・ントの挿入実装
型部品のはんだ付け方法に関する。The present invention relates to a method for soldering insertion-mounted components, and particularly to a method for soldering insertion-mounted components of a surface-mounted printed wiring board unit.
従来、プリント配線板の両面に表面実装型部品を実装す
るとともに、挿入実装型部品を実装する場合、例えば第
３図あるいは第４図に示すように挿入実装型部品は浸漬
方式、特に、はんだ噴流に浸漬するフロ一方式が採用さ
れている。Conventionally, when surface-mounting type components are mounted on both sides of a printed wiring board and insertion-mounting type components are being mounted, the insertion-mounting type components are mounted using the immersion method, especially the solder jet method, as shown in Fig. 3 or 4, for example. A one-flow system is used, in which the water is immersed in water.
すなわち、第３図に示す方法では、プリント配線板の挿
入実装型部品のリード先端が突き出る側の面、すなわち
、はんだ面のソフトプリント等はんだ付けを必要とする
箇所にソルダークリームを印刷しくａ）、はんだ面に表
面実装型部品を仮固定するための接着剤を印刷しくｂ）
、はんだ面の表面実装型部品を搭載した後（Ｃ）、硬化
炉内で例えば紫外線照射と加熱とにより接着剤を硬化さ
せてはんだ面に表面実装型部品が仮固定される（ｄ）。That is, in the method shown in Fig. 3, solder cream is printed on the side of the printed wiring board from which the lead tips of the insertion-mounted components protrude, that is, on the solder surface where soldering is required, such as soft printing.a) , print adhesive to temporarily fix surface mount type components on the solder surface b)
After mounting the surface mount type component on the solder surface (C), the adhesive is cured by, for example, ultraviolet irradiation and heating in a curing furnace, and the surface mount type component is temporarily fixed on the solder surface (d).
この後、プリント配線板を反転させて（ｅ）、プリント
配線板の挿入実装型部品のバ・ンケージ本体が位置する
側の面、すなわち、実装面のワットプリント等にソルダ
ークリームを印刷しくｆ）、実装面の表面実装型部品を
搭載しくｇ）、実装面とはんだ面との表面実装型部品を
リフロー方式、例えば気相はんだ付け方式（Ｖ Ｐ Ｓ
方式）によってはんだ付けする（ｈ）。挿入実装型部品
は、この後、プリント配線板に挿入され（ｉ）、フロ一
方式によってはんだ付けされる（ｊ）。After this, turn the printed wiring board over (e) and print solder cream on the side of the printed wiring board where the bunkage body of the insertion-mounted component is located, that is, on the mounting surface, etc. f) , mounting surface mount type components on the mounting surfaceg), surface mount type components on the mounting surface and solder surface using a reflow method, for example, vapor phase soldering method (VPS).
(h). The insertion-mounted component is then inserted into a printed wiring board (i) and soldered using a flow method (j).
また、第４図に示す方法では、プリント配線板の実装面
の必要な箇所にソルダークリームを印刷しくａ）、実装
面の表面実装型部品を搭載しくｂ）、リフロー方式、例
えば気相はんだ付け方式（ＶＰＳ方式）によって実装面
の表面実装型部品２ａをはんだ付けする（Ｃ）。この後
、プリント配線板を反転させ（ｄ）、プリント配線板の
はんだ面にソルダークリームを印刷しくｅ）、はんだ面
に表面実装型部品を仮固定するための接着剤を印刷しく
ｆ）、はんだ面の表面実装型部品を搭載した後（ｇ）、
硬化炉内で例えば紫外線照射と加熱とにより接着剤を硬
化させてはんだ面の表面実装型部品が仮固定される（ｈ
）、挿入実装型部品は、更にこの後、プリント配線板を
再反転させてから（ｉ）、プリント配線板に挿入される
（ｊ）、最後に、フロ一方式によってはんだ面の表面実
装型部品と挿入実装型部品とがはんだ付けされる（ｋ）
。In addition, in the method shown in Fig. 4, a) solder cream is printed on the required locations on the mounting surface of the printed wiring board, and surface-mounted components are mounted on the mounting surface b), using a reflow method, such as vapor phase soldering. The surface mount type component 2a on the mounting surface is soldered using the VPS method (C). After this, turn the printed wiring board over (d), print solder cream on the solder side of the printed wiring board e), print adhesive for temporarily fixing the surface mount type component on the solder side f), and solder. After mounting surface-mounted components on the surface (g),
The adhesive is cured in a curing oven by, for example, ultraviolet irradiation and heating, and the surface mount type component on the solder side is temporarily fixed (h
), the insertion mount type component is then inserted into the printed wiring board (i) after re-inverting the printed wiring board (j), and finally, the surface mount type component on the solder side is inserted into the printed wiring board by a flow method. and the insertion-mounted component are soldered (k)
.
なお、これらの方法において、はんだ面へのソルダーク
リームの印刷は省略されることがある。Note that in these methods, printing of solder cream on the solder surface may be omitted.
このように挿入実装型部品に対して浸漬方式、特にフロ
一方式が採用される理由は、主として、品質のばらつき
が少なく、かつ、大量生産に適した同時多点接合ができ
ることにある。The reason why the immersion method, especially the flow one method, is adopted for insertion-mounted parts is mainly because there is little variation in quality and simultaneous multi-point bonding is possible, which is suitable for mass production.
しかしながら、電子機器の高速化や多機能化が急激に進
められ、表面実装型部品の端子あるいはリードの狭ピッ
チ化が進められるにつれて、フロ一方式に代表される浸
漬方式のはんだ付けでは例えばリードあるいは端子の配
列ピッチが０．２ｍ程度以下の狭ピツチ表面実装型部品
のショートが多発し、はんだ面に狭ピツチ表面実装型部
品を配置できないことが分かった。However, as electronic devices rapidly become faster and more multi-functional, and as the pitch of terminals or leads of surface-mounted components becomes narrower, immersion soldering, typified by flow-type soldering, It has been found that short-circuits occur frequently in narrow-pitch surface mount type components where the terminal arrangement pitch is approximately 0.2 m or less, and that narrow-pitch surface mount type components cannot be placed on the solder surface.
また、フロ一方式の場合には、はんだ噴流によってはん
だ面の表面実装型部品の位置ずれや脱落が生じないよう
に接着剤で表面実装型部品をプリント配線板に固定する
必要があり、この接着剤がソルダークリームに混入して
はんだ接続不良または、はんだ未着不良を発生させたり
、プリント配線板の表面に玉状になって付着してプリン
ト配線板の表面を汚染するという問題がある。In addition, in the case of the flow type, it is necessary to fix the surface mount type components to the printed wiring board with adhesive to prevent the solder side of the surface mount type components from shifting or falling off due to the solder jet. There are problems in that the agent mixes into the solder cream and causes poor solder connections or non-solder connections, or adheres to the surface of the printed wiring board in the form of beads, contaminating the surface of the printed wiring board.
本発明は、上記の事情を鑑みてなされたものであり、い
わゆるはんだ面に狭ピンチ表面実装型部品を配置できる
とともに、はんだ面の表面実装型部品を接着剤で仮固定
せずに済むようにした挿入実装型部品のはんだ付け方法
を提供することを目的とする。The present invention has been made in view of the above-mentioned circumstances, and allows narrow-pinch surface mount type components to be placed on the so-called solder surface, and also eliminates the need to temporarily fix the surface mount type components on the solder surface with adhesive. The purpose of the present invention is to provide a method for soldering insertion-mounted components.
本発明は、例えば第１図に示すように挿入実装型部品４
をプリント配線板１に実装する挿入実装型部品のはんだ
付け方法において、挿入実装型部品４のリード４ａにソ
ルダーバンプ３を形成した後、プリント配線板１に搭載
し、リフロー方式により前記ソルダーバンプ３を溶解さ
せて挿入実装型部品４をはんだ付けすることを特徴とし
ている。For example, as shown in FIG.
In a method of soldering an insertion mount type component to a printed wiring board 1, after forming solder bumps 3 on the leads 4a of the insertion mount type component 4, the solder bump 3 is mounted on the printed wiring board 1, and the solder bumps 3 are soldered by a reflow method. The method is characterized in that the insertion mounting type component 4 is soldered by melting it.
この発明を挿入実装型部品４と表面実装型部品２ａ・２
ｂとをプリント配線板１に実装する表面実装構造プリン
ト配線板ユニットに適用する場合には、挿入実装型部品
４のリード４ａにはん・だ３Ｃあるいはソルダークリー
ム３ｄよりなるソルダーバンプ３を保持させた後、プリ
ント配線板１に搭載し、実装面１ａあるいははんだ面１
ｂもしくは実装・はんだ両面１ａ・１ｂの表面実装型部
品２ａ・２ｂのリフロー方式はんだ付けと同時に前記は
んだ３Ｃあるいはソルダークリーム３ｄを溶解させて挿
入実装型部品４をリフロー方式によりはんだ付けすると
いう構成にする。This invention can be applied to insertion mounting type components 4 and surface mount type components 2a and 2.
When applying the above to a surface-mounted printed wiring board unit mounted on a printed wiring board 1, the leads 4a of the insertion-mounted component 4 are held with solder bumps 3 made of solder 3C or solder cream 3d. After that, it is mounted on a printed wiring board 1, and the mounting surface 1a or solder surface 1 is
b or mounting/soldering At the same time as the reflow soldering of the surface mount type components 2a and 2b on both sides 1a and 1b, the solder 3C or solder cream 3d is melted and the insertion mount type component 4 is soldered by the reflow method. do.
本発明においては、挿入実装型部品４のリード４ａには
んだ、あるいはソルダークリームによるソルダーバンプ
３が形成されているので、該ソルダーバンプ３のリフロ
ーによりスルーホール１ｃにはんだが流れ込んで挿入実
装型部品４は固着される。In the present invention, since the solder bumps 3 made of solder or solder cream are formed on the leads 4a of the insertion mount type component 4, the reflow of the solder bumps 3 causes the solder to flow into the through hole 1c, and the solder bump 3 is formed on the lead 4a of the insertion mount type component 4. is fixed.
以下、本発明の一実施例に係る表面実装構造プリント配
線板ユニ・ノドの製造方法を第１図に基づき説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a surface-mounted printed wiring board uni-nod according to an embodiment of the present invention will be described below with reference to FIG.
まず、はんだ面１ｂの所定の位置にソルダークリーム３
ｂを印刷しくａ）、はんだ面１ｂの表面実装型部品２ｂ
を搭載する（ｂ）。この後、リフロー方式ではんだ面ｉ
ｂの表面実装型部品２ｂをはんだ付けしくＣ）、プリン
ト配線板１を反転させる（ｄ）。次に、実装面１ａにソ
ルダークリーム３ａを印刷しくｅ）、実装面１ａの表面
実装型部品２ａを搭載する（ｆ）。First, apply solder cream 3 to a predetermined position on the solder surface 1b.
Print b) a), surface mount type component 2b on solder side 1b
(b). After this, the solder surface i is soldered using the reflow method.
Solder the surface mount type component 2b in b) and turn the printed wiring board 1 over (d). Next, solder cream 3a is printed on the mounting surface 1a (e), and the surface mount type component 2a is mounted on the mounting surface 1a (f).
一方、挿入実装型部品４を溶融はんだに浸漬させて、そ
のリード４ａにはんだ３Ｃを保持させてソルダーバンプ
３を形成した後（ｇ）、プリント配線板１に挿入実装型
部品４を挿入する（ｈ）。On the other hand, after immersing the insertion mount type component 4 in molten solder and holding the solder 3C on the leads 4a to form solder bumps 3 (g), the insertion mount type component 4 is inserted into the printed wiring board 1 ( h).
前記リード４ａは、はんだ３ｃの保持量を多くするため
、その一部分を広幅に形成し、この広幅部分を第２図（
ａ）に示すように、断面形状が山型に屈曲させた形状や
、同図（ｂ）に示すような弧状に曲げた形状に形成する
ことが可能である。In order to increase the amount of solder 3c held, a portion of the lead 4a is formed wide, and this wide portion is shown in FIG.
It is possible to form the cross-sectional shape into a bent mountain shape as shown in a) or an arc-shaped cross-sectional shape as shown in FIG.
また、リード４ａの先端は、スルーホールへの突入を容
易にするため、針状に細くしである。Further, the tip of the lead 4a is tapered into a needle shape to facilitate entry into the through hole.
実装面１ａの表面実装型部品２ａの搭載（ｆ）と挿入実
装型部品４の挿入（ｈ）との順序は逆であってもよいが
、これら実装面１ａの表面実装型部品２ａの搭載（ｆ）
と挿入実装型部品４の挿入（ｈ）とが終わった後に、こ
れら実装面１ａの表面実装型部品２ａと挿入実装型部品
４とをリフロー方式によってはんだ付けする（ｉ）。Although the order of mounting (f) of the surface mount type component 2a on the mounting surface 1a and insertion of the insertion mount type component 4 (h) may be reversed, the mounting of the surface mount type component 2a on the mounting surface 1a ( f)
After the insertion of the insertion mount type component 4 (h), the surface mount type component 2a on the mounting surface 1a and the insertion mount type component 4 are soldered by a reflow method (i).
ここで、挿入実装型部品４のリード４ａに付着させたは
んだ３Ｃはリフロー方式のはんだ付け工程において、溶
解してリード４ａを伝ってスルーホールＩＣに流入する
。Here, the solder 3C attached to the leads 4a of the insertion-mounted component 4 melts during the reflow soldering process and flows along the leads 4a into the through-hole IC.
この表面実装構造プリント配線板ユニ７）の製造方法で
は、表面実装型部品２ａ・２ｂ及び挿入実装型部品４の
はんだ付けがともにリフロー方式であるので、はんだ面
１ｂの表面実装型部品２ｂが溶解したはんだの流れにさ
らされることはなく、はんだ面１ｂの表面実装型部品２
ｂのリードあるいは端子の間にはんだ噴流が付着するお
それがなくなり、このはんだ噴流の付着によるショート
が発生するおそれもなくなる。従って、狭ピツチ表面実
装型部品をはんだ面１ｂに自由に配置して、プリント配
線板ユニットの回路を一層高密度にすることができる。In this manufacturing method of the surface mount structure printed wiring board UNI 7), since both the surface mount type components 2a and 2b and the insertion mount type component 4 are soldered by the reflow method, the surface mount type component 2b on the solder surface 1b is melted. The surface mount component 2 on the solder side 1b is not exposed to the flow of solder.
There is no possibility that the solder jet will adhere between the leads or terminals of b, and there is no possibility that a short circuit will occur due to the adhesion of the solder jet. Therefore, narrow pitch surface mount type components can be freely arranged on the solder surface 1b, and the circuit density of the printed wiring board unit can be further increased.
また、はんだ面１ｂの表面実装型部品２ｂがはんだ噴流
によって動かされるおそれもな（なるので、接着剤によ
って表面実装型部品２ｂをはんだ面１ｂに仮固定する必
要が無くなり、接着剤印刷の工程と接着剤の硬化工程と
を省略してコストダウンを図れるとともに、接着剤がソ
ルダークリーム３ａ・３ｂに混入してはんだ接続不良ま
たは、はんだ未着不良が生じることやプリント配線板１
の表面が接着剤で汚染されることを防止できる。In addition, there is no risk that the surface mount type component 2b on the solder surface 1b will be moved by the solder jet (therefore, there is no need to temporarily fix the surface mount type component 2b on the solder surface 1b with adhesive, and the adhesive printing process It is possible to reduce costs by omitting the curing process of the adhesive, and it also prevents the adhesive from getting mixed into the solder cream 3a and 3b, resulting in poor solder connection or non-solder bonding, and prevents the printed wiring board 1.
This prevents the surface from being contaminated with adhesive.
上記の一実施例では挿入実装型部品４のはんだ付けと実
装面１ａの表面実装型部品２ａのはんだ付けとが同時に
行われているが、はんだ面１ｂの表面実装型部品２ｂの
はんだ付けと挿入実装型部品４のはんだ付けとを同時に
することや、実装・はんだ両面１ａ・１ｂの表面実装型
部品２ａ・２ｂのはんだ付けと挿入実装型部品４のはん
だ付けとを同時にすることも可能である。ただし、これ
らの場合、下側になる実装面１ａあるいははんだ面１ｂ
の部品の落下を防止するため、その下側に適当な治具を
あてがうことが必要になる。In the above embodiment, soldering of the insertion mount type component 4 and soldering of the surface mount type component 2a on the mounting surface 1a are performed simultaneously, but soldering and insertion of the surface mount type component 2b on the soldering surface 1b are performed simultaneously. It is also possible to simultaneously solder the mount type components 4, or to simultaneously solder the surface mount type components 2a and 2b of the mounting/soldering surfaces 1a and 1b and solder the insertion mount type component 4. . However, in these cases, the lower mounting surface 1a or solder surface 1b
In order to prevent the parts from falling, it is necessary to place an appropriate jig under them.
また、挿入実装型部品４のリード４ａには、はんだ３Ｃ
に代えて、例えば第１図（ｇ′）に示すようにソルダー
クリーム４ｄを付着させ、ソルダーバンプ３を形成して
もよい。この場合、ソルダークリーム４ｄは例えば手を
使ってリード４ａに付着させればよい。In addition, solder 3C is applied to the lead 4a of the insertion mounting type component 4.
Alternatively, solder bumps 3 may be formed by applying solder cream 4d, for example, as shown in FIG. 1(g'). In this case, the solder cream 4d may be applied to the leads 4a using, for example, hands.
以上表面実装構造のプリント配線板ユニットについての
み説明したが、この発明は挿入実装部品のみよりなるプ
リント配線板ユニットにも適用出来ることはもちろんで
ある。Although only a printed wiring board unit having a surface mount structure has been described above, the present invention can of course be applied to a printed wiring board unit consisting only of insert-mounted parts.
以上のように、本発明の挿入実装型部品はんだ付け方法
によれば、挿入実装型部品及び表面実装型部品がともに
リフロー方式ではんだ付けされるので、いわゆる、はん
だ面の表面実装型部品がはんだ噴流にさらされるおそれ
がなくなる。その結果、表面実装型部品のリードあるい
は端子間へのはんだ噴流の付着によるショートが発生す
るおそれがなくなるので、狭ピツチ表面実装型部品を自
由にはんだ面に配置することができ、プリント配線板ユ
ニットの回路を一層高密度化することができる。As described above, according to the insertion mount type component soldering method of the present invention, both the insertion mount type component and the surface mount type component are soldered by the reflow method, so that the so-called surface mount type component on the solder side is soldered. There is no risk of being exposed to jets. As a result, there is no risk of short circuits caused by adhesion of solder jets between the leads or terminals of surface mount components, allowing narrow pitch surface mount components to be freely placed on the solder surface, and printed wiring board units. circuits can be made even more dense.
また、はんだ面の表面実装型部品がはんだ噴流によって
動かされるおそれがないので、はんだ面の表面実装型部
品を接着剤で仮固定する必要がなくなり、接着剤の印刷
工程及び硬化工程を省略してコストダウンを図れるとと
にも、接着剤のソルダークリームへの混入による接着不
良や接着剤によるプリント配線板の汚染を防止すること
ができる。In addition, since there is no risk that the surface mount components on the solder side will be moved by the solder jet, there is no need to temporarily fix the surface mount components on the solder surface with adhesive, and the adhesive printing and curing steps can be omitted. In addition to reducing costs, it is also possible to prevent poor adhesion due to the adhesive being mixed into the solder cream and contamination of the printed wiring board due to the adhesive.
（ａ）及び（ｂ）はそれぞれ異なる挿入実装型部品のリ
ードの斜視図であり、第３図、第４図はそれぞれ異なる
従来の表面実装構造プリント配線板ユニットの挿入実装
型部品はんだ付け方法の手順を示すフロー図である。(a) and (b) are perspective views of leads of different insertion mount type components, and FIGS. 3 and 4 are respectively different methods of soldering insertion mount type components of conventional surface mount structure printed wiring board units. It is a flow diagram showing a procedure.
図中、 １・・・プリント配線板、 １ａ・・・実装面、 １ｂ・・・はんだ面、 ２ａ・２ｂ・・・表面実装型部品、 ３・・・ソルダーバンプ、 ３Ｃ・・・はんだ、 ３ｄ・・・ソルダークリーム、 ４・・・挿入実装型部品、In the figure, 1...Printed wiring board, 1a... mounting surface, 1b...Solder surface, 2a/2b...Surface mount type parts, 3...Solder bump, 3C...Solder, 3d...Solder cream, 4...insertion mounting type parts,
第１図は本発明の一実施例に係る表面実装構造プリント
配線板ユニットの挿入実装型部品はんだ付け方法の手順
を示すフロー図であり、第２図（ａ）
（ｂ）
〕−ドの銅萄晃図
第
図
従来例のフロー図
第
図FIG. 1 is a flowchart showing the steps of a method for soldering insertion-mounted components of a surface-mounted printed wiring board unit according to an embodiment of the present invention, and FIG. Flow diagram of conventional example
Claims (1)
実装する挿入実装型部品のはんだ付け方法において、 挿入実装型部品（４）のリード（４ａ）にソルダーバン
プ（３）を形成した後、プリント配線板（１）に搭載し
、リフロー方式により前記ソルダーバンプ（３）を溶解
させて挿入実装型部品（４）をはんだ付けすることを特
徴とする、挿入実装型部品のはんだ付け方法。 〔２〕挿入実装型部品（４）と表面実装型部品（２ａ）
・（２ｂ）とをプリント配線板（１）に実装する表面実
装構造プリント配線板ユニットに対する挿入実装型部品
のはんだ付け方法において、 挿入実装型部品（４）のリード（４ａ）にソルダーバン
プ（３）を形成した後、プリント配線板（１）に搭載し
、 実装面（１ａ）あるいははんだ面（１ｂ）もしくは実装
・はんだ両面（１ａ）・（１ｂ）の表面実装型部品（２
ａ）・（２ｂ）のリフロー方式はんだ付けと同時にリフ
ロー方式により前記ソルダーバンプ（３）を溶解させて
挿入実装型部品（４）をはんだ付けすることを特徴とす
る、挿入実装型部品のはんだ付け方法。 〔３〕上記ソルダーバンプ（３）が挿入実装型部品（４
）のリード（４ａ）の断面形状を屈曲形状ないし弧形状
に形成し、浸漬方式によりリード（４ａ）に溶融はんだ
（３ｃ）を付着させた請求項１又は２に記載の挿入実装
型部品のはんだ付け方法。[Scope of Claims] [1] A method for soldering an insertion mount type component (4) on a printed wiring board (1), comprising the steps of: soldering a lead (4a) of the insertion mount type component (4); After the bumps (3) are formed, the solder bumps (3) are melted by a reflow method, and the insertion mount type component (4) is soldered. How to solder mounted components. [2] Insertion mount type component (4) and surface mount type component (2a)
・In a method for soldering an insertion mount type component to a surface mount structure printed wiring board unit in which (2b) is mounted on a printed wiring board (1), a solder bump (3) is attached to the lead (4a) of the insertion mount type component (4). ), it is mounted on a printed wiring board (1), and the surface mount type component (2) is mounted on the mounting surface (1a) or solder surface (1b) or on both mounting and soldering surfaces (1a) and (1b).
Soldering of insertion mount type components, characterized in that the solder bumps (3) are melted by the reflow method and the insertion mount type components (4) are soldered at the same time as the reflow soldering of a) and (2b). Method. [3] The above solder bump (3) is an insertion mount type component (4
3. The solder for the insertion mount type component according to claim 1 or 2, wherein the cross-sectional shape of the lead (4a) is formed into a bent shape or an arc shape, and the molten solder (3c) is attached to the lead (4a) by a dipping method. How to attach.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22210790A JPH04103193A (en) | 1990-08-22 | 1990-08-22 | Soldering method of insertion mounting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22210790A JPH04103193A (en) | 1990-08-22 | 1990-08-22 | Soldering method of insertion mounting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04103193A true JPH04103193A (en) | 1992-04-06 |
Family
ID=16777253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22210790A Pending JPH04103193A (en) | 1990-08-22 | 1990-08-22 | Soldering method of insertion mounting component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04103193A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012256954A (en) * | 2012-10-02 | 2012-12-27 | Mitsubishi Electric Corp | Electronic control system |
-
1990
- 1990-08-22 JP JP22210790A patent/JPH04103193A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012256954A (en) * | 2012-10-02 | 2012-12-27 | Mitsubishi Electric Corp | Electronic control system |
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