JP2540461B2 - Lead mounting structure for electronic component packages - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead mounting structure for a package that houses electronic components such as semiconductor elements.

[Prior Art] Conventionally, when attaching leads for input and output to a conductor pattern provided on an upper surface of an insulator of a package accommodating a semiconductor element or the like, a brazing material such as silver solder is used to attach the lead end portion to the above Brazing connection to the conductor pattern such as the top surface of the insulator,
Alternatively, the lead ends are directly soldered to the conductor pattern on the upper surface of the insulator or the like by using solder.

[Problems to be Solved by the Invention] However, when the lead end is attached to the conductor pattern provided on the upper surface of the insulator using a brazing material such as silver braze, the temperature of about 800 ° C. Add directly to the insulator etc. directly under the pattern. Therefore, the packages to which the leads can be connected by brazing are limited to those in which high melting point tungsten, molybdenum, or the like is used for the conductor pattern and high melting point ceramic or the like is used for the insulator.
That is, assuming that the leads are brazed to the conductor pattern of the package using a low melting point material such as copper or silver for the conductor pattern, the heat generated during brazing causes the conductor pattern such as copper or silver to be separated from the insulator. Since the bonding strength is lowered, the leads cannot be brazed to the conductor pattern using the low melting point material.

Also, when the lead ends are attached by soldering to the conductor pattern provided on the upper surface of the insulator of the package, etc., the heating temperature during soldering is around 230 ° C, so the semiconductor element is placed inside the package where the leads are soldered. It is necessary to contain electronic components such as the above, cover the upper surface of the package with a sealing cap, and apply the sealing material to the upper surface of the package with a sealing material to suppress the sealing temperature to a low soldering temperature or lower. That is, when the sealing cap is applied by applying the sealing temperature higher than the soldering temperature, the solder connecting the leads to the conductor pattern is melted and the leads are separated from the conductor pattern. Therefore, in the package in which the leads are soldered and connected, the sealing cap has to be adhered to the upper surface of the insulator of the package using a low melting point sealing material such as resin having low airtightness and moisture resistance. . Therefore, in the package in which the leads are attached by soldering, it is not possible to accommodate an electronic component such as a semiconductor element therein with sufficient airtightness and moisture resistance.

The present invention has been made to solve the above problems, and an object thereof is to provide leads to a conductor pattern of the package even if the conductor pattern is a package using a low melting point material such as copper or silver. A semiconductor element, etc. that can be easily installed without adverse effects and that can be used as a sealing material to which a sealing cap is attached, such as a low-melting glass or a gold-tin eutectic alloy having excellent airtightness and moisture resistance. An object of the present invention is to provide a lead attachment structure for an electronic component package that accommodates the.

[Means for Solving the Problems] In order to achieve the above object, the lead mounting structure (hereinafter, referred to as a lead mounting structure) of the first electronic component package of the present invention is formed on the surface of an insulator forming the package. A lower portion of the upper lead having a flange on the head, and a middle portion in the upper and lower portions of the through hole penetrating vertically through the portion to be connected with the lead of the conductor pattern and the insulator. And insert the upper part of the lower lead provided with a flange, and sandwich the portion to be connected to the lead of the conductor pattern around the through hole and the insulator between the flange of the upper lead and the flange of the lower lead, The upper lead and the lower lead are integrally formed in the through hole by electric resistance welding in a state where the flange is pressure-connected to a portion of the conductor pattern around the through hole to which the lead is to be connected. Connect,
A lead formed by connecting the upper lead and the lower lead is fixed in the through hole.

A second lead mounting structure of the present invention includes: a portion of a conductor pattern provided on a surface of an insulator forming a package, to which a lead is to be connected; and an upper portion in a through hole that is vertically penetrated through the insulator. In the lower part, the lower part of the upper lead having a flange on the head, and the upper part of the lower lead are inserted, and in the state where the flange is pressure-welded to the portion to be connected to the lead of the conductor pattern around the through hole, The upper lead and the lower lead are integrally connected by electric resistance welding in the through hole, and the heat generated by the electric resistance welding is used to surround the upper lead and the lower lead,
It is characterized in that a lead formed by connecting the upper lead and the lower lead is fixed to the inside of the through hole by welding to a welding member integrally attached to the inner peripheral surface of the through hole.

According to a third lead attachment structure of the present invention, a portion of a conductor pattern provided on a surface of an insulator forming a package, to which a lead is to be connected, and an upper portion of a through-hole penetrating vertically through the insulator, The lower part of the upper lead having a flange on the head and the upper part of the lower lead having a flange in the middle are inserted into the lower part, and the through hole is provided between the flange of the upper lead and the flange of the lower lead. By sandwiching the part to be connected with the lead of the surrounding conductor pattern and the insulator,
The upper lead and the lower lead are integrally connected in the through hole by electric resistance welding in a state where the flange is pressure-connected to the portion of the conductor pattern around the through hole to which the lead is to be connected, and the electric resistance is Using the heat generated by welding, the periphery of the upper lead and the lower lead is welded to the welding member integrally attached to the inner peripheral surface of the through hole to connect the upper lead and the lower lead. The resulting lead is fixed in the through hole.

[Operation] In the first, second, or third lead attachment structure of the present invention, the upper lead is formed by press-connecting a part of the flange of the lead to a portion of the conductor pattern around the through hole to which the lead should be connected. The lead formed by connecting the lower lead and the lower lead is electrically connected to a portion of the conductor pattern to which the lead is to be connected.

Therefore, the lead can be electrically connected to the portion of the conductor pattern to which the lead is to be connected, without directly applying heat to the conductor pattern.

Also, due to the electric resistance welding capable of withstanding high temperatures, the high temperature heat generated when the upper lead and the lower lead are integrally connected in the through hole or when the upper lead and the lower lead are integrally connected by electric resistance welding The upper lead and the lower lead are connected to the upper lead and the lower lead by welding to the welding member integrally attached to the inner peripheral surface of the through hole so as to withstand high temperature. The lead is fixed in the through hole.

Therefore, even if the lead is exposed to high temperature, the connection portion between the upper lead and the lower lead is separated, or the periphery of the lead is separated from the welding member adhered to the inner peripheral surface of the through hole,
It is possible to prevent the lead from falling out of the through hole.

Further, in the first or third lead mounting structure of the present invention, a portion to be connected to the lead of the conductor pattern around the through hole and the insulator are provided between the flange of the upper lead and the flange of the lower lead. The flange can be reliably pressed against the portion of the conductor pattern around the through hole to which the lead is to be connected by sandwiching the flange. Then, the lead can be surely electrically connected to the portion of the conductor pattern to which the lead is to be connected. Also, the flanges of the upper lead and the lower lead are locked to the conductor pattern part and the insulator part around the through hole to ensure that the lead connecting the upper lead and the lower lead does not fall into the through hole. Can be fixed to.

Further, in the second or third lead attachment structure of the present invention, the periphery of the upper lead and the lower lead is welded to the welding member integrally attached to the inner peripheral surface of the through hole, and the upper lead and the lower lead are attached. The lead, which is integrally connected with the lead, can be securely fixed so as not to drop into the through hole. Further, the periphery of the lead, which is formed by integrally connecting the upper lead and the lower lead, is welded to the welding member integrally attached to the inner peripheral surface of the through hole without any gap, and the space between the lead periphery and the inner peripheral surface of the through hole is It can be closed with a welding member without any gaps. Further, it is possible to prevent the airtightness inside the insulator forming the package from being impaired through the through hole.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.
1 to 3 show a preferred embodiment of the first lead attachment structure of the present invention. FIG. 1 is a front sectional view of a package in which leads are attached using the structure, and FIG. 3 is an enlarged front sectional view of the lead portion of the package shown in FIG.
The figure is an explanatory view of a lead attaching method when attaching a lead to a package by the structure. The lead mounting structure in the above figures will be described below. In the figure, reference numeral 1 is an insulator such as a ceramic substrate which constitutes a package having a conductor pattern 2 made of a metallized layer or the like on its upper surface. Conductor pattern 2 made of copper or the like on the upper surface of this insulator 1
A through hole 4 that penetrates the inside of the conductor pattern 2 and the insulator 1 and reaches the lower surface of the insulator 1 is provided in a portion to which the lead 3 is connected. Further, a Kovar (iron-
Upper lead 3a made of nickel-cobalt alloy) or the like,
Lower leads 3b, which are also made of Kovar or the like, each having a disk-shaped flange 6 are provided in the middle. Then, the lower part of the upper lead 3a and the upper part of the lower lead 3b, which are separate bodies, are inserted into the upper part and the lower part of the through hole 4 of the insulator 1, respectively, and the upper lead 3a and the lower part are inserted into the through hole 4. Insert the lead 3b into the through hole 4 by abutting the lower end and the upper end.
They are connected together by electric resistance welding. And the second
As shown in the figure, with the lower surface of the flange 5 of the upper lead head connected to the surface of the conductor pattern 2 on the upper surface of the insulator around the through hole 4 by pressure welding, An insulator 1 around the through hole 4 including the conductor pattern 2 is sandwiched between the upper surface of the flange 6 and the upper surface of the flange 6, and a lead 3 integrally connecting an upper lead and a lower lead is inserted into the through hole 4 formed through the insulator 1. It is fixed.

In order to attach the lead 3 to the package with the above structure, as shown in FIG. 3, the upper lead 3a and the lower lead 3b, which are respectively inserted in the upper and lower parts of the through hole 4 of the insulator, are attached to the welding machine. While pressing the upper and lower electrodes 8a and 8b into the through hole 4 to bring the lower end of the upper lead 3a and the upper end of the lower lead 3b into contact with each other in the through hole 4, the upper lead 3a and the lower lead 3a
A welding current is passed between the upper lead 3a and the lower lead 3b through electrodes 8a and 8b to integrally connect the upper lead 3a and the lower lead 3b by electric resistance welding. Then, in the through hole 4, the upper lead 3a and the lower lead 3a
At the same time that 3b is integrally welded and connected, the upper lead 3a and the lower lead 3b have a second butted portion 9 that is inserted into the through hole 4 due to heat generated by electric resistance welding of the upper lead 3a and the lower lead 3b.
As shown in the figure, the upper lead head flange 5 lower surface is pressed and connected to the upper lead head flange 5 lower surface with the lower surface of the flange 5 of the upper lead head pressed and connected to the surface of the conductor pattern 2 on the upper surface of the insulator 1. The insulator 1 around the through hole 4 including the conductor pattern 2 is sandwiched between the upper surface of the lower lead and the upper surface of the flange 6, and the lead 3 integrally connecting the upper lead and the lower lead is transparently provided on the insulator 1. It is fixed in the through hole 4.

FIGS. 4 to 6 show a preferred embodiment of the second lead mounting structure of the present invention, and FIG. 4 is a front sectional view of a package in which the leads are mounted using the structure, and FIG. FIG. 4 is an enlarged front sectional view of the lead portion of the package of FIG. 4, and FIG. 6 is an explanatory view of a lead attaching method in the case of attaching the lead by the structure. In the figure, the same members as those shown in FIGS. 1 to 3 are denoted by the same reference numerals and the description thereof will be omitted. The lead mounting structure in the above figures will be described below. A welding member 7 such as a metallized metal layer or a plated metal layer is integrally attached to the inner peripheral surface of the through hole 4 which penetrates through the conductor pattern 2 and the insulator 1 and reaches the lower surface of the insulator 1. In addition, an upper lead 3a having a disk-shaped flange 5 on the head and a lower lead 3b having no flange are separately provided to form the lead 3. Then, the lower part of the upper lead 3a and the upper part of the lower lead 3b which are separate bodies are respectively inserted into the upper part and the lower part of the through hole 4 of the insulator, and the upper lead 3a and the lower lead inserted into the through hole 4 are inserted. The lower end and the upper end of 3b are butted and connected together by electric resistance welding in the through hole 4, and the lower surface of the flange 5 of the upper lead head is connected to the surface of the conductor pattern 2 around the through hole as shown in FIG. In a state of pressure contact connection, the welding member 7 adhered to the inner peripheral surface of the through hole 4 is integrally welded to the periphery of the portion of the lead 3 integrally connecting the upper lead and the lower lead, which is located in the through hole 4. Then, the lead 3 is fixed in the through hole 4 provided through the insulator 1.

In order to attach the lead 3 to the package with the above structure, as shown in FIG.
Through hole 4 in which the welding member 7 is integrally attached to the inner peripheral surface of 8a, 8b
Upper lead 3a and lower lead 3b inserted in the upper and lower parts of
While pressing the inside of the through hole 4 respectively to bring the lower end of the upper lead 3a and the upper end of the lower lead 3b into contact with each other in the through hole 4,
A welding current is passed between the upper lead 3a and the lower lead 3b through electrodes 8a and 8b to integrally connect the upper lead 3a and the lower lead 3b by electric resistance welding. Then the upper lead
3a and the lower lead 3b are integrally welded and connected in the through hole 4, and at the same time, the upper lead and the lower lead, which are inserted into the through hole 4 by the heat of the electric resistance welding of the upper lead 3a and the lower lead 3b, are butted. As shown in FIG. 5, the portion 9 melts and becomes stiff, and the lower surface of the flange 5 of the upper lead is in pressure contact with the surface of the conductor pattern 2 on the upper surface of the insulator 1. At the same time, the portion around the inside of the through hole 4 of the lead 3 integrally connecting the upper lead and the lower lead with the heat when the electric resistance welding is performed on the upper lead 3a and the lower lead 3b is the inner circumference of the through hole 4. The lead 3 is integrally welded to the welding member 7 adhered to the surface, and the lead 3 is fixed in the through hole 4 formed through the insulator 1.

FIG. 7 shows a preferred embodiment of the third lead attachment structure of the present invention, and more specifically, it is an enlarged front sectional view of a lead portion of a package in which the lead is attached using the structure.
The lead mounting structure in this figure will be described below. In this lead attachment structure, as shown in FIG. 7, a flange 6 is provided in the middle part of the lower lead 3b, and between the lower surface of the flange 5 of the upper lead head and the upper surface of the flange 6 of the lower lead middle part. The upper lead 3a and the lower lead 3b are integrally connected in the through hole 4 by electric resistance welding so that the insulator 1 around the through hole 4 including the conductor pattern 2 is sandwiched, and the upper lead 3a and the lower lead 3b are integrally connected to each other. Similar to the lead mounting structure shown in Fig. 6, upper lead 3a and lower lead 3a
The heat generated when 3b is electrically resistance-welded causes the through hole 4 around the lead 3 that integrally connects the upper lead and the lower lead.
The lead 3 is firmly fixed in the through hole 4 of the insulator by integrally welding to the welding member 7 attached to the inner peripheral surface.

In the first, second or third lead mounting structure described above, gold plating or the like may be applied to the upper lead 3a in order to reduce the contact resistance between the lower surface of the flange 5 of the upper lead and the conductor pattern 2.

Further, in order to reduce the contact resistance between the lead 3 and the conductor pattern 2, from the inner peripheral surface of the through hole 4 into which the lead 3 is inserted to the lower surface of the insulator 1 where the upper surface of the flange 6 of the lower lead is pressed, A conductor pattern (not shown) such as a metallized metal layer for short-circuiting to the conductor pattern 2 for press-connecting the lower surface of the flange 5 of the upper lead may be provided.

[Effects of the Invention] As described above, in the first, second, or third lead attachment structure of the present invention, the upper lead and the lower lead are directly heated without applying heat to the conductor pattern provided in the insulator. A part of the lead formed by connecting and is electrically connected to the portion of the conductor pattern to which the lead is to be connected by pressure contact connection.

Therefore, according to the first, second or third lead attachment structure of the present invention, a package using a conductor pattern made of high melting point tungsten, molybdenum or the like, or an insulator such as heat resistant ceramic is used. Not only the package, but also the package that uses a conductor pattern made of low melting point copper, silver, gold, etc., or the package that uses an insulator such as resin that does not have heat resistance, the joint strength between the conductor pattern and the insulator It is possible to easily and accurately electrically connect the lead to the portion to which the lead of the conductor pattern is to be connected, without lowering the temperature or cutting a part of the conductor pattern.

Further, in the first, second or third lead attachment structure of the present invention, by electric resistance welding capable of withstanding high temperature,
By utilizing the high temperature heat generated when the upper lead and the lower lead are integrally connected in the through hole or when the upper lead and the lower lead are integrally connected by electric resistance welding, By welding the periphery of the to the welding member integrally attached to the inner peripheral surface of the through hole so as to withstand high temperature,
A lead formed by integrally connecting the upper lead and the lower lead is fixed in the through hole.

Therefore, according to the first, second, or third lead attachment structure of the present invention, even if the leads are exposed to high temperature, the connecting portion between the upper lead and the lower lead is separated, or the lead periphery is within the through hole. It is possible to prevent the lead from falling out of the through hole by being detached from the welding member adhered to the peripheral surface.

As a result, according to the first, second or third lead mounting structure of the present invention, the package upper surface containing the electronic component such as the semiconductor element is covered with the sealing cap, and the cap is sealed on the package upper surface. And a sealing material having a high melting point such as a low melting point glass and a gold-tin eutectic alloy having excellent moisture resistance can be applied. Then, an electronic component such as a semiconductor element can be enclosed in a space surrounded by the package and the cap while having high airtightness and high moisture resistance.

Further, according to the first or third lead attachment structure of the present invention, the portion to which the lead of the conductor pattern around the through hole is to be connected and the insulator are sandwiched between the flange of the upper lead and the flange of the lower lead. Thus, the flange can be securely pressed against the portion of the conductor pattern around the through hole to which the lead is to be connected. Then, the lead can be surely electrically connected to the portion of the conductor pattern to which the lead is to be connected. Further, the flanges of the upper lead and the lower lead are locked to the conductor pattern portion and the insulator portion around the through hole, so that the lead can be securely fixed so as not to drop into the through hole.

Further, according to the second or third lead mounting structure of the present invention, the periphery of the upper lead and the lower lead is welded to the welding member integrally attached to the inner peripheral surface of the through hole, and the upper lead and the lower lead are attached. The lead formed by connecting and can be securely fixed so as not to fall into the through hole. Further, the periphery of the upper lead and the lower lead are welded to the welding member integrally attached to the inner peripheral surface of the through hole without any gap, and the periphery of the lead formed by connecting the upper lead and the lower lead and the inner peripheral surface of the through hole are connected. It is possible to close the space between and with a welding member without any gap. Further, it is possible to prevent the airtightness inside the insulator forming the package from being impaired through the through hole, and to accommodate the electronic component such as a semiconductor element in the package inner space with airtightness.

[Brief description of drawings]

1 is a front sectional view of a package in which leads are attached by the lead attaching structure of the present invention, FIG. 2 is an enlarged front sectional view of a lead portion of FIG. 1, and FIG. 3 is the lead attaching structure of FIG. FIG. 4 is a front sectional view of a package in which leads are mounted by another lead mounting structure of the present invention, FIG. 5 is an enlarged front sectional view of the lead portion of FIG. 4, and FIG. Is an explanatory view of a lead attaching method using the lead attaching structure of FIG. 4, and FIG. 7 is an enlarged front sectional view of a lead portion of a package to which a lead is attached by another lead attaching structure of the present invention. 1 ... Insulator, 2 ... Conductor pattern, 3 ... Lead, 3a ... Upper lead, 3b ... Lower lead, 4 ... Through hole, 5,6 ... Flange, 7 ... Welding member.

Claims (3)

(57) [Claims] 1. A head is provided at an upper portion and a lower portion in a through hole which is vertically penetrated through a portion of a conductor pattern provided on an insulator surface constituting a package to which a lead is to be connected and the insulator. The lower part of the upper lead having a flange and the upper part of the lower lead having a flange in the middle are inserted, and the lead of the conductor pattern around the through hole is inserted between the flange of the upper lead and the flange of the lower lead. In the state where the flange and the insulator are sandwiched between a portion to be connected to the upper portion, the upper lead and the lower lead in the through hole in a state where the flange is pressure-connected to the portion to which the lead of the conductor pattern around the through hole is to be connected. A lead attachment structure for an electronic component package, characterized in that the leads formed by connecting the upper lead and the lower lead are integrally connected by electric resistance welding and fixed in the through hole. . 2. A head is provided in an upper portion and a lower portion in a through hole that is vertically penetrated through a portion of a conductor pattern provided on a surface of an insulator constituting a package to which a lead is to be connected and the insulator. The upper lead and the lower lead are inserted in a state where the lower part of the upper lead having a flange and the upper part of the lower lead are inserted, and the flange is pressure-connected to the portion of the conductor pattern around the through hole to which the lead is to be connected. And are integrally connected by electric resistance welding in the through hole, and the heat generated by the electric resistance welding is used to integrally form the periphery of the upper lead and the lower lead on the inner peripheral surface of the through hole. A lead mounting structure for an electronic component package, characterized in that a lead formed by connecting the upper lead and the lower lead is fixed in the through hole by being fused to the deposited welding member. 3. A head is provided at an upper portion and a lower portion in a through hole which is vertically penetrated through a portion to be connected with a lead of a conductor pattern provided on an insulator surface constituting a package and the insulator. The lower part of the upper lead having a flange and the upper part of the lower lead having a flange in the middle are inserted, and the lead of the conductor pattern around the through hole is inserted between the flange of the upper lead and the flange of the lower lead. In the state where the flange and the insulator are sandwiched between a portion to be connected to the upper portion, the upper lead and the lower lead in the through hole in a state where the flange is pressure-connected to the portion to which the lead of the conductor pattern around the through hole is to be connected. A welding member integrally connected by electric resistance welding and utilizing the heat generated by the electric resistance welding to integrally adhere the periphery of the upper lead and the lower lead to the inner peripheral surface of the through hole. Welded, lead attachment structure of the upper lead and the electronic component package in which a lead formed by connecting the lower lead, characterized in that fixed to the through hole.