JP2002260760A - Reed terminal, reed frame, electronic components and mounting method of electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reed terminal equipped with a terminal part to press fit into a board, a reed frame which can mount reed terminals on both sides, on 3 sides or on 4 sides, an electronic component mechanically combining the board with the terminal part, and a mounting method of an electronic component combining the board mechanically with the reed terminal. SOLUTION: A metal plate material is equipped with a reed part and a terminal part, which latter is structured with a terminal piece formed by cutting up the metal plate material from its end side in a longitudinal direction and tongue pieces formed at both sides of the terminal piece.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead terminal, a lead frame provided with the lead terminal, an electronic component using the lead terminal, and a method for assembling an electronic component using the lead frame.

[0002]

2. Description of the Related Art Conventionally, as input / output terminals, for example, press-fit pins, clip terminals and the like are known. FIG.
1 shows a press-fit pin 1. The press-fit pin 1 is provided with a notch 2 so that it can be cut at a predetermined length.

The press-fit pin 1 is press-fit into a hole 4 of a substrate 3 as shown in FIG. FIG. 20 shows the clip terminal 5. The clip terminal 5 includes a clip portion 5 for gripping the substrate 6.
a at the tip.

[0004]

When the press-fit pin 1 is used, as shown in FIG. 19, the hole 4 of the substrate 3 is separated from the end 3a by a predetermined distance L in order to securely attach the press-fit pin 1. It had to be provided.

As a result, an extra area is formed on the substrate 3, resulting in problems such as not only increasing the cost but also reducing the size. Further, since the press-fit pin 1 has no stopper, there is a problem in press-fit accuracy. As shown in FIG. 21, the solder 7 adheres to the substrate 6 near the clip portion 5a when soldering in the dipping bath, as shown in FIG.

Further, as shown in FIG. 22, when the clip terminal 5 is soldered with the iron 8, soldering from both sides is necessary. Further, as shown in FIG. 23, the clip terminals 5 need to be prepared according to the thickness of the substrate 6. Here, the thickness t1 of the substrate 6 in FIG.
3 (2) shows an example in which the thickness of the substrate 6 is larger than t2.

Further, in the lead frame 9 using the clip terminal 5, as shown in FIGS. 24 and 25, when necessary for both sides, three sides and four sides of the substrate 10, one sheet metal cannot cope with it. For example, it was necessary to separate one side 9a and the other side 9b of the lead frame 9. Further, as shown in FIGS. 26 and 27, the clip terminal 5 has a problem in fitting since the cutout portion 11 is as narrow as 1 to 2 mm in the state where the board is mounted.

[0008] Further, as shown in FIG.
Is placed on the device substrate 13 via the pad 14 and press-fitted into the hole 16 of the component substrate 15, when the component is in SMT, the reflow wind sent from the component substrate 15 side does not reach the pad 14, so the terminal temperature However, reflow soldering was difficult.

The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a lead terminal having a terminal portion which can be pressed into a substrate. Another object of the present invention is to provide a lead frame capable of assembling lead terminals on both sides, three sides, and four sides of a substrate. Another object of the present invention is to provide an electronic component in which a substrate and a lead terminal are mechanically connected.

Another object of the present invention is to provide a method of assembling an electronic component for mechanically connecting a substrate and a lead terminal.

[0011]

According to the first aspect of the present invention,
It is made of a metal plate material in which a lead portion and a terminal portion are continuously provided, and the terminal portion is formed by cutting and raising the metal plate material from one end side in the longitudinal direction, and on both sides of the terminal piece. And a tongue piece formed.

According to a second aspect of the present invention, in the lead terminal according to the first aspect, the terminal piece has an arc-shaped cross section of a wall surface. According to a third aspect of the present invention, in the lead terminal according to the first aspect, the terminal piece has a V-shaped cross section of a wall surface. According to a fourth aspect of the present invention, in the lead terminal according to any one of the first to third aspects, the terminal piece has an opening in a wall surface.

According to a fifth aspect of the present invention, in the lead terminal according to any one of the first to fourth aspects, the terminal piece has a tapered or mountain-shaped top. I do. The invention according to claim 6 is the invention according to claim 1.
6. The lead terminal according to claim 5, wherein the terminal piece has a projection on a wall portion. 7.

According to a seventh aspect of the present invention, in the lead terminal according to any one of the first to fifth aspects, the terminal piece has a step portion on a wall portion. The invention according to claim 8 is the lead terminal according to any one of claims 1 to 7, wherein the tongue has a slit or a notch in a longitudinal direction.

A ninth aspect of the present invention is characterized in that a plurality of the lead terminals according to any one of the first to eighth aspects are provided. According to a tenth aspect of the present invention, there is provided a substrate provided with a hole, and the lead terminal according to any one of the first to eighth aspects, wherein a terminal piece of the lead terminal is provided in the hole of the substrate. The tongue of the lead terminal is fixed to the back side of the substrate while being fitted.

According to the eleventh aspect of the present invention, there is provided a method for manufacturing a semiconductor device comprising:
And a lead terminal according to any one of claims 1 to 8, wherein the two substrates are arranged to face each other,
The terminal piece of the lead terminal is fitted into the hole of the one substrate, and the tongue of the lead terminal is fixed to the back side of the substrate, and the hole protrudes from the hole in the hole of the other substrate. A terminal piece of the lead terminal to be inserted.

According to a twelfth aspect of the present invention, there is provided a substrate provided with a notch on an end face thereof, and the substrate according to any one of the first to eighth aspects.
Wherein the terminal piece of the lead terminal is fitted into a cutout portion of the board, and the tongue piece of the lead terminal is fixed to the back side of the board. According to a thirteenth aspect of the present invention, there are provided two substrates each having a notch on an end face thereof, and the lead terminal according to any one of the first to eighth aspects, wherein the two substrates are arranged to face each other. Then, a terminal piece of the lead terminal is fitted into a cutout portion of the one substrate, and a tongue piece of the lead terminal is fixed to a back surface side of the substrate, and the cutout portion of the other substrate is inserted into the cutout portion of the other substrate. It is characterized in that a terminal piece of the lead terminal protruding from the notch is fitted.

According to a fourteenth aspect of the present invention, the board provided with the plurality of holes is lowered from above the lead frame according to the ninth aspect, and terminal pieces of the respective lead terminals are fitted into the holes of the lead frame. Attach the board to the board, mount the parts on the board,
It is characterized by soldering, cutting and shaping the lead terminals, and dividing the substrate from the lead frame. Claim 15
According to the present invention, a substrate provided with a plurality of notches is lowered from above the lead frame according to claim 9, and the terminal pieces of each lead terminal are fitted into the notches of the substrate to attach the substrate to the lead frame. And mounting the components on the board, soldering, cutting and shaping the lead terminals, and dividing the board from the lead frame.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described based on embodiments shown in the drawings. 1 to 5 show a lead terminal 30 and an electronic component 40 using the lead terminal 30 according to an embodiment of the present invention (corresponding to claims 1, 2, 5, and 10). The lead terminal 30 according to the present embodiment is configured by connecting a lead portion 32 and a terminal portion 33 to a metal plate 31. Here, the metal plate material 31 is made of, for example, a copper alloy (for example, copper, phosphor bronze, brass) or an iron-based alloy having a plate thickness of 0.15 mm to 0.3 mm. The terminal surface treatment includes solder plating, tin plating, gold plating, and palladium plating.

The length of the lead portion 32 is arbitrarily set according to the use and purpose of the lead terminal 30. The terminal portion 33 is formed with a terminal piece 35 having a width equal to the width of the lead portion 32 and two tongue pieces 36, 36 on a base portion 34 formed at one end of the metal plate material 31 to be wider than the lead portion 32. are doing.

The terminal piece 35 is erected along two cuts 37 provided in the longitudinal direction from one end of the metal plate 31. And the cross-sectional shape of the wall surface forms an arc shape. The height of the terminal strip 35 is arbitrarily set according to the use and purpose of the lead terminal 30. Also,
The head 35a of the terminal strip 35 is an inclined side having a mountain shape.

The upright sides 35 on both sides of the terminal strip 35
b and 35b constitute press-fit portions into holes or cutouts of the substrate. In the lead terminal 30 according to the present embodiment configured as described above, since the terminal strip 35 is formed upright, it can be press-fitted into a hole or a cutout of the substrate.
Since the two tongue pieces 36 are located at the root of the terminal piece 35, the two tongue pieces 36, 36 can function as stoppers for the terminal piece 35. Further, since the two tongue pieces 36, 36 are in contact with the back side of the board, the lead terminals 30 can be securely fixed to the board.

Further, since the terminal piece 35 has an inclined side whose head 35a has a mountain shape, it absorbs the accuracy error of the hole or the notch when press-fitting into the hole or the notch of the substrate. can do. Also, since the terminal piece 35 has an arc-shaped cross section on the wall surface, after press-fitting into a hole or a notch in the substrate, the rising edge portions 35 on both sides of the terminal piece 35 are formed.
The function that b and 35b are pressed against the inner wall surface of the hole or the cutout portion of the substrate and the terminal piece 35 is hard to come off is exerted.

If the terminal pieces 35 are set at a predetermined height, they can be commonly used even when the thickness of the substrate changes. In addition, since the terminal piece 35 has an upright shape,
At the time of soldering, it can respond in only one direction. FIG. 4 shows an electronic component 40 using the lead terminal 30 thus configured.
Is shown.

The substrate 41 is provided with a hole 42. The terminal strip 35 of the lead terminal 30 is fitted into the hole 42, and the upstanding sides 35 b, 35 b on both sides of the terminal strip 35 are pressed against the inner wall surface 42 a of the hole 42 to make it difficult for the terminal strip 35 to come off. I have. The two tongue pieces 36 of the lead terminal 30 are in contact with the back surface 41a of the substrate 41. In the electronic component 40 according to the present embodiment thus configured, the terminal piece 35 of the lead terminal 30 is press-fitted into the hole 42 and the terminal piece 3
5, the two tongue pieces 36, 36 located at the root of the terminal piece 5 function as stoppers, and the upright sides 35b, 35b on both sides of the terminal piece 35 fitted into the hole 42 are used as inner wall surfaces 42a of the hole 42. The terminal piece 35 has a function of preventing the terminal piece 35 from coming off by pressing the tongue piece 36, 36 so that the two tongue pieces 36, 36
The lead terminal 30 can be securely fixed to the substrate 41 by being pressed against the side 1a.

The hole 42 provided in the substrate 41 does not require mechanical strength as in the prior art, and therefore may be provided at a position where the terminal piece 35 of the lead terminal 30 can be fitted. Also, as shown in FIG.
By soldering in a state in which it is pressed against the back surface 41a side, more electricity can be supplied. Here, as the substrate 41, a base material (both sides, multilayer) capable of through holes such as FR-4 and CEM-3 was used.

FIG. 6 shows a substrate 44 provided with a notch 45.
4 shows an electronic component 43 using. The electronic component 43 according to the present embodiment can provide the same effect as the electronic component 40 described above. FIG. 7 shows a modification of the above-described lead terminal 30 (corresponding to claim 4). The lead terminal 30A according to the present embodiment differs from the lead terminal 30 shown in FIG. 1 in that an opening 35A is provided in the wall surface of the terminal piece 35. Other configurations are the same as those of the lead terminal 30 shown in FIG.

According to the lead terminal 30A according to this embodiment, when soldering the terminal piece 35 into the hole of the board after press-fitting, the solder spreads over the front and back surfaces of the terminal piece 35 through the opening 35A. The soldering surface area is increased, the bonding strength is further increased, and the reliability is further improved.

FIG. 8 shows a modification of the above-described lead terminal 30 (corresponding to claim 6). The lead terminals 30 </ b> B according to the present embodiment include upright sides 35 b on both sides of the terminal strip 35.
Is provided with a projection 35B on the lead terminal 30 shown in FIG.
Is different from Other configurations are similar to those of the lead terminal 3 shown in FIG.
Since it is the same as 0, its description is omitted. According to the lead terminal 30B according to this embodiment, the retention after press-fitting is further improved.

Other functions and effects are the same as those of the lead terminal 30 shown in FIG. FIG. 9 shows a modification of the above-described lead terminal 30 (corresponding to claim 8). The lead terminal 30 </ b> C according to the present embodiment has cuts 3 in two tongue pieces 36, 36.
6A and 36A, the lead terminals 30 shown in FIG.
Is different from Other configurations are similar to those of the lead terminal 3 shown in FIG.
Since it is the same as 0, its description is omitted.

According to the lead terminal 30C of this embodiment, even if air bubbles are involved during soldering, the cuts 36
Bubbles can be released from A and 36A, and defective bonding can be prevented. Other functions and effects are the same as those of the lead terminal 30 shown in FIG. The cut 36
A slit may be provided instead of A and 36A.

FIG. 10 shows a lead terminal 50 according to another embodiment of the present invention (corresponding to claims 1, 3 and 5). The lead terminal 50 according to the present embodiment is different from the lead terminal 3 shown in FIG.
Different from 0. Other configurations are the same as those of the lead terminal 30 shown in FIG.

In the lead terminal 50 according to the present embodiment, the cross section of the wall surface of the terminal piece 55 is V-shaped, so that the terminal piece 55 is press-fitted into a hole or a notch in the substrate.
These three points 55b, 55c, and 55d can be brought into pressure contact with the inner wall surfaces of the holes and cutouts of the substrate to exert a function of making the terminal piece 55 hard to come off.

Other functions and effects are the same as those of the lead terminal 30 shown in FIG. FIG. 11 shows an electronic component 60 using a lead terminal 50 according to another embodiment of the present invention (corresponding to claims 1, 3, 5, and 12). The electronic component 60 according to the present embodiment can achieve the same operation and effect as the electronic component 40 shown in FIG. 5 except for the pressure contact of the terminal piece 55 to the hole 62 of the substrate 61 at the three points 55b, 55c, and 55d. .

FIG. 12 shows a lead frame 70 using a lead terminal 30 according to another embodiment of the present invention (corresponding to claims 1, 4 and 5). In the lead frame 70 according to the present embodiment, a plurality of lead terminals 30 are provided on a continuous metal plate 71. In the lead frame 70, since the terminal pieces 35 for mounting the substrate are erected on the lead frame 70, it is possible to mount the terminal simply by lowering the substrate from above the lead frame 70.

Accordingly, it is not necessary to separately provide the lead terminals facing each other as in the related art. Further, the lead frame 70 can be easily processed continuously from one sheet metal by, for example, a progressive die. FIGS. 13 and 14 show a method of assembling an electronic component using the lead frame 70 (corresponding to claims 14 and 15).

First, the board 71 imposed is lowered from above the lead frame 70, and the terminal pieces 35 of the lead terminals 30 are press-fitted into holes or cutouts provided in the board 71. Next, the component 72 is mounted on the substrate 71. Next, the lead terminals 30 are connected to the substrate 71 by reflow or soldering.
Fixed to.

As described above, in this embodiment, the number of times of soldering can be reduced. That is, only one thermal stress is required for the substrate 71 and the component 72. As shown in FIG. 14, after soldering, it is possible to cut and form the lead terminals 30 while cutting the connecting portions 71a at the two corners and dividing the substrate 71 from the base material.

FIG. 15 shows a modification of the above-described lead terminal 30 (corresponding to claim 7). The lead terminal 30D according to the present embodiment is different from the lead terminal 30 shown in FIG. 1 in that a step 35D is provided on the wall of the terminal piece 35. Other configurations are the same as those of the lead terminal 30 shown in FIG. FIG. 16 shows an electronic component 90 using this lead terminal 30D (corresponding to claims 11 and 13).

According to the electronic component 90 of this embodiment, the two substrates 91 and 92 can be assembled to the lead terminal 30D. First, as shown in FIGS. 4 and 11, the lead terminal 30D is attached to one substrate 91 via a hole or a notch. Next, lead terminal 30
The other substrate 92 is mounted on the step 35D of D.

Here, the size of the hole or cut portion of the substrate 92 is set to a size that allows a portion above the step portion 35D to be press-fitted.

[0042]

According to the present invention, the terminal piece can be fitted into the hole or the notch of the board and can be pressed against the back side of the board by the two tongue pieces located at the root of the terminal piece. In addition, the lead terminals can be securely attached to the substrate.

Further, since the lead terminals assembled in the holes or cutouts of the substrate can be soldered through the holes or cutouts, there is no mounting restriction due to soldering. Also, by providing the lead terminals on the lead frame, the board can be assembled, soldered, divided, cut, and shaped continuously, so that the electronic component can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a lead terminal 30 according to an embodiment of the present invention.

FIG. 2 is a plan view showing a lead terminal 30 of FIG.

FIG. 3 is a plan view showing a metal plate material 31 forming the lead terminal of FIG. 1;

FIG. 4 is a plan view showing a main part of an electronic component 40 using the lead terminal 30 of FIG.

FIG. 5 is a sectional view showing a main part of the electronic component 40 of FIG.

FIG. 6 is a plan view showing a main part of an electronic component 43 using a substrate 44 provided with a cutout 45.

FIG. 7 is a perspective view showing a modification of the lead terminal 30 of FIG.

FIG. 8 is a perspective view showing a modification of the lead terminal 30 of FIG.

9 is a perspective view showing a modification of the lead terminal 30 of FIG.

FIG. 10 shows a lead terminal 50 according to another embodiment of the present invention.
It is a top view which shows the principal part of.

11 is an electronic component 6 using the lead terminal 50 of FIG.
It is a top view which shows the principal part of 0.

12 is a plan view of a lead frame 70 using the lead terminals 30 of FIG.

13 is an explanatory view showing a method of assembling an electronic component using the lead frame 70 of FIG.

14 is an explanatory diagram showing a method of assembling an electronic component using the lead frame 70 of FIG.

FIG. 15 is a perspective view showing a modification of the lead terminal 30 of FIG.

FIG. 16 is an explanatory diagram showing an electronic component 90 using the lead terminal 30D of FIG.

FIG. 17 is a perspective view showing a conventional press-fit pin.

18 is a cross-sectional view showing a state where the press-fit pin shown in FIG. 17 is press-fitted into a substrate.

19 is a perspective view showing a state where the press-fit pin shown in FIG. 17 is press-fitted into a substrate.

FIG. 20 is a side view showing a conventional clip terminal.

FIG. 21 is an explanatory view showing a soldering state of the clip terminal of FIG. 20;

FIG. 22 is an explanatory view showing soldering of the clip terminal of FIG. 20 with an iron;

FIG. 23 is an explanatory view showing the clip terminal of FIG. 20;

FIG. 24 is a plan view showing a lead frame using a conventional clip terminal.

FIG. 25 is a side view showing a lead frame using a conventional clip terminal.

FIG. 26 is a plan view showing a conventional imposition substrate.

FIG. 27 is a side view showing an example in which clip terminals are fitted into the imposition board of FIG. 26;

FIG. 28 is an explanatory view showing an assembled state of a conventional press-fit pin.

[Explanation of symbols]

30, 30A, 30B, 30C, 30D, 50 Lead terminal 31, 71 Metal plate 32 Lead part 33 Terminal part 34 Base 35, 55 Terminal piece 35A Opening 35a Head 35b Standing side 35D Step 36 Tongue 37 37A Notch 40, 43, 60, 90 Electronic component 41, 71 Board 42 Hole 42a Inner wall surface of hole 42 44, 91, 92 Board 70 Lead frame

Claims (15)

[Claims] 1. A terminal piece formed by cutting a metal plate material from one end side thereof in a longitudinal direction, the terminal piece comprising a metal plate material in which a lead portion and a terminal portion are continuously provided. A lead terminal comprising a tongue formed on both sides of the terminal. 2. The lead terminal according to claim 1, wherein the terminal piece has an arc-shaped cross section of a wall surface. 3. The lead terminal according to claim 1, wherein the terminal piece has a V-shaped cross section of a wall surface. 4. The lead terminal according to claim 1, wherein the terminal piece has an opening in a wall surface. 5. The lead terminal according to claim 1, wherein a top of the terminal piece has a tapered shape or a chevron shape. 6. The lead terminal according to claim 1, wherein the terminal piece has a projection on a wall portion. 7. The lead terminal according to claim 1, wherein the terminal piece has a step on a wall. 8. The lead terminal according to claim 1, wherein the tongue has a slit or a notch in a longitudinal direction. 9. A lead frame comprising a plurality of the lead terminals according to claim 1. 10. A board provided with a hole, and the lead terminal according to any one of claims 1 to 8, wherein a terminal piece of the lead terminal is fitted into the hole of the board. An electronic component comprising a tongue piece of the lead terminal fixed to a back surface of the substrate. 11. A substrate, comprising: two substrates provided with holes;
And a lead terminal according to any one of claims 8 to 10, wherein the two substrates are arranged to face each other, and a terminal piece of the lead terminal is fitted into a hole of the one substrate. An electronic component, wherein a tongue piece of the lead terminal is fixed to a back surface side, and a terminal piece of the lead terminal protruding from the hole is fitted into a hole of the other substrate. 12. A substrate provided with a notch on an end face, and the lead terminal according to claim 1, wherein a terminal piece of the lead terminal is provided in the notch of the substrate. An electronic component, wherein the tongue of the lead terminal is fixed to the back surface of the substrate while being fitted. 13. A semiconductor device comprising: two substrates each having a cutout on an end face; and the lead terminal according to claim 1; wherein the two substrates are arranged to face each other; A terminal piece of the lead terminal is fitted into a notch of one substrate, and a tongue of the lead terminal is fixed to the back side of the substrate, and the notch of the other substrate is An electronic component, wherein a terminal piece of the protruding lead terminal is fitted. 14. A board provided with a plurality of holes is lowered from above the lead frame according to claim 9, and a terminal piece of each lead terminal is fitted into the hole of the board to attach the board to the lead frame. A method for assembling an electronic component, comprising: mounting a component on a substrate, soldering, cutting and shaping a lead terminal, and dividing a substrate from a lead frame. 15. A board provided with a plurality of notches is lowered from above the lead frame according to claim 9, and terminal pieces of respective lead terminals are fitted into the notches of the board to attach the board to the lead frame. Mounting a component on a board, soldering, cutting and shaping a lead terminal, and dividing the board from a lead frame.