CN109962032B - Precise leveling adsorption table - Google Patents
Precise leveling adsorption table Download PDFInfo
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- CN109962032B CN109962032B CN201711423525.6A CN201711423525A CN109962032B CN 109962032 B CN109962032 B CN 109962032B CN 201711423525 A CN201711423525 A CN 201711423525A CN 109962032 B CN109962032 B CN 109962032B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Abstract
The invention discloses a precise leveling adsorption platform, which comprises: a base; the adsorption disc is arranged on the base through at least three screws which are uniformly distributed; each screw mounting position between the adsorption disc and the base is provided with a leveling device; the leveling device comprises a fixed wedge block, a movable wedge block and a precise actuator, wherein the movable wedge block is movably arranged between the fixed wedge block and the base. Because the leveling device which moves through a wedge is arranged between the base and the adsorption plate, the leveling device converts the left and right movement of the movable wedge block into the up and down movement of the fixed wedge block, thereby realizing the up and down leveling of the adsorption plate, replacing the direct up and down leveling of the adsorption plate in the prior art, and the leveling device realizes the amplification of the up and down movement of the adsorption plate through the arrangement of the inclination rate, thereby having higher leveling precision.
Description
Technical Field
The invention relates to an adsorption bearing device, in particular to a precise leveling adsorption platform.
Background
The silicon chip based on semiconductor wafer is more and more widely used at present, the size has been developed into various series, 4 inches, 6 inches, 8 inches and 12 inches, at present, the maximum size has reached 18 inches, when the silicon chip is processed by semiconductor technology, the silicon chip needs to be carried by a platform with certain adjusting precision, firstly, in order to ensure that the silicon chip keeps extremely high flatness when being processed, the back reference of the silicon chip is required, the commercial silicon chip chuck at present has reached the precision level that the flatness of the whole disk is less than 0.5 μm, and meanwhile, the high precision level needs to be kept in the working process so as to prevent the problems of defocusing and the like in the photoetching process, and therefore, the requirements on a silicon chip adsorption platform are higher and higher. In the field of biochips related to silicon wafers, the chips with different sizes and specifications need to be processed, and besides the function of realizing the same wafer process, the complex working condition of the biochip working is also met, so that special consideration needs to be taken in the design of the adsorption platform.
The current commercial leveling platform is generally divided into a manual leveling platform and an electric leveling platform, wherein the height of the leveling platform is adjusted manually mainly through a linear actuator, and the two heights are adjusted around a pivot to realize inclination adjustment so as to achieve the leveling purpose, and the leveling platform is simple in structure and limited in adjustment precision; the electric adjusting platform mainly drives the height of different positions through an electric actuator, and integrates sensors inside, so that the leveling function is realized, the principle is similar to that of manual operation, but the electric precision is higher, but the cost is higher, for example, PZT piezoelectric ceramics are used as the actuator, a capacitance sensor is used as feedback, the adjusting range is 2mrad, and the adjusting resolution reaches 0.05 mrad; the automatic silicon wafer adjusting platform utilizes a plurality of voice coil motors to realize leveling in a combined motion mode, the precision grating ruler is used as feedback, the adjusting range is 4mrad, the adjusting resolution reaches 0.1 mu rad, and the price of the product is generally high.
In conclusion, the silicon wafer adjusting platform has low manual structure precision and overhigh electric structure cost.
Disclosure of Invention
The application provides a simple structure, with low costs and the high accurate leveling adsorption platform of leveling precision.
An embodiment provides a precision leveling adsorption platform, including:
a base;
the adsorption disc is arranged on the base through at least three screws which are uniformly distributed;
each screw mounting position between the adsorption disc and the base is provided with a leveling device; the leveling device comprises a fixed wedge block, a movable wedge block and a precision actuator, the fixed wedge block is fixed on the bottom surface of the adsorption disc, the movable wedge block is movably arranged between the fixed wedge block and the base, and through holes with the hole diameter larger than the outer diameter of the screw are formed in the fixed wedge block and the movable wedge block; the edge of the base is provided with a raised mounting block, the precision actuator is mounted in the mounting hole of the mounting hole and connected with the movable wedge block, and the precision actuator is used for driving the movable wedge block to move so as to push the adsorption disc to be leveled.
Furthermore, the leveling device also comprises a return spring, one end of the return spring is connected with one end of the movable wedge block relative to the precision actuator, and the other end of the return spring is fixedly installed and is always in a compressed state; the wedge surfaces of the fixed wedge and the movable wedge are inclined downwards towards the center of the adsorption disc.
Furthermore, a counter bore for mounting the screw is arranged on the adsorption disc, the aperture of the counter bore is larger than the outer diameter of the screw, a spherical surface adjusting pad is arranged on the step surface of the counter bore, the spherical surface adjusting pad comprises an upper gasket and a lower gasket which can swing, the lower surface of the upper gasket is a convex spherical surface, and the upper surface of the lower gasket is an inverted conical surface or a concave spherical surface; the screw is arranged on the spherical adjusting pad in a penetrating way.
Further, the base or/and the adsorption disc are/is provided with a placing groove for accommodating the leveling device, and one end of the return spring is fixed on the side wall of the placing groove.
Furthermore, a guide rail is arranged on the base, and the movable wedge block is slidably arranged on the guide rail.
Furthermore, the fixed wedge block and the adsorption disc are of an integrated structure.
Furthermore, at least two mutually independent adsorption belts are arranged on the adsorption surface of the adsorption disc, and the at least two adsorption belts are positioned on the circumferences of the concentric circles with different radiuses.
Furthermore, an annular adsorption groove or a plurality of adsorption holes are arranged on the adsorption belt.
Furthermore, the adsorption disc comprises three adsorption belts, three air receiving ports are formed in the side face of the adsorption disc, and the three air receiving ports are respectively communicated with adsorption grooves or adsorption holes in the three adsorption belts through three mutually independent air passages.
In other embodiments, the precision leveling adsorption platform further comprises an optical detection driving system, which comprises a detection unit, a driving unit and a control processing unit, wherein patterns for leveling detection are arranged on the adsorption surface of the adsorption disc, the detection unit is arranged to face the adsorption surface of the adsorption disc, the driving unit is connected with the precision actuator, and the control processing unit is used for calculating the levelness of the adsorption disc and controlling and driving the precision actuator to adjust the levelness of the adsorption disc.
According to the precise leveling adsorption platform of the embodiment, the leveling device which moves through the wedge shape is arranged between the base and the adsorption plate, the leveling device converts the left and right movement of the movable wedge block into the up and down movement of the fixed wedge block, so that the adsorption plate is driven to level up and down, the direct up and down leveling of the adsorption plate in the prior art is replaced, the up and down movement of the adsorption plate is amplified by the leveling device through the arrangement of the inclination rate, and the precise leveling adsorption platform has higher leveling precision.
Drawings
FIG. 1 is a schematic perspective view of an exemplary precise leveling adsorption stage;
FIG. 2 is a schematic cross-sectional view illustrating an exemplary precise leveling adsorption stage;
FIG. 3 is a schematic top view of an exemplary precision leveling adsorption stage.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings.
The embodiment provides a precise leveling adsorption platform which is mainly used for adsorbing and placing biochips, such as silicon wafers. This accurate leveling adsorbs platform is equipped with levelling device, can the regulation levelness of high accuracy.
As shown in fig. 1 and 2, the precision leveling suction table of the present embodiment mainly includes a base 1, a suction plate 2, and a leveling device 3. The adsorption disc 2 is arranged on the base 1 and fixed by three screws 4 uniformly distributed on the circumference, and a leveling device 3 is arranged at each mounting and fixing position of the adsorption disc 2 and the base 1, namely, the leveling devices 3 in the embodiment have 3, and one surface is determined by three points, so that the adsorption disc 2 can be adjusted by arranging 3 leveling devices 3. In other embodiments, the leveling devices 3 are provided in the same number if the suction plate 2 is fixed by four, six or another number of screws 4.
In this embodiment, in order to install the leveling device 3, the bottom surface of the adsorption disc 2 is provided with an installation groove, and the base 1 is also provided with a shallow groove for installing the leveling device 3 and limiting the leveling device 3, and in other embodiments, the base 1 may also be provided with an installation groove for accommodating the whole leveling device 3.
The leveling device 3 comprises a fixed wedge 31, a movable wedge 32 and a precise actuator 33, wherein the fixed wedge 31 is fixedly arranged at the bottom of an installation groove on the bottom surface of the adsorption disc 2, namely, the upper end surface of the fixed wedge 31 is fixed with the adsorption disc 2, and the lower end surface is a wedge surface. The movable wedge 32 is movably arranged between the fixed wedge 31 and the bottom surface of the groove of the base 1, the upper end surface of the movable wedge 32 is a wedge surface, the slope of the wedge surface is consistent with that of the fixed wedge 31, the wedge surfaces of the movable wedge and the fixed wedge are attached, and the lower end surface of the movable wedge 32 is a plane. The fixed wedge 31 and the movable wedge 32 have through holes for avoiding the screws 4, and the hole diameter of the through holes is larger than the outer diameter of the screws 4 to avoid the swing of the screws 4.
Three raised mounting blocks 11 are arranged on the circumferential edge of the base 1, the mounting blocks 11 are arranged opposite to the mounting grooves of the adsorption disc 2, a precision actuator 33 is mounted in the mounting hole of the mounting block 11 of the base, one end of the precision actuator 33 extends to be connected with the movable wedge 32, and the other end of the precision actuator is used for manual or electric driving. The precision actuator 33 is a precision screw drive, or other drive configuration. In other embodiments, when the recess of the base 1 is provided deep, the precision actuator 33 may be mounted directly on the side wall of the recess of the base 1.
The leveling principle of the embodiment is as follows: the precision actuator 33 is controlled manually or electrically to drive the movable wedge 32 to move horizontally in the base 1, and the movable wedge 32 presses the fixed wedge 31 to move up and down, so that one end of the adsorption disc 2 is driven to move up and down to realize the leveling of the adsorption disc 2.
In order to better realize leveling and reduce the driving force of the precision actuator 33, the leveling device 3 further comprises a return spring 34, the return spring 34 is installed in the installation groove of the adsorption disc 2, one end of the return spring 34 is connected with the other end of the movable wedge 32 opposite to the precision actuator 33, and the other end is fixed on the side wall of the installation groove of the adsorption disc 2. In this embodiment, the return spring 34 is always in a compressed state, and always provides a thrust force for the movable wedge 32, and the inclination directions of the fixed wedge 31 and the movable wedge 32 are inclined downwards towards the center of the adsorption disc 2, so that when the adsorption disc 2 needs to be adjusted upwards, the precise actuator 33 applies a force to drive the adsorption disc 2 to move inwards; when the adsorption disc 2 needs to be downwards adjusted, the precise actuator 33 releases the pushing force, the movable wedge 32 is driven to move outwards by the pushing force of the return spring 34, namely, the return spring 34 replaces the pushing force in one direction, and the adjustment automation is also improved.
In other embodiments, the fixing wedge 31 and the adsorption disk 2 are of an integral structure, that is, the wedge-shaped surface of the fixing wedge 31 is directly machined from the adsorption disk 2.
In other embodiments, the precision of movement of movable wedge 32 is improved to provide the leveling precision of suction plate 2, a high precision guide rail is provided in the recess of base 1, the lower end face of movable wedge 32 is provided with a corresponding guide groove, movable wedge 32 is slidably mounted on the guide rail of movable wedge 32, and the precision of movement control is improved by reducing the friction force between movable wedge 32 and base 1.
In this embodiment, since the adsorption plate 2 will swing during the leveling process, in order to ensure the stable connection of the screws 4, on the basis that the mounting hole of the adsorption disc 2 is set as a counter bore, a spherical adjusting pad 5 is arranged on the step surface of the counter bore, the spherical adjusting pad 5 comprises two washers which are stacked up and down, and a spherical pair is arranged between the two washers, the upper surface of the washer positioned above is a plane, the lower surface is a convex spherical surface, the upper surface of the washer positioned below is an inverted conical surface, or a concave spherical surface, the lower surface is a plane, so that the upper gasket can be stacked on the lower gasket in a swinging way, the diameter of the through holes of the two gaskets is larger than the outer diameter of the screw 4, even if the adsorption disc 2 swings and levels and inclines relative to the screw 4, under the self-adaptive effect of the upper and lower gaskets, the fixed connection of the screws 4 is ensured, and the screws 4 are prevented from being screwed up and fixed to press the adsorption disc 2 back to the original position.
The precise leveling adsorption platform has high leveling precision and can be suitable for adsorption of silicon wafers of different sizes.
As shown in fig. 1 and 3, the adsorption disk 2 is provided with three adsorption belts, the three adsorption belts are respectively provided with three annular adsorption grooves, which are respectively a first adsorption groove 21a, a second adsorption groove 21b and a third adsorption groove 21c from inside to outside, the side surface of the adsorption disk 2 is provided with three air-receiving ports, which are respectively a first air-receiving port 22a, a second air-receiving port 22b and a third air-receiving port 22c, the first air-receiving port 22a is communicated with the first adsorption groove 21a through a first air passage, the second air-receiving port 22b is communicated with the second adsorption groove 21b through a second air passage, and the third air-receiving port 22c is communicated with the third adsorption groove 21c through a third air passage, that is, the three adsorption grooves have mutually independent air passages, and the three adsorption grooves can respectively work independently or together. For example, when the silicon wafer to be sucked covers only the first suction grooves 21a, only the first suction grooves 21a are opened for suction; when the silicon wafer to be adsorbed covers the first adsorption groove 21a, the second adsorption groove 21b and the third adsorption groove 21c, only the third adsorption groove 21c may be opened for adsorption, and for more stable adsorption, the second adsorption groove 21b and the third adsorption groove 21c may be opened simultaneously, or three adsorption grooves may be opened simultaneously.
In other embodiments, the adsorption plate 2 may be provided with other numbers of adsorption grooves to satisfy the adsorption fixation of more silicon wafers with different sizes. For example, two or five rings of adsorption tanks. In addition, the adsorption plate 2 can be provided with adsorption holes which are encircled into a circle to replace an adsorption groove, and an adsorption belt can be formed to realize adsorption on silicon wafers with different sizes.
In other embodiments, the precision leveling adsorption table further comprises an optical detection driving system (not shown in the figure), wherein the optical detection driving system comprises a detection unit, a driving unit and a control processing unit. For the convenience of detection, patterns for leveling detection are arranged on the adsorption surface of the adsorption disc 2. The detection unit of the optical detection driving system is used for facing the adsorption surface of the adsorption disc 2, the driving unit is connected with the precision actuator 33, the control processing unit is used for calculating the levelness of the adsorption disc 2 and controlling and driving the precision actuator 33 to adjust the levelness of the adsorption disc 2, and the precision leveling is automatic detection electric driving leveling and has higher leveling precision and efficiency.
In the precise leveling adsorption platform of the embodiment, assuming that the diameter of the adsorption disc 2 is 200mm, if the precise actuator 33 adopts a fine adjustment screw, the screw pitch is 0.2mm, the manual resolution can reach 3 μm, the inclination of the movable wedge 32 is designed to be 1:10, and the leveling resolution is 3/10/200 ═ 1.5 μ rad; if the precision actuator 33 uses an electric piezoelectric ceramic actuator and uses a capacitance sensor as feedback, the electric resolution can reach 5nm, the inclination of the moving wedge 32 is designed to be 1:10, and the leveling resolution is 5/10/200-2.5 nrad.
Assuming that the diameter of the adsorption tray 2 is 200mm, the outer diameter of the first adsorption tank 21a is 90mm, the outer diameter of the second adsorption tank 21b is 140mm, and the outer diameter of the third adsorption tank 21c is 180mm, the adsorption tray 2 can adsorb silicon wafers of 4 inches, 6 inches, and 8 inches.
According to the precise leveling adsorption platform provided by the embodiment, the leveling device 3 which moves through a wedge shape is arranged between the base 1 and the adsorption disc 2, the leveling device 3 converts the left-and-right movement of the movable wedge block 32 into the up-and-down movement of the fixed wedge block 31, so that the adsorption disc 2 is driven to level up and down, the direct up-and-down leveling of the adsorption disc 2 in the prior art is replaced, the leveling device 3 amplifies the up-and-down movement of the adsorption disc 2 through the arrangement of the inclination rate, and therefore higher leveling precision is achieved. And three mutually independent adsorption tanks are arranged on the adsorption disc 2, so that the adsorption disc 2 can adsorb at least three silicon wafers with different sizes.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (7)
1. A precision leveling adsorption table is characterized by comprising:
the base is provided with a groove and used for installing a leveling device;
the adsorption disc is arranged on the base through at least three screws which are uniformly distributed;
the leveling device is arranged at each screw mounting position between the adsorption disc and the base; the leveling device comprises a fixed wedge block, a movable wedge block and a precision actuator, the fixed wedge block is fixed on the bottom surface of the adsorption disc, a guide rail is arranged on the base, the movable wedge block is slidably arranged on the guide rail, the movable wedge block is movably arranged between the fixed wedge block and the base, and through holes with the hole diameter larger than the outer diameter of the screw are formed in the fixed wedge block and the movable wedge block; the edge of the base is provided with a raised mounting block, the precision actuator is mounted in a mounting hole of the mounting block and connected with the movable wedge block, and the precision actuator is used for driving the movable wedge block to move so as to push the adsorption disc to be leveled;
the leveling device also comprises a return spring, one end of the return spring is connected with one end of the movable wedge block relative to the precision actuator, and the other end of the return spring is fixedly installed and is always in a compressed state; the wedge surfaces of the fixed wedge block and the movable wedge block are inclined downwards towards the center direction of the adsorption disc;
the adsorption disc is provided with a counter bore for mounting a screw, the aperture of the counter bore is larger than the outer diameter of the screw, a spherical surface adjusting pad is arranged on the step surface of the counter bore and comprises an upper gasket and a lower gasket which can swing, the lower surface of the upper gasket is a convex spherical surface, and the upper surface of the lower gasket is an inverted conical surface or a concave spherical surface; the screw penetrates through the spherical adjusting pad.
2. The precision leveling suction table as claimed in claim 1, wherein the base or/and the suction plate is provided with a placement groove for receiving a leveling device, and one end of the return spring is fixed on a side wall of the placement groove.
3. The precision leveling suction table as recited in claim 1 wherein the retaining wedge is a one-piece construction with the suction plate.
4. The precision leveling adsorption platform of any one of claims 1 to 3, wherein at least two mutually independent adsorption bands are arranged on the adsorption surface of the adsorption disk, and the at least two adsorption bands are positioned on the circumferences of concentric circles with different radiuses.
5. The precision leveling adsorption platform of claim 4, wherein the adsorption belt is provided with an annular adsorption groove or a plurality of adsorption holes.
6. The precision leveling adsorption platform of claim 5, wherein the adsorption disk comprises three adsorption belts, three air receiving ports are arranged on the side surface of the adsorption disk, and the three air receiving ports are respectively communicated with the adsorption grooves or the adsorption holes on the three adsorption belts through three mutually independent air passages.
7. The precision leveling adsorption table according to any one of claims 1 to 3, further comprising an optical detection drive system including a detection unit, a drive unit and a control processing unit, wherein the adsorption surface of the adsorption plate is provided with a pattern for leveling detection, the detection unit is arranged to face the adsorption surface of the adsorption plate, the drive unit is connected with a precision actuator, and the control processing unit is used for calculating the levelness of the adsorption plate and controlling and driving the precision actuator to adjust the levelness of the adsorption plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711423525.6A CN109962032B (en) | 2017-12-25 | 2017-12-25 | Precise leveling adsorption table |
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| CN201711423525.6A CN109962032B (en) | 2017-12-25 | 2017-12-25 | Precise leveling adsorption table |
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| CN109962032A CN109962032A (en) | 2019-07-02 |
| CN109962032B true CN109962032B (en) | 2021-05-14 |
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| CN111152146A (en) * | 2020-01-10 | 2020-05-15 | 东莞市磐锐机电科技有限公司 | Vacuum adsorption positioning structure and working method thereof |
| CN114353648B (en) * | 2021-10-29 | 2024-03-26 | 中国航发西安动力控制科技有限公司 | Rapid adjustment leveling device and leveling method for flatness measurement |
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| CN101387731A (en) * | 2008-10-22 | 2009-03-18 | 中国科学院长春光学精密机械与物理研究所 | Reflecting mirror inclination angle trimming regulating mechanism |
| CN103775795A (en) * | 2012-10-24 | 2014-05-07 | 李一凡 | Leveling device |
| CN103822064A (en) * | 2014-03-17 | 2014-05-28 | 武汉华威科智能技术有限公司 | Supporting device with height adjusting and leveling functions |
| CN106895830A (en) * | 2017-03-03 | 2017-06-27 | 中国科学院长春光学精密机械与物理研究所 | A kind of Wedge-type precision levelling gear for optics load light axial adjustment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09252045A (en) * | 1996-03-15 | 1997-09-22 | Matsushita Electric Works Ltd | Wafer holder |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101387731A (en) * | 2008-10-22 | 2009-03-18 | 中国科学院长春光学精密机械与物理研究所 | Reflecting mirror inclination angle trimming regulating mechanism |
| CN103775795A (en) * | 2012-10-24 | 2014-05-07 | 李一凡 | Leveling device |
| CN103822064A (en) * | 2014-03-17 | 2014-05-28 | 武汉华威科智能技术有限公司 | Supporting device with height adjusting and leveling functions |
| CN106895830A (en) * | 2017-03-03 | 2017-06-27 | 中国科学院长春光学精密机械与物理研究所 | A kind of Wedge-type precision levelling gear for optics load light axial adjustment |
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