JPH01129446A - Formation of solder bump - Google Patents
Formation of solder bumpInfo
- Publication number
- JPH01129446A JPH01129446A JP28890387A JP28890387A JPH01129446A JP H01129446 A JPH01129446 A JP H01129446A JP 28890387 A JP28890387 A JP 28890387A JP 28890387 A JP28890387 A JP 28890387A JP H01129446 A JPH01129446 A JP H01129446A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder ball
- hole
- circuit board
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 132
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000009736 wetting Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 3
- 230000004927 fusion Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
Description
【発明の詳細な説明】
〔概要〕
回路基板の表面にハンダバンプを形成するための方法に
関し、
ハンダバンプを確実に形成せしめることを目的とし、
回路基板の所定部に対向する位置にハンダボールが嵌合
する透孔が設けられ溶融ハンダに対し非濡れ性を有する
ハンダボール保持板の該透孔に、該透孔の一方の開口面
からの吸気手段でハンダボールを保持せしめ、
該回路基板と、該回路基板に重ねた該ハンダボール保持
板とを、ハンダボール溶融温度に加熱し、該所定部に該
透孔内のハンダボールが溶けてなるハンダバンプを被着
させる構成とする。[Detailed Description of the Invention] [Summary] A method for forming solder bumps on the surface of a circuit board, the purpose of which is to form solder bumps reliably, by fitting solder balls into positions facing predetermined portions of the circuit board. The circuit board and the solder ball are held in the through hole of a solder ball holding plate which is provided with a through hole and is non-wettable to molten solder by means of air intake from one opening surface of the through hole. The solder ball holding plate stacked on the circuit board is heated to a solder ball melting temperature, and solder bumps formed by melting the solder balls in the through holes are applied to the predetermined portions.
本発明はハンダバンプの形成方法、特に回路基板上の複
数個所にハンダバンプを同時かつ確実に形成させるため
の改良に関する。The present invention relates to a method for forming solder bumps, and particularly to an improvement for simultaneously and reliably forming solder bumps at multiple locations on a circuit board.
回路基板の表面に回路素子を搭載する等のため形成する
ハンダバンプの形成方法には、めっきを利用した方法、
ハンダベーストを利用した方法。Methods for forming solder bumps for mounting circuit elements on the surface of circuit boards include methods using plating,
Method using solder base.
ハンダボールを利用した方法等があり、数百μｍの厚さ
のハンダバンプは、ハンダペーストまたはハンダボール
を利用する。しかし、ハンダペーストを利用した方法は
、ハンダハンプの周辺部がだれるという欠点があり、か
かる欠点なしに形成するには、ハンダボールを利用する
方法が採られている。There are methods such as using solder balls, and solder bumps with a thickness of several hundred μm are made using solder paste or solder balls. However, the method using solder paste has the disadvantage that the peripheral portion of the solder hump sag, and in order to avoid this disadvantage, a method using solder balls has been adopted.
第４図はハンダボールを利用した従来のハンダバンプ形
成方法を説明するための図である。FIG. 4 is a diagram for explaining a conventional method of forming solder bumps using solder balls.
第４図において、ハンダフラックス３を被着した回路基
板１上の複数個所（図は５ケ所）の所定部２に、それぞ
れハンダボール４を搭載し、そのハンダボール４を溶融
させてハンダバンプを形成させる従来方法は、各所定部
２に対向する透孔６を明けたハンダボール搭載板５と、
所定部２に対向しハンダボール４より小径の吸気孔８を
形成したハンダボールキャリヤ７とを利用する。In FIG. 4, solder balls 4 are mounted on predetermined portions 2 at multiple locations (five locations in the figure) on the circuit board 1 coated with solder flux 3, and the solder balls 4 are melted to form solder bumps. The conventional method is to provide a solder ball mounting plate 5 with through holes 6 facing each predetermined portion 2;
A solder ball carrier 7 is used in which a suction hole 8 facing the predetermined portion 2 and having a smaller diameter than the solder ball 4 is formed.
図示しない真空装置に接続し、該装置の駆動によって空
洞９内の空気が吸引されるキャリヤ７は、回路基板１の
設置位置と多数のハンダボール４を収容した容器（図示
せず）との間を移動し、回路基板１に搭載したハンダボ
ール搭載板５の各透孔６に、ハンダボール４を挿入させ
る。A carrier 7 is connected to a vacuum device (not shown), and the air in the cavity 9 is sucked by the drive of the device. is moved, and the solder balls 4 are inserted into the through holes 6 of the solder ball mounting plate 5 mounted on the circuit board 1.
そこで、回路基板１とハンダボール搭載板５とを重ねた
状態で一緒に加熱し、ハンダボール搭載板５の各透孔６
に挿入されたハンダボール４を溶融させると、回路基板
ｌの所定部２にはハンダバンプが形成されるようになる
。Therefore, the circuit board 1 and the solder ball mounting board 5 are heated together in a stacked state, and each through hole 6 of the solder ball mounting board 5 is heated.
When the solder balls 4 inserted into the circuit board 1 are melted, solder bumps are formed on the predetermined portions 2 of the circuit board 1.
以上説明したように、ハンダボール４を使用した従来の
ハンダバンプ形成方法は、ハンダボール４より小径の吸
気孔８の開口端に、ハンダボール４を吸気力で保持せし
めて搬送し、吸気力を解除してハンダボール４を落下せ
しめ透孔６に挿入させるが、軟質のハンダボール４が吸
気孔８の開口端に食いつき、吸気力を解除するも落下し
ないことがあるという問題点があった。As explained above, in the conventional solder bump forming method using the solder ball 4, the solder ball 4 is held at the open end of the intake hole 8, which has a smaller diameter than the solder ball 4, by suction force, is conveyed, and the suction force is released. Although the solder ball 4 is caused to fall and inserted into the through hole 6, there is a problem in that the soft solder ball 4 bites into the open end of the air intake hole 8 and may not fall even if the air intake force is released.
上記問題点の除去を目的とした本発明は、第１図の実施
例によれば、回路基板ｌの所定部２に対向する位置にハ
ンダボール４が嵌合する透孔１６が設けられ、溶融ハン
ダに対し非濡れ性を有するハンダボール保持板１５の透
孔１６に、透孔１６の上方のからの吸気手段でハンダボ
ール４を保持せしめ、回路基板１と、回路基板１に重ね
たハンダボール保持板１５とを、ハンダボール溶融温度
に加熱し、所定部２に透孔１６内のハンダボール４が溶
けてなるハンダバンプ１０を被着させることを特徴とし
たハンダバンプの形成方法である。According to the embodiment shown in FIG. 1, the present invention is aimed at eliminating the above-mentioned problems. A through hole 16 into which a solder ball 4 fits is provided at a position facing a predetermined portion 2 of a circuit board l, and The solder balls 4 are held in the through holes 16 of the solder ball holding plate 15, which is non-wetting to solder, by air suction means from above the through holes 16, and the solder balls 4 are held on the circuit board 1 and the solder balls stacked on the circuit board 1. This method of forming a solder bump is characterized in that the holding plate 15 is heated to a solder ball melting temperature, and a solder bump 10 formed by melting the solder ball 4 in the through hole 16 is applied to a predetermined portion 2.
本発明によれば、ハンダボール保持板の透孔に該透孔の
一方からの吸気手段でハンダボールを保持せしめ、該保
持板と回路基板とを重ねて加熱して該透孔内のハンダボ
ールを溶かし、回路基板の所定部にハンダバンプを形成
させることで、ハンダボールの移し換えの行われないこ
とがあるという従来方法の問題点を除去し、ハンダバン
プが確実に形成できるようになる。According to the present invention, the solder balls are held in the through holes of the solder ball holding plate by means of suction from one of the through holes, and the holding plate and the circuit board are overlapped and heated to cause the solder balls in the through holes to be held. By melting the solder bumps and forming solder bumps on predetermined portions of the circuit board, the problem of the conventional method in which the solder balls may not be transferred can be eliminated, and the solder bumps can be reliably formed.
以下に、図面を用いて本発明によるハンダバンプの形成
方法を説明する。The method for forming solder bumps according to the present invention will be described below with reference to the drawings.
第１図は本発明方法の一実施例に係わるハンダバンプ形
成装置の主要部を示す側断面図（（） 、 （ｒｊ）
。FIG. 1 is a side sectional view ((), (rj)) showing the main parts of a solder bump forming apparatus according to an embodiment of the method of the present invention.
.
（ハ）と、ハンダバンプの形成された回路基板の側面図
（＝）である。(c) and a side view (=) of the circuit board on which solder bumps are formed.
第１図において、装置はハンダボールキャリア１１と、
ハンダボール保持具１２と、回路基板１を搭載する台１
３を具えてなる。In FIG. 1, the device includes a solder ball carrier 11,
A stand 1 on which a solder ball holder 12 and a circuit board 1 are mounted
It has 3.
図示しない真空装置に接続し、台１３の配設位置と多数
のハンダボールを収容した容器との間を移動し、該移動
端で上下動するハンダボールキャリア１１は、下方に開
口する凹所１４と保持具１２の嵌合する凹所１９を具え
てなる。The solder ball carrier 11 is connected to a vacuum device (not shown), moves between the installation position of the stand 13 and a container containing a large number of solder balls, and moves up and down at the end of the movement. and a recess 19 into which the holder 12 fits.
ハンダボール保持具１２は、回路基板１の所定部２に対
向しハンダボールの嵌合自在な透孔１６をあけた保持板
１５とハンダボールより小径の透孔１８をあけた吸引板
１７からなり、透孔１６と１８とは同心に形成されてい
る。ただし、ハンダボールの溶融時にも使用するハンダ
ボール保持具１２は、溶融ハンダに対し非濡れ性であり
、従って保持板１５と吸引板１７とは、例えばインバー
にクロームめっきを施してなる。The solder ball holder 12 consists of a holding plate 15 facing a predetermined portion 2 of the circuit board 1 and having a through hole 16 into which a solder ball can be fitted, and a suction plate 17 having a through hole 18 smaller in diameter than the solder ball. , the through holes 16 and 18 are formed concentrically. However, the solder ball holder 12, which is also used when melting the solder balls, is non-wettable with the molten solder, and therefore the holding plate 15 and the suction plate 17 are made of, for example, invar plated with chrome.
台１３の上面には、上方に突出する少なくとも一対の突
起２０と、回路基板１の嵌合する四部２１を設け、周囲
にスペーサ２３を張設してなり、突起２０の嵌合する凹
所２２をキャリア１１に形成し、突起２０の貫通する貫
通孔２４が保持具１２に形成されている。The upper surface of the stand 13 is provided with at least a pair of protrusions 20 projecting upward and four parts 21 into which the circuit board 1 fits, a spacer 23 is stretched around the periphery, and a recess 22 into which the protrusions 20 fit. is formed in the carrier 11, and a through hole 24 through which the protrusion 20 passes is formed in the holder 12.
このようなハンダボールキャリア１１．ハンダボール保
持板１２１台１３を具えた装置を使用し、回路基板１の
所定部２には、ハンダバンプ１０が形成される。Such a solder ball carrier 11. Solder bumps 10 are formed on predetermined portions 2 of circuit board 1 using a device equipped with solder ball holding plates 121 and 13.
第２図（イ）〜（ニ）は前述の装置を使用し７、ハンダ
バンプを形成させる方法の手順を説明するための図であ
る。FIGS. 2(A) to 2(D) are diagrams for explaining the steps of a method for forming solder bumps using the above-mentioned apparatus 7.
第２図（イ）において、キャリア１１の凹所１９にハン
ダボール保持具１２を嵌合せしめ、その保持具１２の下
面がハンダボール容器のハンダボールと接する状態で、
凹所１４内を排気（減圧）させると、保持板１５の各透
孔１６にハンダボール４が嵌合、保持されるようになる
。In FIG. 2(A), the solder ball holder 12 is fitted into the recess 19 of the carrier 11, and the lower surface of the holder 12 is in contact with the solder ball of the solder ball container.
When the inside of the recess 14 is evacuated (depressurized), the solder balls 4 are fitted into each through hole 16 of the holding plate 15 and held.
他方、台１３の凹所２１には第２図（ＴＩ）に示すよう
に、ハンダバンプを形成ずべき所定部２を形成し、ハン
ダフラックス３の被着された回路基板１を嵌合させる。On the other hand, as shown in FIG. 2 (TI), a predetermined portion 2 where a solder bump is to be formed is formed in the recess 21 of the stand 13, and the circuit board 1 coated with the solder flux 3 is fitted therein.
そこで第２図（ハ）に示すように、突起２０に凹所２２
を嵌合せしめて台１３にキャリア１１を重ね、凹所１４
の排気を解除した後、第２図（ニ）に示すように、ハン
ダボール保持具１２を残してキャリア１１をを除去し、
ハンダボール保持具１２の搭載された台１３をハンダ溶
融温度に加熱すると、各ハンダボール４は溶けて第１図
（＝）示すように、所定部２の」二にハンダバンプ１０
が形成される。Therefore, as shown in FIG.
The carrier 11 is placed on the stand 13, and the recess 14 is fitted.
After releasing the exhaust, remove the carrier 11 leaving the solder ball holder 12 as shown in FIG. 2(d).
When the stand 13 on which the solder ball holder 12 is mounted is heated to the solder melting temperature, each solder ball 4 melts and forms a solder bump 10 on the second part of the predetermined portion 2, as shown in FIG.
is formed.
第３図（（） 、 （＋１）は本発明方法の他の実施例
による装置の要部を示す側断面図である。FIG. 3 ((), (+1) is a side sectional view showing the main parts of an apparatus according to another embodiment of the method of the present invention.
第３図（イ）において、図示しない真空装置に接続され
るキャリア３１には、その凹所３２を覆うように回路基
板取り付は治具３３が装着される。周囲にスペーサ３７
を張設した下面の中央部の凹所に回路基板１が嵌合する
治具３３には、下方に突出する少なくとも一対の突起３
４と、上下方向に貫通する貫通孔３６を具えてなる。回
路基板ｌの所定部２に対向しハンダボール４が嵌合自在
な透孔３８を有するハンダボール保持板３５は、突起３
４に嵌合する透孔′３９を具えてなる。In FIG. 3(A), a circuit board mounting jig 33 is attached to a carrier 31 to be connected to a vacuum device (not shown) so as to cover a recess 32 thereof. Spacer 37 around
The jig 33 in which the circuit board 1 fits into the recess in the center of the lower surface on which the
4, and a through hole 36 penetrating in the vertical direction. A solder ball holding plate 35 that faces a predetermined portion 2 of the circuit board l and has a through hole 38 into which a solder ball 4 can fit freely has a protrusion 3
4 and a through hole '39 that fits into the hole '39.
キャリア３１の下に取り付は治具３３を装着し、治具３
３の下にハンダボール保持板３５を嵌合せしめ、キャリ
ア３１の接続された真空装置を駆動すると、透孔３８に
嵌合したハンダボール４は、図中に実線矢印で示す減圧
排気流によって、透孔３８内に保持されるようになる。Attach the mounting jig 33 under the carrier 31, and
When the solder ball holding plate 35 is fitted under the carrier 31 and the vacuum device connected to the carrier 31 is driven, the solder balls 4 fitted into the through holes 38 are moved by the reduced pressure exhaust flow shown by the solid line arrow in the figure. It comes to be held within the through hole 38.
そこで、キャリア３１を上下方向にひつくり返してから
真空装置の排気を解除し、キャリア３１を取り除くと第
３図（０）に示すように、各透孔３８にハンダボール４
の嵌合する保持板３５が治具３３に搭載された状態にな
り、治具３３を保持板３５と共にノ＼ンダ溶融温度に加
熱すると、各ハンダボール４は溶けて第１図（ニ）示す
ようをハンダバンプ１０が形成される。Therefore, when the carrier 31 is turned over vertically, the exhaust of the vacuum device is released, and the carrier 31 is removed, a solder ball 4 is inserted into each through hole 38, as shown in FIG. 3(0).
When the retaining plate 35 that is fitted is mounted on the jig 33 and the jig 33 is heated together with the retaining plate 35 to the melting temperature, each solder ball 4 melts as shown in FIG. 1(d). Thus, solder bumps 10 are formed.
以上説明したように本発明によれば、ハンダボール保持
板の透孔に該透孔の一方からの吸気手段でハンダボール
を保持せしめ、該保持板と回路基板とを重ねて加熱して
該透孔内のハンダボールを溶かし、回路基板の所定部に
ハンダバンプを形成させることで、ハンダボールを使用
したハンダバンプの形成が従来方法よりか確実となり、
混成集積回路等においてハンダバンプのチエツクおよび
修正の工数を著しく低減させた効果がある。As explained above, according to the present invention, the solder balls are held in the through holes of the solder ball holding plate by the suction means from one of the through holes, and the holding plate and the circuit board are overlapped and heated to form the through holes. By melting the solder balls in the holes and forming solder bumps on predetermined parts of the circuit board, the formation of solder bumps using solder balls is more reliable than with conventional methods.
This has the effect of significantly reducing the number of man-hours for checking and correcting solder bumps in hybrid integrated circuits and the like.
第１図は本発明方法の一実施例に係わる装置の主要部と
ハンダバンプを示す図、
第２図は第１図に示す装置を使用したハンダバンプ形成
手順を説明するための図、
第３図は本発明方法の他の実施例による装置の要部を示
す図、
第４図はハンダボールを利用した従来のハンダバンプ形
成方法の説明図、
である。
図中において、
１は回路基板、
２は回路基板の所定部、
４はハンダボール、
ｌＯはハンダバンプ、
１５．３５はハンダボール保持板、
１６．３８は透孔、
を示す。
主ｔｓとハゾダバ／フ゛Σ水す園
ンプ小夾士傾を吉も明４ろに約、ｎＴＺＪ第？ ｍ
１９４８月方法の七ｎ笑′うそ七、捌ｌ二よろ製置ル９
掌＃１５２示すｍ
第 ５ 図FIG. 1 is a diagram showing the main parts of an apparatus and solder bumps according to an embodiment of the method of the present invention, FIG. 2 is a diagram for explaining the solder bump forming procedure using the apparatus shown in FIG. 1, and FIG. FIG. 4 is an explanatory diagram of a conventional solder bump forming method using solder balls. In the figure, 1 is a circuit board, 2 is a predetermined portion of the circuit board, 4 is a solder ball, IO is a solder bump, 15.35 is a solder ball holding plate, and 16.38 is a through hole. The main TS and Hazodaba/FΣSuisuenpu 小夾士 inclined to Yoshimo Ming 4ro, nTZJ part? m 1948 August method 7 n lol 'lie 7, 12 Yoro production le 9
Palm #152 shows m Fig. 5
Claims (1)
ダボール（４）が嵌合する透孔（１６または３８）が設
けられ、溶融ハンダに対し非濡れ性を有するハンダボー
ル保持板（１５または３５）の該透孔に、該透孔の一方
の開口面からの吸気手段でハンダボールを保持せしめ、 該回路基板と、該回路基板に重ねた該ハンダボール保持
板とを、ハンダボール溶融温度に加熱し、該所定部に該
透孔内のハンダボールが溶けてなるハンダバンプ（１０
）を被着させることを特徴としたハンダバンプの形成方
法。[Claims] A through hole (16 or 38) into which the solder ball (4) fits is provided at a position facing the predetermined portion (2) of the circuit board (1), and is non-wetting with molten solder. The solder ball is held in the through hole of the solder ball holding plate (15 or 35) having the circuit board and the solder ball holding plate stacked on the circuit board by means of suction from one opening surface of the through hole. The plate is heated to a solder ball melting temperature, and a solder bump (10
) A method for forming a solder bump, characterized by depositing a
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62288903A JP2528910B2 (en) | 1987-11-16 | 1987-11-16 | Solder bump forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62288903A JP2528910B2 (en) | 1987-11-16 | 1987-11-16 | Solder bump forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129446A true JPH01129446A (en) | 1989-05-22 |
| JP2528910B2 JP2528910B2 (en) | 1996-08-28 |
Family
ID=17736277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62288903A Expired - Lifetime JP2528910B2 (en) | 1987-11-16 | 1987-11-16 | Solder bump forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528910B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5403776A (en) * | 1990-06-25 | 1995-04-04 | Fujitsu Limited | Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
| EP0588609B1 (en) * | 1992-09-15 | 1997-07-23 | Texas Instruments Incorporated | Ball contact for flip-chip devices |
| US5985694A (en) * | 1997-09-29 | 1999-11-16 | Motorola, Inc. | Semiconductor die bumping method utilizing vacuum stencil |
| CN109392254A (en) * | 2017-08-04 | 2019-02-26 | 普罗科技有限公司 | Soldered ball or soldering paste loading device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225435A (en) * | 1985-07-25 | 1987-02-03 | Ikeda Jido Kiki Kk | Formation of boding bump |
-
1987
- 1987-11-16 JP JP62288903A patent/JP2528910B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225435A (en) * | 1985-07-25 | 1987-02-03 | Ikeda Jido Kiki Kk | Formation of boding bump |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5403776A (en) * | 1990-06-25 | 1995-04-04 | Fujitsu Limited | Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
| EP0588609B1 (en) * | 1992-09-15 | 1997-07-23 | Texas Instruments Incorporated | Ball contact for flip-chip devices |
| US5985694A (en) * | 1997-09-29 | 1999-11-16 | Motorola, Inc. | Semiconductor die bumping method utilizing vacuum stencil |
| CN109392254A (en) * | 2017-08-04 | 2019-02-26 | 普罗科技有限公司 | Soldered ball or soldering paste loading device |
| CN109392254B (en) * | 2017-08-04 | 2021-01-26 | 普罗科技有限公司 | Solder ball or solder paste mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2528910B2 (en) | 1996-08-28 |
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