JP3236836B2 - Electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in which electronic components such as a piezoelectric vibrator and a semiconductor element are hermetically housed in a container formed of an insulating base such as ceramics and a metal cover.

[0002]

2. Description of the Related Art Electronic components such as a piezoelectric vibrator and a semiconductor element are air-tightly accommodated in a container for accommodating the electronic components to become an electronic device as a product.

The most reliable one of such electronic devices is made of ceramics such as an aluminum oxide sintered body, and has a mounting portion on which an electronic component is mounted at the center of the upper surface and a mounting portion surrounding the mounting portion. An insulating substrate having a frame-shaped metallized metal layer adhered thereto, and a metal frame made of an iron-nickel alloy or an iron-nickel-cobalt alloy attached to the metallized metal layer of the insulating substrate so as to surround a mounting portion. A type in which electronic components are hermetically sealed inside a container comprising a body and a metal lid made of an iron-nickel alloy or an iron-nickel-cobalt alloy joined to the metal frame by seam welding. is there.

In an electronic device of this type, after mounting an electronic component on a mounting portion of an insulating base, a metal lid is mounted on a metal frame attached to the insulating base, and an outer peripheral edge of the metal lid is mounted. Rolling while contacting a pair of roller electrodes of a seam welding machine, and applying a large current for welding between the roller electrodes to raise the temperature of the contact portion between the roller electrodes and the metal lid, It is manufactured by seam welding a metal lid to a metal frame.

However, this type of electronic device is
A metal frame is required as a base metal for seam welding a metal lid to an insulating base, and the height of the electronic device is increased by the metal frame. There was a problem that it was difficult to reduce the thickness required. In addition, there is also a problem that the price is increased by the price of the metal frame.

Accordingly, an oxidizing device having a mounting portion for mounting electronic components at the center of the upper surface and a metallized metal layer having a thickness of 10 to 50 μm and a width of approximately 0.3 to 0.5 mm in a frame shape surrounding the mounting portion at the outer peripheral portion of the upper surface. Prepare a container consisting of an insulating base made of ceramics such as an aluminum sintered body, and a metal lid made of iron-nickel alloy or iron-nickel-cobalt alloy, and mount electronic components on the mounting portion of the insulating base. After that, a metal lid is placed on the metallized metal layer of the insulating substrate with a brazing material interposed therebetween, and the metal lid is rolled while being brought into contact with a pair of roller electrodes of a seam welding machine on the outer peripheral edge of the metal lid, By passing a large current for welding between the roller electrodes, the contact portion between the roller electrode and the metal lid is heated to a high temperature, and the heat melts the brazing material, and the metal lid is put through the metallization through the brazing material. Electronic device encapsulated electronic components hermetically inside a container made of an insulating substrate and the metal lid by seam welding has been proposed to the metal layer.

According to this electronic device, since the metallized metal layer and the metal lid are joined via the brazing material interposed therebetween, the metallized metal layer and the metal lid are made of iron as a base metal for seam welding the metal lid. There is no need for a metal frame made of a nickel alloy, an iron-nickel-cobalt alloy, or the like. Therefore, the height can be reduced accordingly and the cost is low.

[0008]

However, as described above, electronic components are hermetically housed in a container in which the metal lid and the metallized metal layer are joined by seam welding with a brazing material interposed therebetween. In electronic devices of the type, generally, the size of the metal lid is substantially the same as the size of the outer periphery of the metallized metal layer. When the metal lid is seam-welded to the metallized metal layer, the outer edge of the metal lid, which is brought into contact with the pair of roller electrodes of the seam welding machine, becomes extremely hot locally. A large thermal load is applied to the outer peripheral edge of the metallized metal layer corresponding to the above, which may cause the outer peripheral edge of the metallized metal layer to be peeled off from the insulating base, thereby significantly reducing the hermetic reliability of the container. Had problems.

The present invention has been devised in view of the above problems, and has as its object to reduce the heat load applied to the outer peripheral edge of the metallized metal layer when seam welding the metal lid to the metallized metal layer. As a small one, the outer peripheral edge of the metallized metal layer does not peel off from the insulating base, making the container hermetic sealing perfect and enabling the electronic components housed inside to operate normally and stably for a long time. An object of the present invention is to provide an electronic device with high airtight reliability.

[0010]

An electronic device according to the present invention has a thickness of 10 to 50 μm and a width of 10 to 50 μm, which is applied to an upper surface of an insulating substrate.
An electronic component inside a frame-shaped metallized metal layer which is 0.3 to 0.5 mm and has a cross-sectional shape formed of a lower surface of a flat surface, an upper surface of a flat surface smaller in width than the lower surface, and a curved side surface. A metal lid having a brazing material adhered to the lower surface on the upper surface of the metallized metal layer,
The outer peripheral edge of the metal lid is located 0.05 mm or more inside the outer peripheral edge of the metallized metal layer and 0.1 mm or more outside the inner peripheral edge, and is joined by seam welding with a brazing material therebetween. It is characterized by the following.

According to the electronic device of the present invention, the outer peripheral edge of the metal lid having the brazing material adhered to the lower surface is adhered to the upper surface of the insulating base with a thickness of 10 to 50 μm and a width of 0.3 to 0.5. 0.05 mm from the outer peripheral edge of the frame-shaped metallized metal layer having a cross-sectional shape that is formed by the lower surface of the flat surface, the upper surface of the flat surface smaller in width than the lower surface, and the side surface of the curved surface.
mm or more inside and 0.1 mm or more outside the inner peripheral edge, and joined by seam welding via a brazing filler metal, so that when the metal cover is seam-welded to the metallized metal layer, Even if the outer peripheral edge is locally high in temperature, the thermal load due to the heat will be applied more than 0.05 mm inward from the outer peripheral edge of the metallized metal layer,
Since a large voltage is not applied to the outer peripheral edge of the metallized metal layer, it is possible to effectively prevent the outer peripheral edge of the metallized metal layer from being separated from the insulating base. In addition, since the outer peripheral edge of the metal lid is located 0.1 mm or more outside the inner peripheral edge of the metallized metal layer and joined by seam welding with a brazing material therebetween, the sealing width by the brazing material is narrow. In this case, the metal lid and the metallized metal layer can be joined tightly with high airtight reliability.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electronic device according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment of an electronic device according to the present invention. In FIG.
2 is a metal cover, and 3 is an electronic component. An electronic device is configured by hermetically housing an electronic component 3 such as a piezoelectric vibrator or a semiconductor element in a container including the insulating base 1 and the metal lid 2.

The insulating substrate 1 is a support for supporting the electronic component 3 and is made of a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body. To form a concave portion A. A mounting portion 1a for mounting the electronic component 3 is formed on the bottom surface of the concave portion A, and the electronic component 3 is mounted on the mounting portion 1a.

For example, when the insulating substrate 1 is made of an aluminum oxide sintered body, a suitable organic binder and a solvent are added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide. A ceramic green sheet is formed by adopting a well-known doctor blade method or a calender roll method, and thereafter, the ceramic green sheet is appropriately punched, and a plurality of ceramic green sheets are laminated. It is manufactured by firing.

Further, a metallized wiring layer 4 made of metal powder of metal such as tungsten or molybdenum, which is led out from the upper surface of the mounting portion 1a to the lower surface of the insulating substrate 1, is formed on the insulating substrate 1.

The metallized wiring layer 4 functions as a conductive path for electrically leading each electrode of the electronic component 3 to the outside. They are electrically connected via an adhesive. The portion of the metallized wiring layer 4 extending to the lower surface of the insulating base 1 is electrically connected to a wiring conductor of an external electric circuit board (not shown) via, for example, solder.

If the metallized wiring layer 4 is made of, for example, metallized tungsten powder, a tungsten paste obtained by adding and mixing an appropriate organic binder and solvent to the tungsten powder is applied to a ceramic green sheet to be used as the insulating substrate 1 by a conventional method. A predetermined pattern is printed and applied by a well-known screen printing method, and is fired together with a ceramic green sheet serving as the insulating base 1, so that the insulating base 1 is adhered and derived in a predetermined pattern from the mounting portion 1a to the lower surface.

The metallized wiring layer 4 is preferably provided with a metal having excellent corrosion resistance and excellent wettability with solder, such as nickel or gold, having a thickness of 1 to 20 μm by plating on the exposed surface. In addition, oxidation corrosion of the metallized wiring layer 4 can be effectively prevented, and the connection between the metallized wiring layer 4 and the wiring conductor of the external electric circuit board can be made strong. Therefore, the surface of the metallized wiring layer 4 is usually coated with a metal such as nickel and gold having excellent corrosion resistance and excellent wettability with solder by 1 to 20 μm by plating.
It is attached to the thickness of.

Further, on the outer periphery of the upper surface of the insulating substrate 1, there are a lower surface of a flat surface having a width of about 0.3 to 0.5 mm and a thickness of about 10 to 50 μm and an upper surface of a flat surface having a width smaller than the lower surface. A frame-shaped metallized metal layer 5 having a shape composed of a curved side surface is formed so as to surround the mounting portion 1a.

The metallized metal layer 5 functions as a base metal for seam welding the metal cover 2 to the insulating base 1 with the brazing material 6 interposed therebetween, and, like the metallized wiring layer 4, a metal such as tungsten or molybdenum. Consists of powder metallization.

If the metallized metal layer 5 is made of, for example, metallized tungsten powder, a tungsten paste obtained by adding an appropriate organic binder and solvent to the tungsten powder is mixed with a ceramic green sheet serving as the insulating substrate 1. On the upper surface of the insulating substrate 1, the upper surface of the mounting portion 1a is surrounded by printing and applying a predetermined thickness and a predetermined pattern by using a conventionally known screen printing method, and firing this together with a ceramic green sheet serving as the insulating substrate 1. To form a frame.

When the metallized metal layer 5 is coated with a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with the brazing material 6 to a thickness of 1 to 20 μm by plating, The metallized metal layer 5 can be effectively prevented from being oxidized and corroded, and the bonding of the metal lid 2 to the metallized metal layer 5 via the brazing material 6 can be made strong. Therefore, usually, the surface of the metallized metal layer 5 is coated with a metal such as nickel or gold having excellent corrosion resistance and excellent wettability with the brazing material 6 by plating.
It is applied to a thickness of μm.

The metal lid 2 welded to the metallized metal layer 5 is made of an iron-nickel alloy plate or an iron-nickel-cobalt alloy plate having a thickness of about 0.1 mm. Brazing material 6 between metal layers 5
The electronic component 3 is hermetically sealed between itself and the insulating base 1 by seam welding.

The metal cover 2 and the metallized metal layer 5 are joined by seam welding by joining the flat metal cover 2 to the insulating base 1.
A brazing material 6 is arranged and placed between the metallized metal layers 5 adhered to the metal cover 2, and a pair of roller electrodes of a seam welding machine are brought into contact with the outer peripheral edge of the metal lid 2 while rolling. A large current for welding is passed between the electrodes, causing the contact between the roller electrode and the metal lid to generate Joule heat,
This heat is transmitted to the lower surface of the metal cover 2 to melt a part of the brazing material 6.

The brazing material 6 disposed between the metal cover 2 and the metallized metal layer 5 is made of a silver-copper alloy or a gold-tin alloy.
It is made of a lead-tin alloy, aluminum-silicon alloy, copper-zinc alloy, silver-copper-phosphorus alloy, silver-indium-tin alloy, or the like, and functions as a joining material for joining the metal cover 2 to the metallized metal layer 5. Then, the heat generated by the Joule heat generated at the contact portion between the outer peripheral edge of the metal lid 2 and the roller electrode is transmitted to the outer peripheral portion of the lower surface of the metal lid 2 so that a part of the metal has a melting width corresponding to the heat. Melts.

When the brazing material 6 is disposed between the metal cover 2 and the metallized metal layer 5, the lower surface of the metal cover 2 can be clad by a cladding method or the like in order to improve the workability of the arrangement. It is applied to a thickness of about 10 to 50 μm by plating or the like.

In the electronic device according to the present invention, the outer peripheral edge of the metal cover 2 is set to be 0.1 mm from the outer peripheral edge of the metallized metal layer 5.
It is important that it is located at least 05 mm inside.

The outer peripheral edge of the metal cover 2 is covered with a metallized metal layer 5.
The metal lid 2 is placed on the metallized metal layer 5 with the brazing material 6 interposed between the metallized metal layer 5 and the outer peripheral edge of the metal lid 2 by seam welding. Rolling while contacting a pair of roller electrodes of the machine and passing a large current for welding between these roller electrodes,
When the contact portion between the roller electrode and the metal lid 2 is heated to seam weld the metal lid 2 to the metallized metal layer 5 via the brazing material 6, the outer peripheral edge of the metal lid 2 is locally extremely hot. However, the heat load due to the heat is largely applied to the inside of the outer periphery of the metallized metal layer 5 by 0.05 mm or more, and is not greatly applied to the outer periphery of the metallized metal layer 5. The outer peripheral edge of the layer 5 does not peel off from the insulating base 1, whereby the hermetic sealing of the container is completed, and the electronic components 3 housed inside the container can be operated normally and stably for a long period of time. Becomes

When the outer peripheral edge of the metal cover 2 is located at a position less than 0.05 mm inward from the outer peripheral edge of the metallized metal layer 5, the metal cover 2 is placed between the metallized metal layer 5 and the brazing material. When seam welding is performed through the metallized metal layer 6, the heat load due to heat from the outer peripheral edge of the metal lid 2, which has become extremely hot locally, largely acts on the outer peripheral edge of the metallized metal layer 5, and The risk of peeling off from the insulating base 1 on the outer peripheral edge is increased.
Therefore, the position of the outer peripheral edge of the metal lid 2 is specified at a position 0.05 mm or more inside the outer peripheral edge of the metallized metal layer 5.

When the outer peripheral edge of the metal cover 2 is located less than 0.1 mm outside the inner peripheral edge of the metallized metal layer 5, the metal cover 2 is placed between the metallized metal layer 5 and the brazing material. 6, after the seam welding is performed, the sealing width by the brazing material 6 becomes narrow, so that it becomes difficult to join the metal lid 2 and the metallized metal layer 5 with high airtight reliability and firmly. It is in. Therefore, the metal lid 2
Position of the outer peripheral edge of the metallized metal layer 5 is 0.
Preferably, the position is 1 mm or more outside.

Thus, according to the electronic device of the present invention, an electronic device in which the electronic component 3 is housed with high hermetic reliability inside the container including the insulating base 1 and the metal lid 2 can be obtained.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the present invention.

[0034]

According to the electronic device of the present invention, the outer peripheral edge of the metal lid having the lower surface covered with the brazing material is attached to the upper surface of the insulating base with a thickness of 10 to 50 μm and a width of 0.3 to 0.3 μm. ~ 0.5mm
The outer peripheral edge of the frame-shaped metallized metal layer having a cross-sectional shape formed of the lower surface of the flat surface, the upper surface of the flat surface smaller in width than the lower surface, and the side surface of the curved surface.
Positioned at least 05 mm inward and 0.1 mm or more outside the inner peripheral edge and joined by seam welding with a brazing material in between, so when seam welding the metal lid to the metallized metal layer, the metal lid Even if the outer peripheral edge of the metallized metal layer becomes locally high temperature, the thermal load due to the heat will be greatly applied 0.05 mm or more inward from the outer peripheral edge of the metallized metal layer, and will not be greatly applied to the outer peripheral edge of the metallized metal layer. Therefore, it is possible to effectively prevent the outer peripheral edge of the metallized metal layer from being peeled off from the insulating base, and as a result, the hermetic sealing of the container is completed, and the electronic components housed therein can be normally and stably maintained for a long time. An airtight and highly reliable electronic device that can be operated can be provided. Also,
The outer edge of the metal lid is 0.1 mm from the inner edge of the metallized metal layer.
mm or more and the seam welding between the brazing material and the seam welding, so that the sealing width by the brazing material does not become narrow, and the metal lid and the metallized metal layer are sealed tightly. High and strong bonding can be achieved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of an electronic device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Mounting part 2 ... Metal cover 3 ... Electronic parts 5 Metallized metal layer 6 ... Brazing material

Claims (1)

(57) [Claims] The thickness of the insulating substrate is 10 to 10
A frame-shaped metallized metal layer having a thickness of 50 μm, a width of 0.3 to 0.5 mm , and a sectional shape including a lower surface of a flat surface, an upper surface of a flat surface having a width smaller than the lower surface, and side surfaces of a curved surface. An electronic component is mounted on the inside of the metallized metal layer, and on the upper surface of the metallized metal layer, a metal lid having a lower surface covered with a brazing material, the outer peripheral edge of the metal lid is 0.05 mm from the outer peripheral edge of the metallized metal layer. More inside and from the inner periphery
An electronic device, which is located 0.1 mm or more outside and joined by seam welding with a brazing material therebetween.