KR100618307B1 - Solder ball supplying apparatus - Google Patents

Abstract

The present invention relates to a solder ball supply apparatus, a ball tool having a vacuum suction hole connected to the space portion and the vacuum portion provided with a vacuum force from the vacuum providing means, and installed in the space to be able to move up and down, the system body Eject means for ejecting the solder ball adsorbed to the vacuum suction hole by the operation cylinder, the ball tool is installed detachably with the system body, the operation cylinder 400 is the system body 100 even during conversion Since it is attached to it, there is no need for the pneumatic connection operation associated with the operation cylinder 400 and the wiring connection operation of the sensor for detecting the operation state of the operation cylinder 400.

Semiconductor, BGA, Solder Ball, Ball Tool

Description

Solder ball supplying device

1 is a vertical cross-sectional view showing a bonded state of the solder ball supply apparatus according to the first embodiment of the present invention,

2 is an enlarged cross-sectional view showing an enlarged main part of the solder ball supply device shown in FIG.

Figure 3 is a vacuum flow diagram of the solder ball supply device shown in Figure 1,

Figures 4a and 4b is an enlarged cross-sectional view showing a state when the solder ball is adsorbed in the solder ball supply device shown in Figure 1,

5A and 5B are enlarged cross-sectional views showing a state when solder balls are ejected in the solder ball supply device shown in FIG.

Figure 6 is a vertical cross-sectional view showing a coupling state of the solder ball supply apparatus according to a second embodiment of the present invention,

FIG. 7 is a vertical sectional view showing a connection state between the vacuum providing means and the space part in the solder ball supply device shown in FIG. 6;

8 is a vacuum flow diagram of the solder ball supply device shown in FIG.

9 is a vertical cross-sectional view showing a bonded state of the solder ball supply apparatus according to a third embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

100: system main body 110: main through hole

120: vacuum hose 130: vacuum sensor

140: solenoid valve 150: vacuum source

160: up-down bar 170: up-down board

200: ball tool 210: tool body

212: Tool Body Hole 216: Guide Shaft

220: tool cover 222: vacuum suction hole

230: space portion 240: tool block

300: ejection means 310: moving plate

312: moving plate hole 314: spring seating groove

318: stopper 320: pin fixing plate

322: pin fixing plate hole 330: pin housing

332: pin housing hole 340: eject pin

350: up-down block 360: guide plate

400: working cylinder 410: push bar

500: elastic means 510: spring guide shaft

600: control device 700: detachable means

710: fastening ring 720: fastener

800: ball box 900: semiconductor substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball supply device, and more particularly, to a solder ball supply device for adsorbing solder balls and supplying them to a flux-coated semiconductor substrate.

In general, a semiconductor component is manufactured by attaching a semiconductor chip on which a highly integrated circuit such as a transistor or a capacitor is formed on a semiconductor substrate made of silicon, and then molding it with resin paper or the like. Among the semiconductor components, a solder ball (Solder Ball), which serves as a lead frame, is adhered to a lower surface of the semiconductor substrate so as to be energized with a chip, called a solder ball type package (BGA Package). On the other hand, in order to manufacture such a solder ball type package, a device for absorbing a solder ball made of small spherical lead and supplying it to a flux-coated semiconductor substrate is required. Such a device is a solder ball supply device.

Conventional solder ball supply apparatus has a ball tool formed with a vacuum suction hole and a space portion, an eject pin which is installed to be capable of lifting and lowering the space portion, and ejecting the solder ball adsorbed in the vacuum suction hole, and the operation of raising and lowering the eject pin It consists of a cylinder and a system body provided with a vacuum providing means for providing a vacuum pressure to the space.

Here, the eject pin is fixed to the pin moving plate installed to be movable up and down in the space portion, the operation cylinder is fixed to the pin moving plate by a moving shaft to raise and lower the pin holding plate. The actuating cylinder is also fixed to the tool body of the ball tool. That is, since the moving shaft of the actuating cylinder is fixed to the pin moving plate and the actuating cylinder is fixed to the tool body of the ball tool, the actuating cylinder and the ball tool form a conversion kit as a single unit.

However, in the case of the conventional solder ball supply device, if the ball tool needs to be replaced according to various types of semiconductor substrates or solder balls, the ball tool including the operation cylinder must be replaced with the conversion kit. In general, a working cylinder is included as a conversion kit due to the fact that one solder ball supply has to work on various types of semiconductor substrates, causing various problems. For example, the operating cylinders are also replaced at each conversion, so the pneumatic connection work associated with the operation cylinders and the wiring of the sensors that detect the operation of the operation cylinders are quite cumbersome and difficult.

The present invention has been made to solve the above problems, an object of the present invention is to provide a solder ball supply device configured to exclude the operation cylinder for raising and lowering the eject pin from the conversion kit.

Another object of the present invention is to configure the operation cylinder for raising and lowering the eject pin to be excluded from the conversion kit and at the same time to form two or more spaces independently partitioned by the ball tool, to control the vacuum to be provided in each space sequentially It is to provide a solder ball supply device that can reliably absorb the solder ball.

In order to achieve the above object, the solder ball supply apparatus according to the present invention is provided with a ball tool is formed with a vacuum suction hole communicating with the space portion and the space portion is provided with a vacuum force from the vacuum providing means, and the space portion can be moved up and down And ejecting means for ejecting the solder ball adsorbed to the vacuum suction hole by an operation cylinder installed in the system main body, wherein the ball tool is detachable from the system main body.

The ball tool is characterized in that the up-down block for transmitting the actuation force of the actuating cylinder to the ejecting means is installed to be able to move up and down.

The ball tool is characterized in that the elastic means for elastically supporting the ejection means in the upward direction.

The lowering operation of the ejecting means is performed by the operation cylinder, and the raising operation of the ejecting means is performed by the elastic means.

The system body and the ball tool are provided with detachable means for fastening the ball tool to the system body detachably.

The ejecting means is fixed to the moving plate installed in the space portion to enable the lifting and lowering by the operating force provided from the operating cylinder, the pin fixing plate coupled to the lower portion of the moving plate and linked to the moving plate, It is characterized by consisting of a plurality of eject pins for ejecting the solder ball adsorbed in the vacuum suction hole while being inserted into the vacuum suction hole.

On the other hand, the solder ball supplying apparatus according to the present invention is provided with a vacuum force from the vacuum providing means and the ball tool formed with two or more spaces separated from each other and the vacuum suction hole communicating with the space portion, and each of the space portion It is installed to be lowered, and comprises an ejecting means for ejecting the solder ball adsorbed to the vacuum suction hole by the operation cylinder installed in the system body, the ball tool is detachable from the system body, the respective space portion sequentially A vacuum force is provided.

Each of the space portion is characterized in that the ejecting means for ejecting the solder ball adsorbed in the vacuum suction hole is installed to be able to move up and down.

An up-down plate fixed to the operation cylinder is installed at the lower end of the system body, and the upper end of the ball tool is elastically supported upward by a predetermined elastic means and receives the operating force from the up-down plate and transmits it to the ejection means. It is characterized in that the plate is installed.

The upper end of the ball tool is coupled to the ejection means by a guide shaft, characterized in that the guide plate is provided to be elastically supported in the upward direction by the elastic means and at the same time receives the lowering force from the operating cylinder.

Hereinafter, a solder ball supply apparatus according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In describing the embodiments according to the present disclosure, the same names and the same reference numerals will be given to the components corresponding to the components of the embodiments described above. In addition, symmetrically arranged or a plurality of components will be described with reference numerals to only one of them.

1 is a vertical cross-sectional view showing a solder ball supply device according to a first embodiment of the present invention in a bonded state, FIG. 2 is an enlarged cross-sectional view showing an enlarged main part of the solder ball supply device shown in FIG. 1, and FIG. The vacuum flow chart of the solder ball supply device shown in FIG.

As shown in Figures 1 to 3, the solder ball supply apparatus according to the first embodiment is largely the system body 100, the ball tool 200, the ejection means 300, the working cylinder 400 and the elastic means 500 Consists of For reference, in FIG. 3, the solid line indicates the flow of pneumatic and vacuum, and the dotted line indicates the flow of the electric signal.

The system body 100 is a body of the solder ball supply device, and is installed to be horizontally moved to a conveying means (not shown). The system body 100 is provided with a vacuum hose 120 connected to the vacuum source 150, this vacuum hose 120 is coupled to the fitting 122. In addition, the fitting 122 has a main through-hole 110 is formed. In addition, the system body 100 is provided with a vacuum providing means for providing a vacuum force to the space portion 230 of the ball tool 200.

As shown in Figure 3, such a vacuum providing means is a vacuum sensor 130 for detecting a vacuum state of the space portion 230, to adjust whether or not to provide a vacuum force in accordance with the detection signal of the vacuum sensor 130 It consists of a vacuum solenoid valve 140 and a vacuum source 150 connected to the vacuum solenoid valve 140. In addition, the vacuum sensor 130 and the vacuum solenoid valve 140 is electrically connected to the control device 600 is controlled.

Meanwhile, in the present embodiment, the vacuum providing means is composed of a combination of the vacuum source 150 and the vacuum solenoid valve 140, but design conditions such as a combination of a pneumatic solenoid valve (not shown) and a vacuum pump (not shown) connected to the pneumatic source. It can be selected in various ways.

The ball tool 200 is an element to which the solder ball is directly adsorbed, and is largely composed of a tool body 210, a tool block 240, and a tool cover 220. A vacuum space 230 is formed between the tool body 210, the tool block 240, and the tool cover 220. The tool body 210 is detachably coupled to the system body 100, and a tool body hole 212 connected to the main through hole 110 is formed therethrough. In addition, the tool body 210 is provided with an up-down block 350 provided with an operating force of the operation cylinder 400 to be vertically movable. In addition, the guide shaft 216 and the spring guide shaft 510 is fixed to the tool body 210 in the vertical downward direction.

The tool block 240 is fastened to the lower portion of the tool body 210 and the inside thereof is empty. In the internal space of the tool block 240, a stopper stopper 242 on which the stopper 318 of the moving plate 310 is blocked is formed. The tool cover 220 is fastened to the lower portion of the tool block 240 and the inside thereof is empty. The lower surface of the tool cover 220 has a plurality of vacuum adsorption holes 222 through which solder balls are adsorbed.

The system body 100 and the ball tool 200 are provided with detachable means 700 to allow the ball tool 200 to be easily replaced from the system body 100. In this embodiment, the detachable means is composed of a fastening ring 710 attached to the system body 100 and a fastener 720 attached to the ball tool 200 to be attached to and detached from the fastening ring 710.

However, the detachable means 700 is not limited thereto, and various fastening means such as bolts and screws may be selected. In addition, although the tool body 210 and the tool block 240 are configured as separate elements in this embodiment, they may be integrally formed according to design conditions.

The ejection means 300 is composed of a moving plate 310, a pin fixing plate 320, a pin housing 330 and a plurality of eject pins (340). The movable plate 310 is installed to be moved up and down in the internal space of the tool block 240, and a movable plate hole 312 connected to the tool body hole 212 is formed therethrough. In addition, the movable plate 310 is formed with a spring seating groove 314 into which the following compression spring 500 is inserted and seated, and a guide bush 316 into which the guide shaft 216 is inserted and supported. The moving plate 310 is guided to the guide shaft 216 to move vertically so that it operates smoothly. In addition, a stopper 318 is provided at a lower edge of the moving plate 310 to limit a lowering range of the moving plate 310. The pin fixing plate 320 is fastened to the lower portion of the movable plate 310, and the pin housing 330 is fastened to the lower portion of the pin fixing plate 320.

The eject pin 340 is a component for ejecting the vacuum suction solder ball while being inserted into the vacuum suction hole 222. The eject pin 340 is fixedly supported by the pin fixing plate 320 and the pin housing 330. In addition, a pin fixing plate hole 322 is formed through the pin fixing plate 320, and a pin housing hole 332 connected to the vacuum suction hole 222 is formed in the pin housing hole 332.

The actuating cylinder 400 is an element for imparting a descending actuation force to the ejection means 300. The operation cylinder 400 is installed detachably from the ball tool 200 in the system body 100. A push bar 410 is provided at the lower end of the operation cylinder 400 to transmit an operating force to the up download block 350. Since the push bar 410 is not fixed to the up-down block 350, the ball tool 200 may be easily separated from the system body 100 and the operation cylinder 400.

In the present embodiment, two operating cylinders 400 are used, but the number of operating cylinders 400 may be appropriately selected according to design conditions. In addition, the meaning of the cylinder in the actuation cylinder 400 is used in a broad sense, and any driving means may be used as long as the actuation force can be applied to the up-down block 350.

The elastic means 500 is an element for moving the ejection means 300 upward. The elastic means 500 is inserted into the spring seating groove 314 of the moving plate 310 is installed to elastically support the moving plate 310 in the upward direction. That is, the lowering of the ejection means 300 including the moving plate 310 is made by the operating force of the operation cylinder 400, and the raising of the ejection means 300 including the moving plate 310 is the elastic means. By the elastic return force of 500. The elastic means 500 is an element necessary for raising the movable plate 310 because the operation cylinder 400 is not fixed to the up-down block 350.

On the other hand, in the present embodiment, such elastic means 500 is composed of a compression coil spring 500, but if it can move the other elements of the moving plate 310 or the ejection means 300 upwards and various elastic means and Drive means may be used.

Hereinafter, the operation of the solder ball supply apparatus according to the first embodiment will be described in detail with reference to the accompanying drawings.

4A and 4B are enlarged cross-sectional views illustrating a state when solder balls are sucked in the solder ball supply device shown in FIG. 1, and FIGS. 5A and 5B are views when solder balls are ejected in the solder ball supply device shown in FIG. An enlarged cross-sectional view showing the state.

First, it will be described when the solder ball is adsorbed in the solder ball supply.

3, 4A and 4B, when the solenoid valve 140 is opened, a vacuum force is transmitted to the space 230 through the main through hole 110 and the tool body hole 212, The vacuum force transmitted to the space 230 is transmitted through the vacuum suction hole 222. At this time, the outside air is strongly introduced through the vacuum adsorption hole 222, the solder balls are adsorbed to the vacuum adsorption hole 222.

As such, since the push bar 410 of the operation cylinder 400 is spaced apart from the up-down block 350 in the state where the solder ball is adsorbed, the operation force of the operation cylinder 400 is not transmitted to the moving plate 310. . In this case, since the movable plate 310 is elevated by the elastic force of the compression spring 500, the eject pin 340 is also lifted up and separated from the vacuum suction hole 222.

Next, a description will be given when the solder ball is ejected from the solder ball supply device.

When the adsorption of the solder ball is completed, the solder ball supply device is moved to the flux-coated semiconductor substrate 900 by the transfer means not shown to lay down the solder ball. As such, when the solder ball supply device is moved onto the semiconductor substrate 900, the vacuum force provided to the space portion 230 is released and maintained at atmospheric pressure. At this time, the solder ball may fall onto the semiconductor substrate by its own weight or may still be attached to the vacuum adsorption hole 222. In this state, the eject pin 340 is lowered to eject the solder balls attached to the vacuum suction hole 222.

5A and 5B, in the state in which the solder ball is ejected, the push bar 410 of the operation cylinder 400 applies an operating force to the up-down block 350 so that the up-down block 350 is lowered. do. At this time, the movable plate 310 is lowered to overcome the elasticity of the compression spring 500 as the up-down block 350 is lowered, and the eject pin 340 is also lowered. Thus, the eject pin 340 ejects the solder ball adsorbed in the vacuum adsorption hole 222. That is, the operating force provided from the operation cylinder 400 is transmitted to the eject pin 340 through the up-down block 350, the moving plate 310, and the pin fixing plate 320.

On the other hand, when all the solder balls attached to the vacuum suction hole 222 falls, the operating force of the operating cylinder 400 is released while the eject pin (including the moving plate 310) by the elastic return force of the compression spring (500) 340 rises and the solder ball supply moves again toward the ball box 800 to adsorb new solder balls.

In the embodiment configured as described above, the system body 100 and the tool body 210 are completely separated when the fastener 720 is released during the conversion (replacement). That is, only the toolbar 210 and its lower elements are separated during the conversion. Therefore, even during the conversion, the operation cylinder 400 is attached to the system body 100 as it is, so that the pneumatic connection work associated with the operation cylinder 400 and the wiring connection of the sensor for detecting the operation state of the operation cylinder 400 No work needed.

Hereinafter, a solder ball supply apparatus according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 6 is a vertical cross-sectional view showing a solder ball supplying device according to a second embodiment of the present invention, and FIG. 7 is a vertical cross-sectional view showing a connection state of a vacuum providing means and a space part in the solder ball supplying device shown in FIG.

6 and 7, the solder ball supply apparatus according to the second embodiment also has the same configuration as that of the first embodiment. That is, the solder ball supply apparatus according to the second embodiment includes a system body 100, a ball tool 200, an ejection means 300, an operation cylinder 400, and an elastic means 500. However, the space 230 of the ball tool 200 is provided with two or more partitioned independently of each other, so that the vacuum force is sequentially provided to each of the space 230. Hereinafter, the above description will focus on these differences.

The system body 100 is provided with an actuating cylinder 400 and an actuating bearing 162, and the actuating bearing 162 is inserted with an up-down bar 160 fixed to the up-down plate 170 below. . This actuating bearing 162 serves to guide the up-down bar 160. An up-down plate seating groove 102 is formed at a lower end of the system body 100, and the up-down plate seating groove 102 is provided with an up-down plate 170 fixed to the operation cylinder 400. A stopper 318 for limiting a lowering range of the up-down plate 170 is provided at a lower edge of the up-down plate 170.

The ball tool 200 is composed of a tool body 210 and a tool cover 220 which form four spaces 230 separated from each other. A guide plate seating groove 202 is formed at an upper end of the tool body 210, and the guide plate seating groove 202 is provided with a guide plate 360 provided with operating force from the up-down plate 170. . The guide plate 360 is installed to elastically support in the upward direction by the compression spring 500 installed on the bottom surface of the guide plate seating groove 202. The guide plate 360 is fixed to the ejection means 300 by a guide shaft 216 guided to the guide bush 316 installed on the tool body 210. In addition, as shown in Figure 7, the vacuum force is transmitted to the respective space portion through the vacuum hose 120, the main through hole 110 and the tool body hole (212). Meanwhile, in the present embodiment, the ball tool 200 having four space parts 230 is disclosed, but the number of space parts 230 may be variously selected according to design conditions.

As shown in Fig. 8, in this embodiment, the vacuum providing means is composed of a vacuum source 150, four vacuum solenoid valves 140 and four vacuum sensors 130. However, the vacuum providing means is not limited thereto, and may be variously changed according to design conditions such as a combination of a pneumatic solenoid valve and a vacuum pump.

On the other hand, in this embodiment, the up-down bar 160 and the operation bearing 162 is to facilitate the operation of the up-down plate 170, in some cases may be removed. In addition, the up-down bar 160, the actuating bearing 162 and the up-down plate 170 is removed, and the push bar 410 of the actuating cylinder 400 is moved to the position where the up-down bar 160 is located in the drawing. It is also possible to cause the operation cylinder 400 to press the two guide plates 360 respectively.

The operation state of the second embodiment will be described below.

Fig. 8 is a vacuum flow chart of the solder ball supply device of the second embodiment. In FIG. 8, the solid line represents the flow of pneumatic and vacuum, and the dotted line represents the flow of the electric signal. In addition, for convenience of description, the four components are divided into first, second, third, and fourth from the left side to be described.

As shown in FIG. 8, the control device 600 is connected to the first, second, third and fourth vacuum sensors 130 and the first, second, third and fourth vacuum solenoid valves 140. The control device 600 sequentially opens and closes the first, second, third and fourth vacuum solenoid valves 140 according to the vacuum state signals transmitted from the first, second, third and fourth vacuum sensors 130, The vacuum force is provided to the first, second, third and fourth spaces 230. First, when the first vacuum solenoid valve 140 is opened by the control device 600, the vacuum force provided from the vacuum source 150 is transmitted to the first space 230. At this time, the solder ball is adsorbed to the first vacuum adsorption hole 222 while a rapid air flow occurs in the first vacuum adsorption hole 222 of the ball tool 200.

In this state, when all the solder balls are adsorbed to the first vacuum adsorption hole 222 and the vacuum degree of the first space portion 230 becomes higher than a set value, the first vacuum sensor 130 detects this and then moves to the control device 600. Sending a detection signal, the control device 600 opens the second vacuum solenoid valve 140 to provide a vacuum force to the second space portion 230 so that the solder ball is adsorbed to the second vacuum suction hole 222. When the solder balls are all adsorbed to the first, second, third and fourth vacuum suction holes 222 by repeating this operation, the solder ball supply device moves toward the semiconductor substrate to which the solder balls are to be provided by the transfer means (not shown) to lower the solder balls. Release. As such, when the solder ball supplying device is moved on the semiconductor substrate, the vacuum force provided to each of the spaces 230 is released to maintain the atmospheric pressure. At this time, the solder ball may fall onto the semiconductor substrate by its own weight or may still be attached to the vacuum adsorption hole 222. In this state, the eject pin 340 is lowered to eject the solder balls attached to the vacuum suction hole 222.

As such, in the state where the solder ball is ejected, the push bar 410 of the operation cylinder 400 applies the operating force to the up-down plate 170 to lower the up-down. In this case, the guide plate 360 is lowered by the up-down plate 170 to lower the eject pin 340. Thus, the eject pin 340 ejects the solder ball adsorbed in the vacuum adsorption hole 222. That is, the operating force provided from the operation cylinder 400 is the eject pin 340 through the up-down plate 170, the guide plate 360, the guide shaft 216, the pin moving plate 310 and the pin fixing plate 320. Is passed to.

On the other hand, when all the solder balls attached to the vacuum suction hole 222 falls, the operating force of the operating cylinder 400 is released while the guide plate 360 is raised by the elastic return force of the compression spring 500, The solder ball supply again moves toward the ball box 800 to adsorb new solder balls.

Thus constructed, the solder ball supply apparatus according to the second embodiment has the same effect as that of the first embodiment, and has two or more divided vacuum chambers to sequentially provide the vacuum force to each vacuum chamber. Since the adsorption of solder balls, under the same capacity of vacuum source, the solder balls can be adsorbed effectively even if the diameter of the vacuum adsorption hole is reduced or the area of the vacuum adsorption hole is increased.

Hereinafter, a solder ball supply apparatus according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings.

9 is a vertical cross-sectional view showing a bonded state of the solder ball supply apparatus according to a third embodiment of the present invention.

As shown in Fig. 9, the solder ball supplying apparatus according to the third embodiment has a configuration basically the same as that of the second embodiment. However, in the third embodiment, the four guide plates of the second embodiment are changed to one guide plate 360, and the up-down plate 170, the up-down bar 160, and the actuating bearing 162 of the second embodiment are removed. . That is, one guide plate 360 is designed to perform both the up-down plate 170 and the four guide plates 360. In addition, in the third embodiment, only four guide bushes 316 for guiding the guide shaft 216 are provided, and the remaining guide shaft 216 is provided with an O-ring 317 to prevent leakage of vacuum pressure. have.

Thus constructed, the solder ball supply apparatus according to the third embodiment can reliably adsorb solder balls even with a vacuum source (vacuum pump) of the same capacity while having a simple configuration as compared with the second embodiment.

On the other hand, in the second and third embodiments are configured to adsorb the solder ball while being controlled to sequentially vacuum one of the four space portion 230, depending on the design conditions, the vacuum is sequentially by two space portion 230 May be controlled or at the same time all spaces 230 may be controlled to be vacuum.

As in the above example, the present invention may be variously applied using the same principle by appropriately modifying the above embodiments. Therefore, it should be interpreted that the above description does not limit the scope of the present invention, which is defined by the limits of the following claims.

As described above, the present invention provides a solder ball adsorption apparatus and a adsorption method having a new structure that solves the problem that the operating cylinder is also included as a conversion kit and the operating cylinder must be replaced with each conversion as in the prior art.

That is, in the present invention, when the fastener 720 is released during the conversion (replacement), the system main body 100 and the tool body 210 are completely separated, and the operation cylinder 400 is connected to the system main body 100 even during the conversion. Since it is attached as it is, there is no need for the pneumatic connection operation associated with the operation cylinder 400 and the wiring connection operation of the sensor for detecting the operating state of the operation cylinder 400.

In addition, two or more spaced parts are provided to sequentially adsorb solder balls by providing vacuum force to each space part sequentially, so that the diameter of the vacuum suction hole becomes smaller or the area of the vacuum suction hole is reduced under the same capacity. Even if it is increased, the solder ball can be effectively absorbed. That is, the vacuum adsorption force is increased because it has the same effect as providing a vacuum source of the same capacity to the area of 1 / n (number of vacuum chambers) of the total vacuum adsorption portion area.

Claims (10)

A ball tool detachably coupled to the system body and having a space for providing a vacuum force from a vacuum providing means and a vacuum suction hole communicating with the space; Eject means is installed so as to be elevated in the space, ejecting the solder ball adsorbed in the vacuum suction hole by the operation cylinder installed in the system body, Solder ball supply apparatus is installed on the ball tool comprising an elastic means for elastically supporting the ejection means in the upward direction. The method of claim 1, And the ball tool is provided with an up-down block capable of lifting up and down for transmitting the actuation force of the actuating cylinder to the ejecting means. delete The method of claim 2, The lowering operation of the ejecting means is performed by the operation cylinder, and the raising operation of the ejecting means is performed by the elastic means. The method according to any one of claims 1, 2 and 4, And the detachable means for detachably fastening the ball tool to the system body is provided in the system body and the ball tool. The method according to any one of claims 1, 2 and 4, The eject means, A moving plate provided in the space part so as to be lowered and lowered by an operating force provided from the operating cylinder; A pin fixing plate coupled to the lower portion of the moving plate and interlocked with the moving plate; And a plurality of eject pins fixed to the pin fixing plate and ejecting the solder balls adsorbed to the vacuum adsorption holes while being inserted into the vacuum adsorption holes. A ball tool having two or more spaces partitioned independently from each other and a vacuum suction hole communicating with the spaces; A vacuum providing means for providing a vacuum force to each of the spaces; Eject means is provided so as to be elevated in each of the space, ejecting the solder ball adsorbed in the vacuum suction hole by the operation cylinder installed in the system body, It is installed on the ball tool includes an elastic means for elastically supporting the ejection means in the upward direction, Solder ball supply device characterized in that for controlling the vacuum providing means so that the vacuum force is sequentially provided in each of the spaces. The method of claim 7, wherein Solder ball supply apparatus, characterized in that the ejecting means for ejecting the solder ball adsorbed in the vacuum suction hole in each of the space portion can be raised and lowered. The method of claim 8, An up-down plate fixed to the operation cylinder is installed at the lower end of the system body, and the upper end of the ball tool is elastically supported upward by a predetermined elastic means and receives the operating force from the up-down plate and transmits it to the ejection means. Solder ball supply device characterized in that the plate is installed. The method of claim 8, The upper end of the ball tool is coupled to the ejection means by a guide shaft, the solder ball supply device characterized in that the guide plate is provided to be elastically supported in the upward direction by the elastic means while receiving a lowering force from the operation cylinder .

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