JPH0818209A - Suction head for solder ball - Google Patents

Abstract

PURPOSE:To provide a suction head for solder balls capable of reliably positioning solder balls on the electrodes of electronic parts. CONSTITUTION:Holes are made as a matrix layout in the bottom portion 21 of a suction head 1. A plate 4A having holes opened is mounted tightly to the bottom surface of the bottom portion 21. By the vacuum suction inside the suction head 1, solder balls 10 are sucked to the holes by vacuum and are transferred to electrodes 33 of an electric part 30A. The plate 4A is formed by a material having a high lubricity such as fluororesin to which a solder ball cannot stick easily. Also to cope with the kinds of electronic parts 30A, various plates 4A having diversified holes are prepared and changed in accordance with the kind of electronic part 30A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball suction head for vacuum-sucking a solder ball and mounting it on an electrode of an electronic component.

[0002]

2. Description of the Related Art As a method for forming bumps (protruding electrodes) on electrodes of electronic parts, solder balls are vacuum-sucked by a suction head and transferred onto electrodes of electronic parts, and then the solder balls are heated by a reflow device. A method of forming bumps by heating and melting and solidifying in a furnace is known.

The suction head is formed by forming a large number of suction holes at the bottom of the case. The inside of the case is vacuum-sucked by a vacuum suction means such as a vacuum pump to suck the solder balls in the suction holes. The solder balls are aligned with the electrodes of the electronic component and landed on the electrodes, and then the vacuum suction state is released and the suction head is raised to transfer the solder balls onto the electrodes.

[0004]

The solder balls are made of Pb or S.
It is made of a soft alloy with a small hardness such as n.
The diameter of the solder balls is generally 1.0 mm or less, and most of them are about 0.5 mm, which is extremely small. Therefore, as described above, when the solder ball is vacuum-sucked in the suction hole of the suction head, and then the solder ball is landed on the electrode of the electronic component to release the vacuum suction state and the suction head is raised, the solder ball is There is a problem that a transfer error in which the transfer head is lifted together with the suction head while being attached to the suction hole is not transferred to the electrode is likely to occur.

There are many kinds of electronic parts, and the number of electrodes and the arrangement pitch are different depending on the kind of electronic parts.
Therefore, there is a problem in that a suction head having suction holes suitable for various kinds of electronic components must be prepared.

Therefore, it is a first object of the present invention to provide a solder ball suction head capable of eliminating a transfer error caused by a solder ball sticking to a suction hole. It is a second object of the present invention to provide a solder ball suction head that can easily be applied to various kinds of electronic components having different numbers and pitches of electrodes.

[0007]

To this end, the present invention corresponds to a case having a bottom portion having holes corresponding to the positions of the electrodes of various kinds of electronic components, and the positions of the electrodes of the target electronic component. And a plate having suction holes formed therein to form a solder ball suction head, and the plate is replaceably mounted on a flat bottom surface.

[0008]

According to the above structure, a plate having suction holes corresponding to the positions of the electrodes of the electronic component is mounted on the bottom surface of the case, so that a wide variety of electronic components can be handled by simply replacing the plate. be able to.

Further, by using a plate made of a material having a large slipperiness to which the solder balls are unlikely to adhere, the transfer error can be eliminated.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. FIG. 1 is an exploded perspective view of a solder ball suction head according to an embodiment of the present invention, and FIG. 2 is a sectional view of the solder ball suction head. This suction head 1 has an upper case 2
The lower case 3 and the plate 4A mounted on the bottom surface of the lower case 3.

The upper case 2 comprises a box-shaped half case 5 and a flange portion 6 thereof. Pipe 7 on the side of half case 5
Is protruding. The pipe 7 is connected to a vacuum suction means (not shown) such as a pump. A bolt hole 8 is formed in the collar portion 6.

The lower case 3 comprises a box-shaped half case 11 and a flange portion 12 thereof. Bolt hole 1 in collar 12
3 is opened. A packing 14 for sealing is arranged on the collar portion 12. As shown in FIG. 2, the upper case 2 and the lower case 3 are integrated by joining the flange portion 6 and the flange portion 12, inserting the bolt 15 into the bolt holes 8 and 13 and screwing the nut 16. It

FIG. 3 is a plan view of a lower case of a solder ball suction head according to an embodiment of the present invention. The bottom 21 of the half case 11 of the lower case 3 is provided with holes 22 in a matrix form (in the present embodiment, a total of 16 vertically and 4 horizontally). In addition, a large number of holes 23 having a diameter slightly smaller than that of the holes 22 are formed between the holes 22.

In FIG. 1, the suction holes 2 are formed in the plate 4A.
4 are formed in a matrix, and screw holes 25 are formed at the four corners. 26 is a screw. The plate 4A is formed of a material having a large slipperiness to which the solder balls 10 are unlikely to adhere. Examples of the material having high lubricity include fluororesin and ceramics. As shown in FIG. 2, the plate 4A is detachably attached to the bottom surface of the half case 11 with screws 26. In that state, the upper surface of the plate 4A is in close contact with the flat bottom surface of the bottom portion 21. As shown in FIG. 1, the plate 4A is vertically
A total of 16 suction holes 24, each of which is 4 horizontal, have been opened.
All the suction holes 24 match the holes 22 of the bottom 21.
Therefore, the solder balls 10 are vacuum-sucked in the suction holes 24 by vacuum suction of the inside of the case in which the half case 5 and the half case 11 are integrated (see FIG. 1). Also the hole 2
The plate 4A is moved to the bottom 2 by vacuum suction from
It strongly adheres to the flat lower surface of 1 and maintains a flat planar state. That is, the plate 4A is thin and easily bent, and when the plate 4A is bent and the flatness is deteriorated, the solder balls 10 cannot be vacuum-sucked to all the suction holes 24. However, the plate 4A is relatively thick in this way. By vacuum suction and intimate contact with the lower surface of the bottom portion 21 having high rigidity, the flatness of the plate 4A can be maintained. The upper case 2 and the lower case 3 are made of a material having high rigidity such as a stainless steel plate.

In FIG. 1, 30A is an electronic component.
The electronic component 30A is manufactured by bonding the chip 32 to the lower surface of the substrate 31. Electrodes 33 are formed in a matrix on the upper surface of the substrate 31. Therefore,
As shown in FIG. 2, the suction head 1 vacuum-sucks and picks up the solder balls 10 provided in the solder ball supply portion (not shown) in the suction holes 24 of the plate 4A to pick up the electronic component 30A.
, The solder ball 10 and the electrode 33 are aligned with each other, and then the suction head 1 is lowered to move the solder ball 10 to the electrode 33.
After landing on the electrode 33 (see the solder ball 10 shown by the chain line in FIG. 2) and releasing the vacuum suction state,
When the suction head 1 is lifted, the solder balls 10 will move to the electrodes 3
3 is transferred. In this case, since the plate 4A is formed of a material having a high degree of lubricity, the solder balls 10 do not adhere to the suction holes 24 and are reliably transferred onto the electrodes 33 when the suction head 1 is raised. . Although not shown, the electrode 33 is pre-coated with flux. The electronic component 30A on which the solder balls 10 are mounted is sent to the heating furnace of the reflow device and heated, so that the solder balls 1
0 becomes a bump by melting and solidifying.

FIG. 4 is a perspective view of another plate and an electronic component according to one embodiment of the present invention, and FIG. 5 is a sectional view of the solder ball suction head. As shown in FIG. 4, this electronic component 30B
The substrate 31 has four electrodes 33 formed thereon. Correspondingly, four adsorption holes 24 corresponding to the four electrodes 33 are opened in the plate 4B. As shown in FIG. 5, instead of the plate 4A, this plate 4B is used.
Is attached to the bottom surface of the half case 11. As shown in FIG.
Although 16 holes 22 are opened in the bottom portion 21, the plate 4B has only four suction holes 24 formed in the central portion thereof, and therefore the bottom portion 2 is formed as shown in FIG.
Of the 16 holes 22 of 1, the four holes 22 in the center
Only the holes 12 communicate with the suction holes 24 of the plate 4B, and the other 12 holes 22 are closed by the plate 4B. Of course, the plate 4B is also made of a material having a large slipperiness, like the plate 4A. Therefore, this plate 4B
Using, the four solder balls 10 can be vacuum-sucked and transferred to the electrodes 33 of the electronic component 30B as shown in FIG.

FIG. 6 is a plan view of another electronic component of one embodiment of the present invention, and FIG. 7 is a plan view of the same plate. On the substrate 31 of this electronic component 30C, 12 electrodes 33 are formed in a frame shape. Therefore, in the case of such an electronic component 30C, twelve suction holes 24 may be formed in the plate 4C so as to correspond to the positions of these electrodes 33. As described above, the main body of the suction head 1 including the upper case 2 and the lower case 3 is shared, and the solder balls can be mounted on the electrodes of various types of electronic components by exchanging the plates according to the types of electronic components. .

The solder ball suction head of the present invention is
It can easily cope with the difference in the arrangement pitch of the electrodes of the electronic component. That is, when there are electrode arrangement pitches of 1.0 mm pitch and 1.5 mm pitch, the half case 11
If the arrangement pitch of the holes 22 (see FIG. 2) is set to 0.5 mm, the bottom 21 of the half case 11 has 1.0 mm.
Both the pitch plate 4A and the 1.5 mm pitch plate 4A can be mounted.

[0019]

As described above, according to the present invention, the solder balls can be mounted on the electrodes of various kinds of electronic parts by exchanging the plates. Further, by forming the plate with a material having a high slipperiness, it is possible to prevent the solder balls from adhering to the holes, and to reliably transfer all the solder balls to the electrodes of the electronic component.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a solder ball suction head according to an embodiment of the present invention.

FIG. 2 is a sectional view of a solder ball suction head according to an embodiment of the present invention.

FIG. 3 is a plan view of a lower case of a solder ball suction head according to an embodiment of the present invention.

FIG. 4 is a perspective view of another plate and an electronic component according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view of a solder ball suction head according to an embodiment of the present invention.

FIG. 6 is a plan view of another electronic component according to an embodiment of the present invention.

FIG. 7 is a plan view of another plate according to the embodiment of the present invention.

[Explanation of symbols]

 1 Adsorption Head 2 Upper Case 3 Lower Case 4A, 4B, 4C Plate 5 Half Case 21 Bottom 22 Hole 24 Adsorption Hole 30A, 30B, 30C Electronic Component 33 Electrode

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Takatoshi Ishikawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kanji Yahiro, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A case having a bottom having holes corresponding to the positions of electrodes of various types of electronic components, and a plate having suction holes corresponding to the positions of electrodes of target electronic components. A solder ball suction head, characterized in that the plate is attached to the flat bottom surface of the bottom portion in a replaceable manner. 2. The solder ball suction head according to claim 1, wherein the plate is made of a material having a greater slipperiness with respect to the solder ball than the bottom portion.