JPH08150469A - Device for soldering electronic parts - Google Patents

Device for soldering electronic parts

Info

Publication number
JPH08150469A
JPH08150469A JP6292875A JP29287594A JPH08150469A JP H08150469 A JPH08150469 A JP H08150469A JP 6292875 A JP6292875 A JP 6292875A JP 29287594 A JP29287594 A JP 29287594A JP H08150469 A JPH08150469 A JP H08150469A
Authority
JP
Japan
Prior art keywords
bobbin
terminal
soldering
guide plate
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6292875A
Other languages
Japanese (ja)
Other versions
JP3339220B2 (en
Inventor
Hidetoshi Hiwatari
英敏 樋渡
Koji Inoue
浩司 井上
Yuichi Sato
雄一 佐藤
Kazumi Haniyu
一美 羽生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP29287594A priority Critical patent/JP3339220B2/en
Publication of JPH08150469A publication Critical patent/JPH08150469A/en
Application granted granted Critical
Publication of JP3339220B2 publication Critical patent/JP3339220B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE: To provide an excellent soldering device of an electronic parts which has no possibility of bending a terminal caused by heat when soldering, which has also no possibility of causing the defective insulation caused by sticking a solder granule onto a bobbin when soldering, and which can correct and detect the bent of the terminal. CONSTITUTION: This device is composed of a chuck 1 which holds a bobbin 3 of electronic parts from which a terminal is projecting, a bobbin guide 5 which guides this bobbin 3, a terminal guide plate 6 which guides the terminal 4, and a solder tank 11 which solders the terminal 3. Therefore, the terminal 4 can be prevented from bended caused by the heat when soldering with the hole of the terminal guide plate 6, further it can be prevented from sticking a solder granule on the bobbin 3 when soldering.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はボビンから端子が突出し
ている電子部品について、上記端子を溶融半田中に浸漬
して半田付けするのに好適な電子部品の半田付け装置に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component soldering apparatus suitable for soldering an electronic component having a terminal protruding from a bobbin by immersing the terminal in molten solder.

【０００２】[0002]

【従来の技術】従来の電子部品の半田付け装置について
図面を用いて説明する。2. Description of the Related Art A conventional soldering apparatus for electronic parts will be described with reference to the drawings.

【０００３】図４は従来の電子部品の半田付け装置の要
部を示した斜視図であり、同図において３はボビン、１
はこのボビン３を保持するチャック、４はボビン３に取
り付けられた端子、１１はこの端子４に半田付けを行う
ための半田槽であり、このように構成された電子部品の
半田付け装置を用いてチャック１でボビン３を保持した
状態で半田槽１１に端子４を浸漬して半田付けするよう
にしていたものであった。FIG. 4 is a perspective view showing a main part of a conventional soldering apparatus for electronic parts. In FIG. 4, 3 is a bobbin, and 1 is a bobbin.
Is a chuck for holding the bobbin 3, 4 is a terminal attached to the bobbin 3, 11 is a solder bath for soldering to the terminal 4, and a soldering apparatus for electronic parts configured as described above is used. The terminal 4 was dipped in the solder bath 11 for soldering while the bobbin 3 was held by the chuck 1.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら上記従来
の電子部品の半田付け装置では、半田付け時の熱により
端子４が曲がったり、あるいは半田付け時に半田粒がボ
ビン３に付着して絶縁不良の原因になったり、あるいは
端子４の曲がりの検出が困難であるなど多くの課題を有
したものであった。However, in the above-mentioned conventional soldering apparatus for electronic parts, the terminals 4 are bent by the heat during soldering, or the solder particles adhere to the bobbin 3 during soldering, which causes insulation failure. However, there are many problems such as that it is difficult to detect the bending of the terminal 4 or the bending of the terminal 4.

【０００５】[0005]

【課題を解決するための手段】上記課題を解決するため
に本発明の電子部品の半田付け装置は、ボビンから端子
が突出した電子部品のボビンを昇降自在に保持するチャ
ックと、このチャックに保持されて下降する上記ボビン
の外周部をガイドして位置決めするボビンガイドと、上
記端子を挿通してガイドする穴を備えて上記ボビンを載
置する端子ガイドプレートと、この端子ガイドプレート
ならびに上記ボビンガイドを結合した昇降自在なプレー
トと、このプレートの下面に配設され上記端子ガイドプ
レートの穴を挿通して下面側に突出した端子を浸漬させ
て半田付けを行う半田槽からなる構成としたものであ
る。In order to solve the above problems, an electronic component soldering apparatus according to the present invention is a chuck for holding an electronic component bobbin whose terminals project from a bobbin so that the bobbin can be lifted and lowered. A bobbin guide that guides and positions the outer peripheral portion of the bobbin that is lowered, a terminal guide plate that has a hole that inserts and guides the terminal and mounts the bobbin, the terminal guide plate, and the bobbin guide And a soldering tank for soldering by immersing the terminal which is arranged on the lower surface of the plate and is inserted into the hole of the above-mentioned terminal guide plate and protrudes to the lower surface side. is there.

【０００６】[0006]

【作用】この構成により半田付け時の熱により端子が曲
がることを端子ガイドプレートの穴により防ぐことがで
きるばかりでなく、端子ガイドプレートにより半田付け
時にボビンに半田粒が付着することを防ぐことができ
る。With this structure, not only can the terminals of the terminal guide plate be prevented from bending due to heat during soldering, but also the terminal guide plate can prevent solder particles from adhering to the bobbin during soldering. it can.

【０００７】また、端子が多少曲がった状態で供給され
た場合でも、チャックにより保持されたボビンを下降さ
せるとボビンガイドによりボビンの位置が規正され、更
にボビンを下降させると端子ガイドプレートの穴のテー
パにより端子の曲がりが修正されて半田付けを行い、良
品を取り出すことができる。Further, even when the terminal is supplied in a slightly bent state, when the bobbin held by the chuck is lowered, the position of the bobbin is regulated by the bobbin guide, and when the bobbin is further lowered, the hole of the terminal guide plate is Bending of the terminal is corrected by the taper and soldering is performed, and a good product can be taken out.

【０００８】[0008]

【実施例】以下、本発明の一実施例について図面を用い
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【０００９】図１は同実施例による電子部品の半田付け
装置の概要を示した斜視図であり、同図において３はボ
ビン、４はボビン３にフォーミングされた端子、１はボ
ビン３を保持可能なチャック、５はボビン３をガイドす
るためのボビンガイド、６はボビンガイド５でボビン３
の位置を規正した後、更に端子４を規制してボビン３を
載せるための端子ガイドプレート、１０はボビン３を載
せた端子ガイドプレート６を上下動するためのエアシリ
ンダ、７はボビン３を上下動させるためにエアシリンダ
１０の先端と端子ガイドプレート６を取り付けたプレー
ト、８はプレート７を上下動させるための軸受、９はプ
レート７を上下動させるためのシャフト、１１は端子４
に半田付けを行うための半田槽である。FIG. 1 is a perspective view showing an outline of a soldering apparatus for electronic parts according to the embodiment, in which 3 is a bobbin, 4 is a terminal formed on the bobbin 3, and 1 is a holder for the bobbin 3. Chuck 5, 5 is a bobbin guide for guiding the bobbin 3, and 6 is a bobbin guide 5.
, The terminal guide plate for further restricting the terminal 4 and mounting the bobbin 3 thereon, 10 is an air cylinder for vertically moving the terminal guide plate 6 on which the bobbin 3 is mounted, and 7 is the bobbin 3 up and down. A plate to which the tip of the air cylinder 10 and the terminal guide plate 6 are attached for moving, 8 is a bearing for moving the plate 7 up and down, 9 is a shaft for moving the plate 7 up and down, and 11 is a terminal 4
It is a solder bath for soldering.

【００１０】このように構成された本発明の電子部品の
半田付け装置は、前工程で組み立てられたボビン３をチ
ャック１により保持し、ボビン３を下降させ、ボビンガ
イド５によりボビン３の位置を規正し、更に、ボビン３
を下降させ、端子ガイドプレート６の上にボビン３を供
給する。In the electronic component soldering apparatus of the present invention thus constructed, the bobbin 3 assembled in the previous step is held by the chuck 1, the bobbin 3 is lowered, and the bobbin guide 5 is used to position the bobbin 3. Align and then bobbin 3
Is lowered and the bobbin 3 is supplied onto the terminal guide plate 6.

【００１１】この時、図２に示すように端子４が大きく
曲がった状態で供給された場合には、チャック１により
保持されたボビン３を下降させるとボビンガイド５によ
りボビン３の位置が規正されるが、更にボビン３を下降
させても端子ガイドプレート６の上面に端子４の先端が
当り、ボビン３がその位置以上下がらないために検出セ
ンサ２により不良と判定し、ボビン３はチャック１に保
持されているため、そのまま不良排出する。At this time, as shown in FIG. 2, when the terminal 4 is supplied in a state of being greatly bent, when the bobbin 3 held by the chuck 1 is lowered, the bobbin guide 5 regulates the position of the bobbin 3. However, even if the bobbin 3 is further lowered, the tip of the terminal 4 comes into contact with the upper surface of the terminal guide plate 6 and the bobbin 3 does not lower than that position. Since it is held, it is discharged as it is.

【００１２】また、図３（ａ）に示すように端子４が多
少曲がった状態で供給された場合には、チャック１によ
り保持されたボビン３を下降させるとボビンガイド５に
よりボビン３の位置が規正され、更にボビン３を下降さ
せると、図３（ｂ）のように端子ガイドプレート６の穴
のテーパにより端子４の曲がりが修正されて端子ガイド
プレート６の上に置かれる。次にチャック１が閉じ、ボ
ビン３は解放され、エアシリンダ１０により、プレート
７を下げることにより端子ガイドプレート６及びボビン
３が下がり、図３（ｃ）に示すように端子４に半田付け
が行われ、一定時間後、エアシリンダ１０によりプレー
ト７を上げることにより端子ガイドプレート６及びボビ
ンが上がり、チャック１が下降し、チャック１が開くこ
とにより、ボビン３を保持し次工程へ供給するように構
成されたものである。Further, when the terminal 4 is supplied in a slightly bent state as shown in FIG. 3 (a), when the bobbin 3 held by the chuck 1 is lowered, the bobbin guide 5 moves the bobbin 3 to a position. When the bobbin 3 is set down and further lowered, the bending of the terminal 4 is corrected by the taper of the hole of the terminal guide plate 6 as shown in FIG. 3B, and the terminal 4 is placed on the terminal guide plate 6. Next, the chuck 1 is closed, the bobbin 3 is released, the plate 7 is lowered by the air cylinder 10, the terminal guide plate 6 and the bobbin 3 are lowered, and the terminal 4 is soldered as shown in FIG. 3 (c). After a certain time, the terminal guide plate 6 and the bobbin are raised by raising the plate 7 by the air cylinder 10, the chuck 1 is lowered, and the chuck 1 is opened so that the bobbin 3 is held and supplied to the next step. It is composed.

【００１３】[0013]

【発明の効果】以上のように本発明の電子部品の半田付
け装置は、端子ガイドプレートを付加することにより半
田付け時の熱により端子が曲がることを防ぐことができ
るばかりでなく、端子ガイドプレートにより半田付け時
にボビンに半田粒が付着することを防ぐことができる。As described above, in the electronic component soldering apparatus of the present invention, by adding the terminal guide plate, the terminal can be prevented from being bent due to heat at the time of soldering, and the terminal guide plate can be prevented. Thus, it is possible to prevent the solder particles from adhering to the bobbin during soldering.

【００１４】また、端子が多少曲がった状態で供給され
た場合に、チャックにより保持されたボビンを下降させ
るとボビンガイドによりボビンの位置が規正され、更に
ボビンを下降させると端子ガイドプレートの穴のテーパ
により端子の曲がりが修正されて半田付けを行い、良品
を取り出すことができる。When the terminal is supplied in a slightly bent state, when the bobbin held by the chuck is lowered, the position of the bobbin is regulated by the bobbin guide, and when the bobbin is further lowered, the hole of the terminal guide plate is Bending of the terminal is corrected by the taper and soldering is performed, and a good product can be taken out.

【００１５】また、端子が大きく曲がった状態で供給さ
れた場合には、チャックにより保持されたボビンを下降
させるとボビンガイドによりボビンの位置が規正される
が、更にボビンを下降させても端子ガイドプレートの上
面に端子の先端が当り、ボビンがその位置以上下がらな
いために検出センサにより不良の判定ができ、かつボビ
ンはチャックに保持されているためにそのまま不良排出
できるという優れた効果が得られるものである。Further, when the terminal is supplied in a state of being greatly bent, when the bobbin held by the chuck is lowered, the position of the bobbin is regulated by the bobbin guide, but even if the bobbin is further lowered, the terminal guide is lowered. Since the tip of the terminal hits the upper surface of the plate and the bobbin does not lower than that position, it is possible to determine a defect by the detection sensor, and since the bobbin is held by the chuck, it can be discharged as it is. It is a thing.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例による電子部品の半田付け装
置の概要を示した斜視図FIG. 1 is a perspective view showing an outline of an electronic component soldering apparatus according to an embodiment of the present invention.

【図２】同実施例の動作を部分断面で示した要部正面図FIG. 2 is a front view of an essential part showing the operation of the embodiment in a partial cross section.

【図３】同実施例の動作を部分断面で示した要部正面図FIG. 3 is a front view of an essential part showing the operation of the embodiment in a partial cross section.

【図４】従来の電子部品の半田付け装置の要部の概要を
示した斜視図FIG. 4 is a perspective view showing an outline of a main part of a conventional electronic component soldering device.

【符号の説明】[Explanation of symbols]

１ チャック ２ 検出センサ ３ ボビン ４ 端子 ５ ボビンガイド ６ 端子ガイドプレート ７ プレート ８ 軸受 ９ シャフト １０ エアシリンダ １１ 半田槽 1 chuck 2 detection sensor 3 bobbin 4 terminal 5 bobbin guide 6 terminal guide plate 7 plate 8 bearing 9 shaft 10 air cylinder 11 solder bath

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 13/08 Ｋ 8315−4Ｅ (72)発明者 羽生 一美 大阪府門真市大字門真1006番地 松下電器 産業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Internal reference number for FI Technical indication H05K 13/08 K 8315-4E (72) Inventor Kazumi Hanyu 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Denki Sangyo Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 ボビンから端子が突出した電子部品の上
記ボビンを昇降自在に保持するチャックと、このチャッ
クに保持されて下降する上記ボビンの外周部をガイドし
て位置決めするボビンガイドと、上記端子を挿通してガ
イドする穴を備えて上記ボビンを載置する端子ガイドプ
レートと、この端子ガイドプレートならびに上記ボビン
ガイドを結合した昇降自在なプレートと、このプレート
の下面に配設され上記端子ガイドプレートの穴を挿通し
て下面側に突出した端子を浸漬させて半田付けを行う半
田槽からなる電子部品の半田付け装置。1. A chuck that holds the bobbin of an electronic component whose terminals protrude from the bobbin so that the bobbin can move up and down, a bobbin guide that guides and positions the outer peripheral portion of the bobbin that is held by the chuck and descends, and the terminal. A terminal guide plate having a hole for inserting and guiding the bobbin, an ascendable / descendable plate combining the terminal guide plate and the bobbin guide, and the terminal guide plate disposed on the lower surface of the plate An electronic component soldering device comprising a soldering tank for soldering by immersing a terminal projecting to the lower surface side through the hole. 【請求項２】 チャックに保持されてボビンガイドにガ
イドされた電子部品の高さを検出することにより端子の
曲がり不良を検出するようにした検出センサを備えた請
求項１記載の電子部品の半田付け装置。2. The solder for an electronic component according to claim 1, further comprising a detection sensor for detecting the bending defect of the terminal by detecting the height of the electronic component held by the chuck and guided by the bobbin guide. Attachment device.
JP29287594A 1994-11-28 1994-11-28 Electronic component soldering equipment Expired - Fee Related JP3339220B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29287594A JP3339220B2 (en) 1994-11-28 1994-11-28 Electronic component soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29287594A JP3339220B2 (en) 1994-11-28 1994-11-28 Electronic component soldering equipment

Publications (2)

Publication Number Publication Date
JPH08150469A true JPH08150469A (en) 1996-06-11
JP3339220B2 JP3339220B2 (en) 2002-10-28

Family

ID=17787517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29287594A Expired - Fee Related JP3339220B2 (en) 1994-11-28 1994-11-28 Electronic component soldering equipment

Country Status (1)

Country Link
JP (1) JP3339220B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019050231A (en) * 2017-09-07 2019-03-28 カルソニックカンセイ株式会社 Mounting device and mounting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019050231A (en) * 2017-09-07 2019-03-28 カルソニックカンセイ株式会社 Mounting device and mounting method

Also Published As

Publication number Publication date
JP3339220B2 (en) 2002-10-28

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