JPH0680759B2 - Chip-on-board lead pin - Google Patents
Chip-on-board lead pinInfo
- Publication number
- JPH0680759B2 JPH0680759B2 JP60232981A JP23298185A JPH0680759B2 JP H0680759 B2 JPH0680759 B2 JP H0680759B2 JP 60232981 A JP60232981 A JP 60232981A JP 23298185 A JP23298185 A JP 23298185A JP H0680759 B2 JPH0680759 B2 JP H0680759B2
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- hole portion
- board
- hole
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は例えばプリント配線基板等に設けられた外部引
出用のリードピンに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of use) The present invention relates to a lead pin for external drawing provided on, for example, a printed wiring board or the like.
（従来の技術とその問題点） 従来、この種のチップオンボード（以下ボードとい
う。）に対するリードピンは、上端に円形状の頭部を有
するものと、リードピンの脚杆部の中途部に円形状の鍔
部を有するものとがある。(Prior art and its problems) Conventionally, a lead pin for this type of chip-on-board (hereinafter referred to as a board) has a circular head at the upper end and a circular shape in the middle of the leg rod part of the lead pin. Some have a collar part.
この脚杆部の中途部に円形状の鍔部を有するリードピン
の固定は、第７図に示す様にボード（Ａ′）に穿設した
取付孔（１′ａ）内面に銅，金，ニッケルメッキ等のメ
ッキ（１′ｂ）を施して形成されたスルホール部
（１′）に、該スルホール部（１′）の内径よりも小径
な脚杆部（２′）の上部にスルホール部（１′）の内面
と密接合して仮止めをするための楕円形状に圧潰した当
接部（５）側から、ボード（Ａ′）のスルホール部
（１′）下側よりかしめ等の嵌挿手段により嵌挿し、リ
ードピン（Ｂ′）の上部周縁及び鍔部（４′）周縁を夫
々別々の作業でボード（Ａ′）に半田付けして固着して
いた。As shown in FIG. 7, the fixing of the lead pin having a circular flange in the middle of the leg rod is performed by attaching copper, gold or nickel to the inner surface of the mounting hole (1'a) formed in the board (A '). The through hole portion (1 ') formed by plating (1'b) such as plating is formed on the upper part of the leg rod portion (2') having a diameter smaller than the inner diameter of the through hole portion (1 '). ′) From the side of the contact portion (5) crushed into an elliptical shape for the purpose of temporary joining by tightly joining with the inner surface of ′), from the lower side of the through hole portion (1 ′) of the board (A ′), a fitting means such as caulking. The lead pin (B ') and the flange portion (4') are fixed by soldering to the board (A ') by separate operations.
ところが、これらの固着方法は夫々別々の２工程作業で
固着するため、作業性が劣ると共に上部周縁の半田
（ｍ）に鬆等（m1）が発生し、固着不良のためリードピ
ン（Ｂ′）が離脱するおそれがあった。However, since these fixing methods are performed in separate two-step operations, workability is poor, and voids (m 1 ) are generated in the solder (m) around the upper edge, and lead pins (B ′) are caused due to defective adhesion. There was a risk of leaving.
（発明が解決しようとるする技術的課題） 以上の問題を解決するための本発明の技術的課題は、ボ
ードのスルホール部にリードピンを固定する際に、その
固着作業を能率的にすると共にリードピンを該スルホー
ル部に確実に固着することである。(Technical problem to be solved by the invention) A technical problem to be solved by the present invention for solving the above problems is to make the fixing work efficient and fix the lead pin when fixing the lead pin to the through hole portion of the board. It is to be firmly fixed to the through hole portion.
（技術的課題を達成するための技術的手段） 以上の技術的課題を達成するための本発明の技術的手段
は、脚杆部の上端側に、チップオンボードのスルホール
部内周への当接係合部を形成すると共に、該当接係合部
の下部近辺に、前記スルホール部の内径よりも大径な鍔
部を有し、前記当接係合部をスルホール部内に挿入し、
且つ前記鍔部をスルホール部の開口部に当接せしめた状
態でスルホール部に対して半田付するリードピンであっ
て、上記鍔部に、スルホール部内へ半田液を通す連絡路
を開穿したことを特徴とする。(Technical Means for Achieving the Technical Problem) The technical means of the present invention for achieving the above technical problem is that the upper end side of the leg rod is brought into contact with the inner circumference of the through hole of the chip-on-board. While forming the engaging portion, in the vicinity of the lower portion of the corresponding contact engaging portion, has a collar portion having a diameter larger than the inner diameter of the through hole portion, and inserting the contact engaging portion into the through hole portion,
A lead pin which is soldered to the through hole portion in a state where the flange portion is brought into contact with the opening portion of the through hole portion, wherein a connection path for passing a solder liquid into the through hole portion is opened in the collar portion. Characterize.
（作用） 而して上記構成によれば、ボードの下面側を半田液中に
浸漬することにより、半田液がスルホール部とリードピ
ンとの間隙に生じる毛細管現象で鍔部の連通路を介して
該間隙内を上昇して充填され、リードピンの上部周縁及
び鍔部周縁を被覆してスルホール部に固着する。(Operation) Therefore, according to the above configuration, when the lower surface side of the board is dipped in the solder liquid, the solder liquid is capillarity generated in the gap between the through hole portion and the lead pin, and the solder liquid flows through the communication path of the collar portion. It fills by rising in the gap, covering the upper peripheral edge of the lead pin and the peripheral edge of the flange portion, and fixing the lead pin to the through hole portion.
（発明の効果） 本発明は以上の様な構成にしたことにより下記の効果を
有する。(Effects of the Invention) The present invention has the following effects by having the above-mentioned configuration.
鍔部の連通路を介して半田がスルホール部とリード
ピンとの間隙に生じる毛細管現象により該間隙に上げら
れてくまなく充填されるので、その接着部における鬆等
の発生を防止することができると共に、リードピンの上
部周縁及び鍔部周縁が基板に半田付けされるのでスルホ
ール部に確実に固着することができる。Since the solder is raised through the communication passage of the flange portion to fill the gap between the through hole portion and the lead pin due to the capillary phenomenon, it is possible to prevent the generation of voids and the like in the adhesive portion. Since the upper peripheral edge and the brim peripheral edge of the lead pin are soldered to the substrate, the lead pin can be securely fixed to the through hole portion.
一工程でリードピンをスルホール部に固着すること
ができるので作業能率の向上を図ることができる。Since the lead pin can be fixed to the through hole portion in one step, the work efficiency can be improved.
（実施例） 以下、本発明の一実施例を図面により説明する。Embodiment An embodiment of the present invention will be described below with reference to the drawings.
（Ａ）はプラスチック，ガラス等のボード、（Ｂ）はボ
ード（Ａ）のスルホール部（１）に圧入し半田付けする
リードピンである。(A) is a board made of plastic, glass or the like, and (B) is a lead pin which is press-fitted into the through hole portion (1) of the board (A) and soldered.
ボードにおけるスルホール部（１）はボード（Ａ）に平
面形状が円形の取付孔（1a）を貫通開穿し、その取付孔
（1a）の内面に導電性の高い銅メッキ，金メッキ，ニッ
ケルメッキ等のメッキ（1b）を施して形成されている。The through hole portion (1) of the board is formed by penetrating the board (A) through the mounting hole (1a) having a circular planar shape, and the inner surface of the mounting hole (1a) is highly conductive copper plating, gold plating, nickel plating, etc. It is formed by plating (1b).
リードピン（Ｂ）は鉄とニッケルの合金を素材とし、表
面に錫メッキを施したものでボード（Ａ）のスルホール
部（１）の内径よりも小径な脚杆部（２）の上端側、即
ちスルホール部（１）内に挿入する部分は圧潰してスル
ホール部（１）と略同径の幅寸法を備えた当接係合部
（2b）を形成すると共に、その当接係合部（2b）の下部
近辺には、スルホール部（１）の内径よりも大径な円板
状の鍔部（３）を形成し、脚杆部（２）上端側をボード
（Ａ）下面側からスルホール部（１）内に圧入して当接
係合部（2b）をスルホール部（１）内周に当接係合せし
め、且つ鍔部（３）をスルホール部（１）の下側開口部
（2a）に当接せしめるをもってスルホール部（１）に対
して仮止めし得るように構成する。尚、上記脚杆部
（２）の長さは、その上端側をスルホール部（１）内に
挿入した状態でボード（Ａ）の下面から下方に適宜長さ
突出する長さとする。The lead pin (B) is made of an alloy of iron and nickel, the surface of which is tin-plated. The upper end of the rod (2), which has a diameter smaller than the inner diameter of the through hole (1) of the board (A), that is, The portion to be inserted into the through hole portion (1) is crushed to form a contact engagement portion (2b) having a width dimension substantially the same as that of the through hole portion (1), and the contact engagement portion (2b). ) Has a disk-shaped collar portion (3) having a diameter larger than the inner diameter of the through hole portion (1), and the upper end of the leg rod portion (2) extends from the lower surface side of the board (A) to the through hole portion. (1) is press-fitted into (1) so that the contact engagement portion (2b) is brought into contact with and engaged with the inner periphery of the through hole portion (1), and the flange portion (3) is provided at the lower opening portion (2a) of the through hole portion (1). ) So that it can be temporarily fixed to the through hole portion (1). The length of the leg rod portion (2) is set so as to appropriately protrude downward from the lower surface of the board (A) with the upper end side inserted into the through hole portion (1).
また、リードピン（Ｂ）における鍔部（３）には、スル
ホール部（１）に連通する連通路（４）が開穿され、該
連通路（４）は第２図及び第４図に示す様に該鍔部
（３）の外周から内周に向って一文字の凹溝（3a）を設
けたものの他、第５図に示す適宜間隔ごとに複数の長溝
孔（3b）を開穿したもの及び適宜大きさの通孔（3c）を
多数設けたもの等があり、ボード（Ａ）を半田液に浸漬
した際に、該半田がこれらの連通路（４）を介してスル
ホール部（１）に通されるものである。Further, a communication passage (4) communicating with the through hole portion (1) is opened in the collar portion (3) of the lead pin (B), and the communication passage (4) is as shown in FIGS. 2 and 4. In addition to a groove (3a) of one character provided from the outer circumference to the inner circumference of the collar portion (3), a plurality of long groove holes (3b) opened at appropriate intervals shown in FIG. For example, there are those provided with a large number of through holes (3c) of an appropriate size, and when the board (A) is immersed in the solder liquid, the solder is passed through these communication passages (4) to the through hole portion (1). It is passed on.
また、これら連通路（４）は上記のものだけに限らず、
スルホール部（１）内に半田を通すことが可能なもので
あれば十文字及び放射状の凹溝を設けることも任意であ
る。Further, these communication passages (4) are not limited to the above,
It is optional to provide cross-shaped and radial concave grooves as long as solder can be passed through the through-hole portion (1).
次に、ボード（Ａ）にリードピン（Ｂ）に固着する手順
について説明すると、先ずボード（Ａ）のスルホール部
（１）に前述の如く脚杆部（２）上端側をボード（Ａ）
下面側から挿入（圧入）し、且つ鍔部（３）をスルホー
ル部（１）の下側開口部（2a）に当接せしめるをもっ
て、スルホール部（１）に対してリードピン（Ｂ）を仮
止めし、しかる後ボード（Ａ）の下側面を半田液（ｎ）
に浸漬する。Next, the procedure for fixing the lead pin (B) to the board (A) will be described. First, as described above, the upper end of the leg rod (2) is attached to the through hole (1) of the board (A).
Insert (press fit) from the lower surface side and bring the flange (3) into contact with the lower opening (2a) of the through hole (1), and temporarily fix the lead pin (B) to the through hole (1). Then, the lower surface of the board (A) is soldered (n)
Soak in.
半田液（ｎ）としては、例えば４−６半田（鉛４に対し
錫６の割合で混合した半田）を230℃の温度に溶解し、
これに30秒間浸漬する。As the solder liquid (n), for example, 4-6 solder (solder mixed with tin 4 to lead 4) is melted at a temperature of 230 ° C.,
Soak it for 30 seconds.
このように、半田液（ｎ）に浸漬することにより該半田
液（ｎ）はスルホール部（１）の内面とリードピン
（Ｂ）との間に生じる毛細管現象で連通路（４）を介し
てスルホール部（１）とリードピン（Ｂ）との間隙を上
昇してスルホール部（１）の上側開口部（2c）からボー
ド（Ａ）上面に流出したリードピン（Ｂ）の上部を被覆
して半円形状の頭部を形成すると共に鍔部周縁をも被覆
して基板（Ａ）にリードピン（Ｂ）が半田付けされるこ
とになる。As described above, when the solder solution (n) is immersed in the solder solution (n), the solder solution (n) passes through the communication passage (4) by a capillary phenomenon generated between the inner surface of the through hole portion (1) and the lead pin (B). A semi-circular shape that covers the upper part of the lead pin (B) that has flowed from the upper opening (2c) of the through hole part (1) to the upper surface of the board (A) by rising the gap between the part (1) and the lead pin (B). The lead pin (B) is soldered to the substrate (A) while forming the head portion of the substrate and also covering the periphery of the flange portion.
第１図は本発明のリードピンをスルホール部に挿入した
状態の断面図、第２図，第３図は同半田液に浸漬した状
態の断面図、第４図は第２図のIV−IV線断面図、第５
図，第６図は鍔部の他の実施例を示す断面図、第７図は
従来例を示す断面図である。 尚、図中 （Ａ）……回路基板本体、（Ｂ）……リードピン （１）……スルホール部、（３）……鍔部 （４）……連通路 を夫々示す。FIG. 1 is a cross-sectional view of the lead pin of the present invention inserted in a through hole portion, FIGS. 2 and 3 are cross-sectional views of the same immersed in the same solder solution, and FIG. 4 is a IV-IV line of FIG. Sectional view, fifth
6 and 6 are sectional views showing another embodiment of the collar portion, and FIG. 7 is a sectional view showing a conventional example. In the figure, (A) ... Circuit board main body, (B) ... Lead pin (1) ... Through hole portion, (3) ... Collar portion (4).
Claims (1)
ルホール部内周への当接係合部を形成すると共に、該当
接係合部の下部近辺に、前記スルホール部の内径よりも
大径な鍔部を有し、前記当接係合部をスルホール部内に
挿入し、且つ前記鍔部をスルホール部の開口部に当接せ
しめた状態でスルホール部に対して半田付するリードピ
ンであって、上記鍔部に、スルホール部内へ半田液を通
す連通路を開穿したことを特徴とするチップオンボード
のリードピン。1. A tip-on-board contact-engaging portion with an inner circumference of a through-hole portion is formed on the upper end side of the leg rod portion, and a diameter larger than an inner diameter of the through-hole portion is provided near a lower portion of the contact-engaging portion. A lead pin having a large diameter collar portion, the contact engagement portion being inserted into the through hole portion, and being soldered to the through hole portion while the collar portion is in contact with the opening portion of the through hole portion. A chip-on-board lead pin, characterized in that a communication passage for passing a solder solution into the through hole portion is opened in the flange portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60232981A JPH0680759B2 (en) | 1985-10-17 | 1985-10-17 | Chip-on-board lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60232981A JPH0680759B2 (en) | 1985-10-17 | 1985-10-17 | Chip-on-board lead pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6292353A JPS6292353A (en) | 1987-04-27 |
| JPH0680759B2 true JPH0680759B2 (en) | 1994-10-12 |
Family
ID=16947921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60232981A Expired - Fee Related JPH0680759B2 (en) | 1985-10-17 | 1985-10-17 | Chip-on-board lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680759B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719874B2 (en) * | 1986-05-31 | 1995-03-06 | イビデン株式会社 | Conductor pin for semiconductor mounting board and manufacturing method thereof |
| JPH0766953B2 (en) * | 1986-09-11 | 1995-07-19 | イビデン株式会社 | Semiconductor mounting board |
| JP2540461B2 (en) * | 1987-05-15 | 1996-10-02 | 新光電気工業株式会社 | Lead mounting structure for electronic component packages |
| JPH0815201B2 (en) * | 1987-05-18 | 1996-02-14 | イビデン株式会社 | Semiconductor mounting board |
| JPH0815200B2 (en) * | 1987-05-18 | 1996-02-14 | イビデン株式会社 | Conductor pins for semiconductor mounting boards |
| KR100775058B1 (en) | 2005-09-29 | 2007-11-08 | 삼성전자주식회사 | Pixel Cell, Image Sensor Adopting The Pixel Cell, and Image Processing System Including The Image Sensor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48104072A (en) * | 1972-04-14 | 1973-12-26 | ||
| JPS5982757A (en) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | Stem for semiconductor and manufacture thereof |
| US4551914A (en) * | 1983-10-05 | 1985-11-12 | Hewlett-Packard Company | Method of making flexible circuit connections |
-
1985
- 1985-10-17 JP JP60232981A patent/JPH0680759B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6292353A (en) | 1987-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4592137A (en) | Method of circuit connection across both surfaces of substrate | |
| JPH11265765A (en) | Connector mounting board and its assembling method | |
| JPH0680759B2 (en) | Chip-on-board lead pin | |
| JP2000114681A (en) | Printed wiring board and its manufacture | |
| JP2717313B2 (en) | Manufacturing method of electronic component mounting board | |
| JPH10335811A (en) | Connection of substrates | |
| JPH11317265A (en) | Mounting structure of printed wiring board | |
| JPH0231985Y2 (en) | ||
| JP2817432B2 (en) | Manufacturing method of electronic component mounting board | |
| JPH1065098A (en) | Composite semiconductor device and manufacture thereof | |
| JPH0223644A (en) | Manufacture of mounting board equipped with conduction pin | |
| JPH10144850A (en) | Connecting pin and mounting method of substrate | |
| JPH05343593A (en) | Connecting terminal | |
| KR100206956B1 (en) | Clga(column land grid array) package | |
| JP2597885B2 (en) | Structure of solder connection part of metal core wiring board | |
| JP2580607B2 (en) | Circuit board and method of manufacturing circuit board | |
| JPS6292352A (en) | Lead pin for chip-on-board | |
| JPS60218900A (en) | Printed circuit board | |
| JPS62158389A (en) | Printed board | |
| JPH0837047A (en) | Pin grid array | |
| JPH0719857B2 (en) | Semiconductor mounting board | |
| JPH02224393A (en) | Method of soldering mixed mounting metal core printed board assembly | |
| JPH11329520A (en) | Electric appliance leading-out part and its connecting method | |
| JP2002260760A (en) | Reed terminal, reed frame, electronic components and mounting method of electronic components | |
| JPS61154101A (en) | Lead mounting of electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |