JP3078534B1 - Electronic equipment - Google Patents

Abstract

A part of a brazing material for sealing a container adheres to an electronic component housed in the container and hinders normal operation of the electronic component. An electronic component (4) is mounted inside a metal frame (2) attached to an upper surface of an insulating substrate (1).
Metal cover 3 by seam welding through brazing material 8 on the upper surface of
Wherein the melting region W1 of the brazing material 8 by seam welding is 0.1 mm from the outer peripheral edge of the metal lid 3.
mm or more and 0.05 mm or more from the inner peripheral edge of the metal frame 2. The airtightness of the container is high, and there is no adhesion of the brazing material 8 to the internal electronic components 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in which electronic components such as a piezoelectric vibrator and a semiconductor element are hermetically housed in a container formed of an insulating base such as ceramics and a metal cover. .

[0002]

2. Description of the Related Art Electronic components such as a piezoelectric vibrator and a semiconductor element are air-tightly accommodated in a container for accommodating the electronic components to become an electronic device as a product.

[0003] Among the electronic devices, the most reliable one is an insulating base made of ceramics such as an aluminum oxide sintered body and having a mounting portion for mounting electronic components at the center of the upper surface. A metal frame made of an iron-nickel alloy or an iron-nickel-cobalt alloy attached to the upper surface of the base so as to surround the mounting portion; and an iron-nickel alloy or iron joined to the metal frame by seam welding. -An electronic component is hermetically sealed inside a container composed of a metal cover made of a nickel-cobalt alloy.

In an electronic device of this type, after mounting an electronic component on a mounting portion of an insulating base, a metal lid is mounted on a metal frame attached to the insulating base, and an outer peripheral edge of the metal lid is mounted. The roller is rolled while a pair of roller electrodes of a seam welding machine are brought into contact with each other, a large current for welding is passed between the roller electrodes, and a metal lid is seam-welded to a metal frame.

In this type of electronic device,
Normally, a nickel plating film and a gold plating film are previously applied to the surfaces of the metal frame and the metal lid, and a part of the nickel plating film and the gold plating film is melted by heat of seam welding to form a metal. The frame and the metal lid are welded.

However, in this type of electronic device, it is necessary to melt the nickel plating and the gold plating adhered to the metal frame and the metal lid when the metal lid is seam-welded to the metal frame. , About 1000 to weld
High temperatures above ℃ are applied.

When such a high temperature exceeding about 1000 ° C. is applied to the welded portion, this is transmitted as a large thermal shock to the insulating substrate, and as a result, cracks are likely to occur in the insulating substrate due to the large thermal shock. Had problems.

Therefore, when seam welding the metal frame and the metal lid, the melting point between the metal frame and the metal lid is about 800 ° C.
An electronic device welded with the following brazing material interposed has been proposed. According to this electronic device, the metal frame and the metal lid are joined by melting a brazing material having a melting point of about 800 ° C. or less interposed between the metal frame and the metal lid during seam welding. Therefore, it is not necessary to apply a high temperature exceeding 1000 ° C. to the welded portion. Therefore, a large thermal shock is not applied to the insulating base when the metal lid is seam-welded to the metal frame, and it is possible to effectively prevent the occurrence of cracks in the insulating base.

[0009]

However, an electronic component is placed inside a container in which the metal frame and the metal lid are joined by seam welding with a brazing material having a melting point of about 800 ° C. or less interposed therebetween. In electronic devices of the type that is housed in an airtight manner,
When seam welding is performed between the metal frame and the metal lid via a brazing material therebetween, a part of the brazing material melted by the heat of the seam welding scatters inside the container and adheres to the internal electronic components. However, there has been a problem that the normal operation of electronic components may be hindered.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide an electronic device capable of operating electronic components normally without the attachment of brazing material to the internal electronic components. To provide.

[0011]

According to an electronic device of the present invention, an electronic component is mounted inside a metal frame attached to an upper surface of an insulating base and a brazing material is interposed on the upper surface of the metal frame. An electronic device in which a metal lid is joined by seam welding, wherein a melting region of the brazing material by the seam welding is 0.1 mm or more from an outer peripheral edge of the metal lid and an inner peripheral edge of the metal frame. And at least 0.05 mm apart from the

Further, in the electronic device of the present invention, an electronic component is mounted inside a frame-shaped metallized metal layer attached to an upper surface of an insulating base, and a seam is formed on the upper surface of the metallized metal layer via a brazing material. An electronic device in which a metal lid is joined by welding, wherein a melting region of the brazing material by the seam welding is 0.1 mm or more from an outer peripheral edge of the metal lid and from an inner peripheral edge of the metallized metal layer. 0.05mm
It is characterized by being separated as described above.

According to the electronic device of the present invention, the melting region of the brazing material by seam welding is 0.1 m from the outer peripheral edge of the metal lid.
m or more, and is separated from the inner peripheral edge of the metal frame or metallized metal layer by 0.05 mm or more, so that the metal lid is interposed between the metal frame and the metallized metal layer of the insulating base attached to the insulating base. When a part of the brazing material melted by the heat of the seam welding attempts to scatter into the container during seam welding via the brazing material, the splatter is melted on the inner peripheral side of the metal frame or the metallized metal layer. The metal lid is effectively prevented by the brazing filler metal, and the metal lid and the metal frame or the metallized metal layer are firmly joined by a brazing filler metal having a melting area from the outer peripheral edge of the metal lid of 0.1 mm or more.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an electronic device according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an example of an embodiment of the electronic device of the present invention. In the figure, 1 is an insulating base, 2 is a metal frame attached to the insulating base 1, 3 is a metal lid, and 4 is an electronic component such as a piezoelectric vibrator or a semiconductor element. The electronic device is configured by hermetically housing the electronic component 4 in a container including the insulating base 1 to which the metal frame 2 is attached and the metal lid 3.

The insulating substrate 1 functions as a support for supporting the electronic component 4 and is made of a ceramic such as an aluminum oxide sintered body or an aluminum nitride sintered body. 3 is provided. The bottom surface of the recess A forms a mounting portion 1a for mounting the electronic component 4, and the electronic component 4 is mounted on the mounting portion 1a.

If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and a solvent are added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc., and mixed. The ceramic green sheet is formed by adopting a doctor blade method or a calender roll method, which is well known in the art, and thereafter, a plurality of ceramic green sheets are subjected to appropriate punching and laminated at a high temperature. It is manufactured by firing.

Further, a metallized wiring layer 5 made of metal powder of a metal powder such as tungsten or molybdenum, which extends from the upper surface of the mounting portion 1a to the lower surface of the insulating substrate 1, is formed on the insulating substrate 1.

The metallized wiring layer 5 functions as a conductive path for electrically leading each electrode of the electronic component 4 to the outside, and the electrode of the electronic component 4 is provided with a conductive adhesive on the upper surface of the mounting portion 1a. Are electrically connected via The portion of the metallized wiring layer 5 extending to the lower surface of the insulating base 1 is electrically connected to a wiring conductor of an external electric circuit board (not shown) via, for example, solder.

When the metallized wiring layer 5 is made of, for example, metallized tungsten powder, a tungsten paste obtained by adding and mixing an appropriate organic binder and solvent to the tungsten powder is conventionally known on a ceramic green sheet to be used as the insulating substrate 1. Is printed and applied in a predetermined pattern by the screen printing method described above, and is fired together with the ceramic green sheet to be the insulating base 1, so that the insulating base 1 is attached and derived in a predetermined pattern from the upper surface to the lower surface of the mounting portion 1a.

The metallized wiring layer 5 is preferably provided with a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with solder to a thickness of 1 to 20 μm on the exposed surface by plating. In addition, oxidation corrosion of the metallized wiring layer 5 can be effectively prevented, and the connection between the metallized wiring layer 5 and the wiring conductor of the external electric circuit board can be made strong. Therefore, it is preferable that a metal having excellent corrosion resistance, such as nickel and gold, and excellent in wettability with solder is applied to the surface of the metallized wiring layer 5 to a thickness of 1 to 20 μm by plating.

Further, a frame-shaped metallized metal layer 6 having a width of about 0.3 to 0.5 mm and a thickness of about 10 to 50 μm is formed on the outer peripheral portion of the upper surface of the insulating base 1 so as to surround the mounting portion 1a. Have been. The metal frame 2 is attached to the metallized metal layer 6 via a brazing material 7 such as silver-copper brazing.

The metallized metal layer 6 functions as a base metal for joining the metal frame 2 to the insulating base 1, and is made of metal powder such as tungsten and molybdenum. For example, in the case of tungsten powder metallization, a tungsten paste obtained by adding and mixing an appropriate organic binder and solvent to tungsten powder is used as an insulating substrate 1
By applying a conventionally known screen printing method on a ceramic green sheet to become a predetermined thickness and a predetermined pattern in advance and firing it together with the ceramic green sheet to become the insulating base 1, the upper surface of the insulating base 1 is formed. It is formed in a frame shape so as to surround the mounting portion 1a.

The metallized metal layer 6 is preferably formed by plating a metal having excellent corrosion resistance, such as nickel and gold, and excellent wettability with the brazing material 7 to a thickness of 1 to 20 μm on the surface thereof by plating. In addition, the metallized metal layer 6 can be effectively prevented from being oxidized and corroded, and the attachment of the metal frame 2 to the metallized metal layer 6 via the brazing material 7 can be made strong. Therefore, the metallized metal layer 6
Is coated with a metal having excellent corrosion resistance, such as nickel or gold, and excellent wettability with the brazing material 7 by 1 to 20 μm by plating.
m.

The metal frame 2 attached to the metallized metal layer 6 is made of a metal such as an iron-nickel alloy or an iron-nickel-cobalt alloy and has a width of, for example, 0.2 to 0.2.
The thickness is about 0.5 mm and the thickness is about 0.2 to 0.5 mm.

The metal frame 2 functions as a base metal member for welding the metal cover 3 to the insulating base 1. The metal cover 3 is seam-welded to the upper surface thereof with a brazing material 8 interposed therebetween. I have.

The metal frame 2 is preferably coated with a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with the brazing material 8 to a thickness of 1 to 20 μm by plating on the surface thereof. In addition, the metal frame 2 can be effectively prevented from being oxidized and corroded, and the seam welding of the metal lid 3 to the metal frame 2 via the brazing material 8 can be made strong. Therefore, it is preferable to apply a metal having excellent corrosion resistance, such as nickel or gold, and excellent wettability with the brazing material 8 to a thickness of 1 to 20 μm on the surface of the metal frame 2 by plating.

The metal lid 3 seam-welded to the metal frame 2 is made of an iron-nickel alloy plate or an iron-nickel-cobalt alloy plate having a thickness of about 0.1 mm, and is attached to the insulating base 1. The electronic component 4 is hermetically sealed with the insulating base 1 by being joined to the metal frame 2 by seam welding with the brazing material 8 interposed therebetween.

The joining of the metal lid 3 and the metal frame 2 by seam welding is performed by disposing a brazing material 8 between the flat metal lid 2 and the metal frame 2 attached to the insulating base 1. While being mounted, a pair of roller electrodes of a seam welding machine are rolled while being brought into contact with the outer peripheral edge of the metal lid 3, and a large current for welding is passed between the roller electrodes, and the roller electrode and the metal lid are The heat is transmitted to the lower surface of the metal lid 3 to melt a part 8a of the brazing material 8 by causing Joule heat to be generated at the contact portion.

The brazing material 8 disposed between the metal lid 3 and the metal frame 2 is made of silver-copper alloy, gold-tin alloy, lead-tin alloy, aluminum-silicon alloy, copper-zinc alloy.・ Silver
It is made of a copper-phosphorus alloy or a silver-indium-tin alloy and functions as a joining material for joining the metal lid 3 to the metal frame 2, and is provided at a contact portion between the outer peripheral edge of the metal lid 3 and the roller electrode. When the heat generated by the generated Joule heat is transmitted to the outer peripheral portion of the lower surface of the metal lid 3, a part 8a of the metal cover 3 is melted with a melting area W1 corresponding to the heat.

When the brazing material 8 is disposed between the metal cover 3 and the metal frame 2, the lower surface of the metal cover 3 is clad in advance in order to improve the workability of the arrangement. And a thickness of about 10 to 50 μm by plating or the like.

In the electronic device of the present invention, the molten region W1 of the molten brazing material 8a at this time is set to be 0.1 mm or more from the outer peripheral edge of the metal cover 3 and to the inner peripheral edge of the metal frame 2. It is important that the distance from the pair is 0.05 mm or more.

The molten region W1 of the molten brazing material 8a is separated from the outer peripheral edge of the metal cover 3 by 0.1 mm or more and separated from the inner peripheral edge of the metal frame 2 by 0.05 mm or more, so that The attached metal frame 2 and metal lid 3 can be joined with high airtightness and firmly, and even if a part of the molten brazing material 8a tries to fly into the recess 1a of the insulating base 1, The scattering is effectively prevented by the unmelted brazing material 8 inside the molten brazing material 8a serving as a barrier. As a result, a part of the melted brazing material 8a does not adhere to the electronic component 4 accommodated in the concave portion 1a of the insulating base 1 and does not hinder the normal operation of the electronic component 3.

The molten region W1 of the molten brazing material 8a
Is less than 0.1 mm from the outer peripheral edge of the metal lid 3, it becomes difficult to join the metal frame 2 and the metal lid 3 attached to the insulating base 1 with high airtightness and firmly. There is. When the molten region W1 of the molten brazing material 8a approaches less than 0.05 mm with respect to the inner peripheral edge of the metal frame 2, a part of the molten brazing material 8a is exposed and scatters in the concave portion 1a of the insulating base 1, It tends to adhere to the electronic component 4 housed inside the concave portion 1a and impair the accurate operation of the electronic component 4. Therefore, the melting region W1 of the molten brazing material 8a
Must be 0.1 mm or more from the outer peripheral edge of the metal lid 3 and 0.05 mm or more from the inner peripheral edge of the metal frame 2.

The molten region W1 of the molten brazing material 8a
Is set to be 0.1 mm or more from the outer peripheral edge of the metal lid 3 and 0.05 mm or more from the inner peripheral edge of the metal frame 2.
While rolling the roller electrode of the seam welding machine on the outer peripheral edge of the metal cover 3, a current for seam welding is supplied between the roller electrodes to perform the seam welding. May be adjusted to an appropriate value according to the type of the brazing material 8 and the facing width W2 between the metal lid 3 and the metal frame 2.

Thus, according to the electronic device of the present invention, the normal operation of the electronic component 4 is prevented inside the container including the insulating base 1 to which the metal frame 2 is attached and the metal lid 3. Thus, an electronic device housed with high airtightness can be obtained.

It is to be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the scope of the present invention. For example, in the example of the above-described embodiment, the metal lid 3 is seam-welded to the metal frame 2 attached to the insulating base 1, but the metal lid 3 is not necessarily provided via the metal frame 2. It is not necessary to be joined to the insulating base 1. For example, FIG.
As shown in a sectional view, the metal lid 3 may be directly seam-welded to the metallized metal layer 6 via the brazing material 8 without attaching the metal frame 2 to the metallized metal layer 6 of the insulating base 1. . In this case, the melting region W1 of the brazing material 8 is
Is required to be at least 0.1 mm from the outer peripheral edge of the metallized metal layer 6 and separated from the inner peripheral edge of the metallized metal layer 6 by at least 0.05 mm.

[0038]

According to the electronic device of the present invention, the melting region of the brazing material by seam welding is 0.1 m from the outer peripheral edge of the metal lid.
m or more, and is separated from the inner peripheral edge of the metal frame or metallized metal layer by 0.05 mm or more, so that the metal lid is interposed between the metal frame and the metallized metal layer of the insulating base attached to the insulating base. Even if a part of the brazing material melted by the heat of seam welding attempts to fly into the container when seam welding is performed via the brazing material, the scattering is effectively prevented by the unmelted brazing material inside. The metal cover and the metallized metal layer are firmly joined by a brazing material whose melting area from the outer peripheral edge of the metal cover is 0.1 mm or more. as a result,
It is possible to provide an electronic device in which the electronic component can be normally operated without the attachment of the brazing material to the electronic component housed therein, and the electronic component is hermetically sealed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of an electronic device of the present invention.

FIG. 2 is a cross-sectional view showing another example of the embodiment of the electronic device of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Mounting part 2 ... Metal frame 3 ... Metal cover 4 ... Electronic parts 6 ... Metallized metal layer 8 Brazing material W1 Melting region of brazing material W2 ... Opposing width between upper surface of metal frame and metal lid W3 ... Upper surface of metallized metal layer Width facing metal lid

Claims (2)

(57) [Claims] An electronic component is mounted inside a metal frame attached to an upper surface of an insulating base, and a metal lid is joined to the upper surface of the metal frame by seam welding via a brazing material. An electronic device, wherein a melting region of the brazing material by the seam welding is 0.1 m from an outer peripheral edge of the metal lid.
m or more, and 0.05 m from the inner peripheral edge of the metal frame.
An electronic device, which is separated by at least m. 2. An electronic component is mounted inside a frame-shaped metallized metal layer attached to an upper surface of an insulating base, and a metal lid is joined to the upper surface of the metalized metal layer by seam welding via a brazing material. The molten region of the brazing material by the seam welding is 0.1 mm or more from an outer peripheral edge of the metal lid, and is separated by 0.05 mm or more from an inner peripheral edge of the metallized metal layer. An electronic device, comprising: