JP2746809B2 - Package for storing optical semiconductor elements - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device housing package, and more particularly to an optical semiconductor device capable of hermetically sealing an optical semiconductor device and holding an optical fiber for transmitting and receiving optical signals to and from the optical semiconductor device. It relates to a package for storage.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor element housing package for housing an optical semiconductor element has an external lead terminal 22 fixed through an insulator 23 and an optical semiconductor element 24 mounted on an upper surface as shown in FIG. Kovar metal having a mounting portion 21a to be mounted
(Iron-nickel-cobalt alloy), a metal base 21 made of copper-tungsten alloy or the like, and the optical semiconductor element mounting portion 21
a metal such as Kovar metal or the like, which is attached to the metal base 21 via a brazing material such as silver brazing so as to surround a, and a fixing member 26 for fixing the optical fiber through the side is brazed and attached. A frame 25, and a metal lid 27 attached to the upper surface of the metal frame 25 and hermetically sealing the optical semiconductor element 24, the optical semiconductor element mounting portion 21 of the metal base 21
a, the electrodes of the optical semiconductor element 24 are connected to the external lead terminals 22 via bonding wires 28, and then the metal lid 27 is attached to the upper surface of the metal frame 25. , Metal base 21, metal frame 25 and metal lid 27
The optical semiconductor element 24 is housed inside a container consisting of: By fixing to the body 25, an optical semiconductor device as a product is obtained.

Such an optical semiconductor device excites light in an optical semiconductor element 24 by a drive signal supplied from an external electric circuit, and transmits the excited light to the outside through an optical fiber 29 to perform high-speed optical communication or the like. It functions as an optical semiconductor device to be used.

In the package for storing an optical semiconductor element, gold is previously layered to a predetermined thickness on the surfaces of the metal base 21 and the metal frame 25 by electrolytic plating, and the metal base 21 and the metal frame 25 are oxidized. Corrosion is effectively prevented, and the optical semiconductor element 24 is firmly adhered and fixed to the optical semiconductor element mounting portion 21a of the metal base 21.

[0005]

However, in this conventional package for storing an optical semiconductor element, a metal substrate is not used.
21, since the metal frame 25 and the fixing member 26 are made of a metal material, and are in direct contact with each other, gold is layered on the surfaces of the metal base 21 and the metal frame 25 by an electrolytic plating method. Gold is also layered on the surface of the fixing member 26 attached to the fixing member 25, resulting in the following disadvantages.

That is, when the flange 30 attached to the optical fiber 29 is joined to the fixing member 26 by welding by irradiating a laser beam, and the optical fiber 29 is fixed to the metal frame 25, the laser light is layered on the surface of the fixing member 26. The flange 30 cannot be firmly joined to the fixing member 26 due to reflection by the gold plating layer, and the metal frame 25 of the optical fiber 29
There is a disadvantage that the light excited by the optical semiconductor element 24 cannot be transmitted to the outside via the optical fiber 29 satisfactorily due to the instability of the optical semiconductor device 24.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to fix an optical fiber firmly to a metal frame and to transmit light excited by an optical semiconductor element to the outside via the optical fiber. It is an object of the present invention to provide a package for accommodating an optical semiconductor element which can be performed.

[0008]

According to the present invention, there is provided a metal base having an external lead terminal fixed via an insulator and having a mounting portion on which an optical semiconductor element is mounted on an upper surface, and the optical semiconductor element mounting portion. A metal frame attached to a metal substrate so as to surround the optical frame, and a fixing member for fixing an optical fiber to a side portion is attached to the metal frame, and the optical semiconductor element is attached to an upper surface of the metal frame. An optical semiconductor element housing package comprising a metal lid hermetically sealed, wherein a fixing member attached to a side portion of the metal frame body is directly bonded to the metal frame body; And a flange member attached with an insulating member interposed therebetween.

[0009]

According to the package for housing an optical semiconductor element of the present invention, the fixing member attached to the side of the metal frame sandwiches the insulating member between the base member directly joined to the metal frame and the base member. The base member and the flange member are electrically isolated by an insulating member. Therefore, even if gold is layered on the metal frame by the electrolytic plating method, the gold plating layer is not layered on the flange member, and as a result,
If the flange attached to the optical fiber is joined to the flange member by welding by irradiating a laser beam, the joining becomes extremely strong, the fixing of the optical fiber to the metal frame becomes stable, and the light excited by the optical semiconductor element is converted to the optical fiber. Satisfactorily to the outside via the

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and 2 show an embodiment of the package for storing an optical semiconductor element of the present invention, wherein 1 is a metal base, 2 is a metal frame, 3
Is a metal lid. The metal base 1, the metal frame 2, and the metal lid 3 constitute a container 5 for housing the optical semiconductor element 4.

The metal substrate 1 has a mounting portion 1a for mounting the optical semiconductor element 4 at the center of the upper surface thereof.
An optical semiconductor element 4 is adhered and fixed above with a Peltier element or the like interposed therebetween.

The metal substrate 1 is made of a Kovar metal (iron-nickel-cobalt alloy), a copper-tungsten alloy, or the like. It is formed into a predetermined shape by applying a working method, a press working method or the like.

The metal substrate 1 has an outer surface coated with gold to a predetermined thickness by an electrolytic plating method. The gold plating layer effectively prevents the metal substrate 1 from being oxidized and corroded. The optical semiconductor element 4 is firmly adhered to the mounting portion 1a.

When a gold plating layer is formed on the outer surface of the metal substrate 1, a nickel plating layer may be formed on the gold base layer so that the adhesion strength between the metal substrate 1 and the gold plating layer is increased. I can do it. Therefore, when a gold plating layer is layered on the outer surface of the metal substrate 1, it is preferable that a nickel plating layer is layered on the underlayer.

A plurality of external lead terminals 6 are fixed to a part of the metal base 1 via an insulator 7 such as glass.

The external lead terminal 6 functions to electrically connect the electrodes of the optical semiconductor element 4 to an external electric circuit, and the electrode of the optical semiconductor element 4 is connected to the bonding wire 8 at one end.
And the other end is connected to an external electric circuit via a brazing material such as solder.

The external lead terminals 6 are made of Kovar metal or 4
It is made of a metal material such as a two-alloy, and is formed into a predetermined rod shape by subjecting a Kovar metal ingot (roll) to a rolling method, a punching method, or a conventionally known metal processing method.

The external lead terminal 6 may be provided with a metal having excellent corrosion resistance, such as nickel and gold, and a good wettability with a brazing material to a thickness of 1.0 to 20.0 μm. This effectively prevents the oxidative corrosion of the external lead terminals 6 and the connection of the bonding wires 8 to the external lead terminals 6. Therefore, the external lead terminal 6
It is preferable that nickel, gold or the like is layered to a thickness of 1.0 to 20.0 μm on the surface by plating.

Further, the external lead terminal 6 is fixed to the metal base 1 by drilling a hole having a diameter slightly larger than that of the external lead terminal 6 in the metal base 1. This is performed by inserting the external lead terminal 6 and then heating and melting the insulator 7 made of glass.

Further, the metal base 1 to which the external lead terminals 6 are fixed has a metal frame 2 attached to the outer periphery of the upper surface so as to surround the optical semiconductor element mounting portion 1a. 2 forms a space for accommodating the optical semiconductor element 4 therein.

The metal frame 2 is made of Kovar metal or the like. The metal frame 2 is formed in a frame shape by pressing an ingot of the Kovar metal, and the metal frame 2 is attached to the metal substrate 1 by an upper surface and a metal frame. This is performed by brazing the lower surface of the body 2 with a silver brazing material.

The metal frame 2 has an outer surface coated with a metal having excellent corrosion resistance, such as gold, and the gold plating layer effectively prevents the metal frame 2 from being oxidized and corroded.

The gold is applied to the surface of the metal frame 2 at the same time as gold is applied to the outer surface of the metal substrate 1 by electrolytic plating to a predetermined thickness.

When a gold plating layer is formed on the surface of the metal frame 2, if a nickel plating layer is layered on the underlayer, the adhesion strength between the metal frame 2 and the gold plating layer is enhanced. be able to. Therefore, when a gold plating layer is deposited on the surface of the metal frame 2, it is preferable to deposit a nickel plating layer on the underlayer.

A fixing member A is attached to the side of the metal frame 2, and the fixing member A functions to fix an optical fiber B described later to the metal frame 2.

As shown in FIG. 2, the fixing member A comprises a base member 9, an insulating member 10, and a flange member 11. The base member 9 and the flange member 11 are made of a metal material such as Kovar metal.
The insulating member 10 is formed of an electrical insulating material such as an aluminum oxide sintered body.

The base member 9 of the fixing member A is a fixing member A
Acts firmly on the metal frame 2 and the metal frame 2
Is attached through a brazing material such as silver brazing.

Further, an insulating member 10 is attached to the base member 9 of the fixing member A, and a flange member 11 is further attached to the insulating member 10. The insulating member 10 is formed by electrically connecting the flange member 11 to the base member 9. It acts to attach while maintaining.

The insulating member 10 is made of, for example, alumina (Al ₂
O ₃ ), silica (SiO ₂ ), magnesia (MgO), calcia
An appropriate organic solvent and a suitable organic solvent are added to the raw material powder such as (CaO) to form a slurry by adding and mixing a solvent and forming a ceramic green sheet (ceramic raw sheet) by employing a doctor blade method or a calendar roll method, Thereafter, the ceramic green sheet is manufactured by subjecting the ceramic green sheet to appropriate punching and firing at a high temperature (about 1600 ° C.).

Further, the insulating member 10 is attached to the base member 9 and the flange member 11 by attaching molybdenum,
A metallized metal layer made of a high-melting metal powder such as tungsten or manganese is adhered to the metallized metal layer adhered to both main surfaces of the insulating member 10, and the base member 9 and the flange member 11 are coated with silver brazing. It is performed by brazing through a brazing material such as.

The metallized metal layer deposited on both main surfaces of the insulating member 10 is made of a metal paste obtained by adding a suitable organic solvent and a solvent to a high melting point metal powder such as tungsten, molybdenum, manganese or the like. The ceramic green sheet serving as the insulating member 10 is applied on both main surfaces of the insulating member 10 by printing and applying a predetermined pattern in advance by a conventionally known screen printing method.

A flange 12 attached to the optical fiber B is welded to the flange member 11 of the fixing member A, whereby the optical fiber B for transmitting the light excited by the optical semiconductor element 4 to the outside is attached to the metal frame 2. It will be fixed.

When the flange 12 attached to the optical fiber B is welded to the flange member 11 of the fixing member A, the flange member 11 and the flange 12 are brought into contact with each other and the corresponding contact portion is irradiated with a laser beam to fuse them together. This is done by In this case, the flange member 11 and the base member 9 are
When gold is electrolytically plated on the surface of the metal frame 2 by the electroplating method,
Although gold is layered on the flange member 11, the gold is not layered on the flange member 11, and as a result, the flange 12
When the laser beam is applied to the corresponding contact portion and the laser beam is not reflected on the flange member 11, there is no reflection of the laser beam, and the welding of the two is completed, thereby stably fixing the optical fiber B to the metal frame 2. Then, the light excited by the optical semiconductor element 4 can be transmitted to the outside via the optical fiber B.

The metal frame 2 has a metal cover on its upper surface.
The optical semiconductor device 4 is attached, and the optical semiconductor element 4 is hermetically accommodated in a container 5 composed of the metal base 1, the metal frame 2, and the metal lid 3, thereby obtaining an optical semiconductor device as a product.

The metal cover 2 is made of a metal material such as Kovar metal or 42 alloy (iron-nickel alloy), and is attached to the upper surface of the metal frame 2 by welding such as seam welding.

Thus, according to the package for housing an optical semiconductor element of the present invention, the optical semiconductor element 4 is bonded and fixed to the optical semiconductor element mounting portion 1a of the metal substrate 1, and
Are connected to the external lead terminals 6 via bonding wires 8, and then a metal cover 3 is attached to the upper surface of the metal frame 2, and the metal base 1, the metal frame 2, the metal cover 3, The optical semiconductor device 4 is accommodated in a container 5 made of a metal material. Finally, the flange 12 attached to the optical fiber B is joined to the fixing member A of the metal frame 3 by welding by irradiating a laser beam. An optical semiconductor device as a product is obtained by fixing the optical semiconductor device 4 to the body 2, and the optical semiconductor element 4 is excited by a drive signal supplied from an external electric circuit, and the excited light is transmitted to the outside via the optical fiber B. This functions as an optical semiconductor device used for high-speed optical communication or the like.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

[0038]

According to the package for housing an optical semiconductor element of the present invention, the fixing member attached to the side of the metal frame has a base member directly joined to the metal frame and an insulating member interposed between the base member. The base member and the flange member are electrically isolated by an insulating member. Therefore, even if gold is layered on the metal frame by the electrolytic plating method, the gold plating layer is not layered on the flange member, and as a result, the flange attached to the optical fiber on the flange member is welded by laser beam irradiation. By joining, the joining becomes extremely strong, the fixing of the optical fiber to the metal frame becomes stable, and the light excited by the optical semiconductor element can be transmitted well to the outside via the optical fiber.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a package for housing an optical semiconductor element of the present invention.

FIG. 2 is an enlarged sectional view of a main part of the package shown in FIG.

FIG. 3 is a sectional view of a conventional package for housing an optical semiconductor element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Metal base 2 ... Metal frame 3 ... Metal cover 4 ... Optical semiconductor element 6 ... External lead terminal 9 ... Base member 10 ... · Insulating member 11 ··· Flange member A ··· Fixing member B ··· Optical fiber

Claims (1)

(57) [Claims] An external lead terminal is fixed via an insulator, a metal base having a mounting portion on which an optical semiconductor element is mounted on an upper surface, and a metal base surrounding the optical semiconductor element mounting portion. A metal frame attached to the base body, to which a fixing member for fixing the optical fiber to the side is attached; and a metal lid attached to the upper surface of the metal frame to hermetically seal the optical semiconductor element. An optical semiconductor element housing package comprising: a base member in which a fixing member attached to a side of the metal frame is directly bonded to the metal frame; and an insulating member interposed between the base member and the base member. An optical semiconductor element storage package, comprising a flange member to be attached.