JP2001267271A - Vacuum chuck apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum chuck apparatus which can chuck vacuously with a high efficiency (a low loss) various chucked objects having different shapes, etc., by providing in the apparatus automatic valve mechanisms of simple structure. SOLUTION: A vacuum chuck apparatus 1A has a vacuum chuck base 2 having a plurality of sucking holes 23 therein, a sucking pump 3, a main pipe 4, branching pipes 5, and valve mechanisms 6A. Each valve mechanism 6A is provided in each flow passage to each sucking hole 23, and it has a tapered flow passage 61, a ball 63 positioned in the tapered flow passage 61, and a spring 64 for energizing the ball 63. In the state of operating the sucking pump 3, the ball 63 is contacted pressingly with an inner surface 62 of the tapered flow passage 61, by the force brought from the pressure change generated in the periphery of the ball 63. Thereby, the valve mechanism 6A at a position where sucking hole aperture 24 is opened is operated so as to clog the tapered flow passage 61 with the ball 63.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction device for holding an object to be suctioned by vacuum suction.

[0002]

2. Description of the Related Art For example, when processing, assembling, transporting, inspecting, measuring, and the like, a suction device having a suction portion having a plurality of suction ports is used to hold an object (work) by vacuum suction. Used.

[0003] While such a suction device can stably hold and hold a work by a plurality of suction ports, it has the following problems. That is, depending on the shape of the work to be sucked, some of the suction ports are left open without being sealed, and a loss of suction force (air leakage) occurs from here. Then, since the entire work is sucked in a state where such a loss occurs, the suction force at the suction port with which the work comes into contact is weakened, and the work is reliably sucked and sucked.
There is a problem that it cannot be retained.

In order to solve this problem, a mechanism is conceivable in which the suction port that is left open is eliminated to increase the force for sucking the object. There was an adsorption device.

[0005] First, there has been a suction apparatus in which a suction unit having suction ports arranged correspondingly is exchanged for a work having a different shape. However, the cost for manufacturing a special suction unit for various kinds of work has been known. However, there is a disadvantage that the efficiency is reduced due to the operation of replacing the suction section even during use.

In addition, there has been a suction device in which the position of each suction port is manually adjusted to conform to the shape of the work. However, every time the work is changed to a work having a different shape, a troublesome manual operation is required. However, there is a disadvantage that the efficiency is reduced.

Therefore, as an alternative to these, a valve mechanism is provided which automatically detects and blocks only the flow path to the suction port which is kept open without contacting the work,
Japanese Patent Application Laid-Open No. Hei 7 (1995) discloses a suction device for preventing air leakage.
-297600.

In the suction device described in the publication, a pressure sensor and an electromagnetic valve are provided in each flow path to each suction port, and the controller compares a set value with a measured value of each pressure sensor by a controller. The configuration is such that a close signal is output only to the electromagnetic valve at which a measured value higher than the value is obtained.

[0009]

However, the apparatus having the above-described valve mechanism requires a pressure sensor and an electromagnetic valve for each suction port, and further requires a controller externally. However, there is a problem that the size and complexity are increased and the manufacturing cost is high.

Further, since electric and electronic parts which dislike water are used for the valve mechanism, there is a problem that they are unsuitable for a suction device for processing, assembling, etc. while flowing washing water or the like.

An object of the present invention is to solve the above-mentioned drawbacks of the prior art. It is an object of the present invention to provide an automatic valve mechanism having a simple structure that does not rely on an electrical mechanism, thereby enabling various kinds of suction objects having different shapes and the like to be provided. An object of the present invention is to provide an adsorption apparatus that can adsorb a substance with high efficiency (with a small loss).

[0012]

This and other objects are achieved by the present invention which is defined below as (1) to (15).

(1) A suction unit having a plurality of suction ports for sucking an object to be suctioned, a suction force generating source for generating a suction force at each of the suction ports, and connected to the suction force generating source. A main pipe, and a branch pipe that branches off from the main pipe and communicates with each of the suction ports, and receives a force due to a pressure change caused by opening of the suction port to block a flow path to the suction port. Characterized in that a valve mechanism that operates as described above is provided.

(2) The valve mechanism includes a flow path having a tapered inner surface, a shielding member capable of shielding the flow path,
An urging member for urging the shielding member, and in an operating state of the suction force generating source, when the suction port is sealed, the shielding member is at a position not shielding the flow path, The suction device according to (1), wherein when the suction port is open, the shielding member is in contact with the tapered inner surface to operate to shield the flow path.

(3) The suction device according to (2), wherein the shielding member closes the suction port by an urging force of the urging member when the suction force generating source is inoperative.

(4) The shielding member is a ball,
The suction device according to the above (2) or (3), wherein the urging member is a spring.

(5) The valve mechanism is housed in a flow path, is composed of a plurality of particles made of an elastic material, and when the suction port is sealed in the operating state of the suction force generating source. The air can pass through the flow path by allowing air to flow through the gaps between the granules, and when the suction port is open, the granules are compressed to reduce or eliminate the gaps, The adsorption device according to the above (1), which operates so as to shield the flow path.

(6) The valve mechanism is housed in a flow path, is formed of a porous body made of an elastic material, and is configured such that when the suction port is sealed in the operating state of the suction force generating source, By allowing air to flow through the pores of the porous body, air can pass through the flow path, and when the suction port is open, the porous body is compressed and the pores shrink or disappear. The adsorption device according to the above (1), which operates so as to shield the flow path.

(7) The suction device according to any one of (1) to (6), wherein the suction port is a suction pad.

(8) The suction device according to any one of the above (1) to (6), wherein the suction section is a suction table having a plurality of suction holes formed on a surface in contact with the suction target.

(9) The suction device according to the above (8), wherein the openings of the suction holes are radially arranged on a surface of the suction table that contacts the suction target.

(10) The suction device according to the above (8) or (9), wherein the surface in contact with the suction target is a flat surface.

(11) The adsorption device according to any one of (1) to (10), wherein the object to be adsorbed is a flat plate material.

(12) The suction device according to (11), wherein the flat plate material is a semiconductor wafer.

(13) The suction section further includes a displacement means for displacing each of the suction ports so as to protrude / retreat toward the suction object, and a plurality of contact sections abutting on the suction object. (1) to (7), wherein the suction port that is not sucking the suction object is retracted when the suction object is being sucked.
The adsorption device according to any one of the above.

(14) The suction device according to the above (13), wherein the displacement means comprises a pneumatic cylinder.

(15) The suction device according to (13) or (14), wherein the suction ports are arranged in a matrix.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a partial sectional side view showing a first embodiment of the suction device of the present invention, and FIG. 2 is a suction device 1 shown in FIG.
A is a plan view, FIG. 3 is a bottom view of the suction device 1A, and FIG.
It is the fragmentary sectional side view which expanded and showed the valve mechanism 6A of the adsorption | suction apparatus 1A. In the following description, the upper side in FIGS. 1 and 4 is referred to as “upper”, and the lower side is referred to as “lower”.

The suction device 1A shown in FIG. 1 is one in which the suction device of the present invention is applied to a suction device in a semiconductor manufacturing machine such as a dicing saw. The suction device 1A includes a suction table 2
, A suction pump (suction force generating source) 3, a main pipe 4, a branch pipe 5, and a valve mechanism 6A. Hereinafter, the configuration of each unit will be described.

The suction table 2 has a disk shape and has an upper surface 21.
The lower surface 22 is flat. The work (sucking object) 12 made of a flat plate material is placed on the suction table upper surface 21.

In the present embodiment, the work 12 is a semiconductor wafer (silicon wafer). Semiconductor wafers usually have a disk shape and are of various types having different diameters and the like.

In the upper portion of the suction table 2, 55 suction holes 23 extending in the vertical direction (thickness direction) are formed, and the upper end of each suction hole 23 is opened to the upper surface 21 of the suction table. I have. The openings 24 of the suction holes 23 are provided on the suction table upper surface 2.
1 constitutes a suction port for sucking the work 12 placed on the work 1.

Further, as shown in FIG. 2, these suction hole openings 24 are arranged radially from the center of the upper surface 21 of the suction table to the outer periphery in 12 directions at equal angular intervals. Further, the arrangement of the suction hole openings 24 is also a quintuple concentric shape with equal radii.

With this arrangement, when one of various disc-shaped works 12 having different diameters or the like is placed so as to be centered on the upper surface 21 of the suction table, any work 12 is brought into contact therewith. The suction hole openings 24 are evenly distributed at approximately the same density. Therefore, with such a configuration, various kinds of works 12 having different diameters or the like can be suctioned with a suction force suitable for each of the works 12 and with a uniform force.

The installation interval of the suction hole opening 24 in the radial direction is as follows.
Although not particularly limited, in the present embodiment, 10 mm
It is preferred that: Further, the suction hole openings 24 may be arranged in a matrix (lattice shape). In this case, both the row interval (row direction pitch) and the column interval (column direction pitch) are 10 mm. It is preferred that:
When the installation interval of the suction hole openings 24 is within such a range, the number of the suction hole openings 24 that come into contact with the semiconductor wafer (work 12) becomes sufficiently large with respect to the size of the semiconductor wafer, and the semiconductor wafer can be more reliably held. Can be adsorbed.

Below each suction hole 23, a tapered flow path 6 is provided.
1 are formed, and each suction hole 23 and each tapered flow channel 61 communicate with each other. The tapered flow channel 61
It has a tapered inner surface 62 whose inner diameter gradually decreases in the downward direction. The minimum inner diameter of the tapered flow channel 61 is the suction hole 2
3 is larger than the inner diameter. This tapered channel 61
Constitutes a part of the valve mechanism 6A as described later.

A connection hole 2 is provided below each tapered flow channel 61.
7 are formed, and the respective tapered flow paths 61 and the respective connection holes 27 communicate with each other. In addition, each connection hole 27
Is opened on the lower surface 22 of the suction table. That is, the suction holes 23, the tapered flow paths 61, and the connection holes 27 form 55 flow paths penetrating from the upper surface 21 to the lower surface 22 of the suction table 2. The inner diameter of the connection hole 27 is larger than the minimum inner diameter of the tapered flow channel 61.

A suction pump 3 for generating a suction force at each suction hole opening 24 is provided separately from the suction table 2. Each suction hole 23 and the suction pump 3 are connected via the main pipe 4 and the branch pipe 5 branched therefrom. Branch pipe 5
Is composed of a first branch pipe 51A and a second branch pipe 52A.

One end of the main pipe 4 is connected to the suction pump 3, and the other end is guided to below the center position of the suction table 2, as shown in FIG.

From a portion of the main pipe 4 located below the adsorption table 2, a C-shaped part 5 composed of arcs having different radii is formed.
Each of the first branch pipes 51A is branched. Thus, the flow path from the suction pump 3 is guided below all positions where the connection holes 27 are arranged.

From the main pipe 4 and the first branch pipe 51A located below the adsorption table 2, a second branch pipe 52A branches upward toward each connection hole 27. The upper side of each second branch pipe 52A is connected to the opening of each connection hole 27 via a joint 53, respectively. Fitting 5
3 is detachable by screwing into the opening of the connection hole 27. With such a configuration, the flow path from the suction pump 3 communicates with each suction hole opening 24, and each suction hole opening 24
Can generate a suction force.

Next, the structure of the valve mechanism 6A will be described with reference to FIG. One valve mechanism 6A is provided for each flow path to each suction hole opening 24. Since each valve mechanism 6A has the same configuration, only one of them will be representatively described below.

The valve mechanism 6A includes a tapered flow path 61,
It is composed of a ball 63 and a spring 64.

As described above, the tapered flow channel 61 is formed inside the adsorption table 2 and has an inner surface (taper surface) 62 whose inner diameter gradually decreases downward.

The ball 63 is located in the tapered channel 61 and forms a shielding member capable of shielding the tapered channel 61. The ball 63 has a spherical shape, and its outer diameter is set to be smaller than the maximum inner diameter and larger than the minimum inner diameter of the tapered flow channel 61, so that the ball 63 can move up and down in the tapered flow channel 61.

Thus, when the ball 63 is above a predetermined position (the position shown in FIG. 6), a gap is formed between the ball 63 and the tapered flow path inner surface 62, so that air can flow. When the ball 63 moves downward from this point to a predetermined position, the ball 63
The flow path is shielded (closed) by contacting the air passage so as to disable the flow of air. Hereinafter, the position at which the ball 63 shields the tapered flow channel 61 (FIG. 6)
Is referred to as a “shielding position”.

A spring 64 is provided below the ball 63. The spring 64 constitutes an urging member for urging the ball 63 upward. Due to this urging force, when the suction pump 3 is in a non-operating state (stop state), the ball 63 comes into contact with the opening (suction hole lower opening) 26 of the suction hole 23 to the tapered flow path 61 from below, and the suction hole 23 23 is closed (the position shown in FIG. 4). This position is
Say "initial position". With such a configuration, it is possible to prevent foreign matter from entering through the suction holes 23 when the suction pump 3 is not operating.

Here, when the suction pump 3 is not operated, the spring 64 is moved until the ball 63 is in the initial position.
Being biased upward by the valve mechanism 6
This is not an essential condition for exhibiting the original function of A.
The spring 64 may urge the ball 63 to a position between the shielding position and the initial position.
That is, in the inoperative state of the suction pump 3, the ball 63 moves to the position shown in FIG.
Say ).

FIGS. 5 and 6 are partial sectional side views showing the state of the valve mechanism 6A when the suction pump 3 is operated (when suction force is generated). Hereinafter, the operation of the suction device 1A will be described with reference to FIGS.

FIG. 4 shows a state of the valve mechanism 6A when the suction pump 3 is not operated. As previously mentioned,
In this state, the ball 63 urged upward by the spring 64 is at the initial position.

When the suction pump 3 starts operating, air flows in from the suction hole opening 24 due to the generated suction force, and an air flow is generated in the flow path. The downward airflow hits the upper portion of the ball 63. As a result, the pressure near the upper portion of the ball 63 becomes larger than the pressure near the lower portion of the ball 63. Thus, a downward force acts on the ball 63 due to a pressure change (pressure difference) generated around the ball 63. As a result, the ball 63 moves from the initial position to the spring 64.
Begins to move downward against the urging force of.

Here, when the suction pump 3 is operated,
The behavior of the ball 63 is different between a position where the suction hole opening 24 is in contact with the work 12 and is sealed, and a position where the suction hole opening 24 is not in contact with the work and is open. Hereinafter, each case will be described.

[Sealing Location of Suction Hole Opening 24] FIG. 5 shows a state of the valve mechanism 6A at a location where the suction hole opening 24 is sealed when the suction pump 3 is operated. At a portion where the suction hole opening 24 is in contact with the work 12 and is sealed, the inflow of air from the suction hole opening 24 is slight, and the airflow is slow. Therefore, the ball 63 as described above
The pressure change around is small. Alternatively, there is no inflow of air from the suction hole opening 24 and the pressure near the lower portion of the ball 63 is slightly lower than that near the upper portion due to the pressure reduction by the suction pump 3. Therefore, the downward force exerted on the ball 63 by these pressure changes is small, and balances with the urging force of the spring 64.

Therefore, the ball 63 does not move downward to the shielding position, but moves to the neutral position where a gap is formed between the ball 63 and the tapered flow path inner surface 62,
Stay here. Thereby, the state in which the air flow path is secured is maintained, and the suction force is transmitted to the work 12.

[Opening Location of Suction Hole Opening 24] FIG. 6 shows a state of the valve mechanism 6A at a location where the suction hole opening 24 is open when the suction pump 3 is operated. At a portion where the suction hole opening 24 is open without contacting the workpiece 12, a large amount of air flows from the suction hole opening 24, so that the airflow is fast and the pressure change around the ball 63 as described above is large. Therefore, the downward force exerted by the pressure change on the ball 63 is large and exceeds the urging force of the spring 64.

Therefore, the ball 63 moves downward to the shielding position. As a result, the tapered flow channel 61 is shielded by the ball 63, and the suction hole opening 24 at this location is blocked.
The flow of air from the air stops. Thereafter, the pressure in the vicinity of the upper portion of the ball 63 in the tapered flow channel 61 becomes substantially equal to the outside air pressure, and the pressure in the vicinity of the lower portion of the ball 63 becomes the pressure reduced by the suction pump 3. The pressure difference between the two exerts a downward force on the ball 63, so that the ball 63
It is pressed against the inner surface 62 of the tapered flow path and keeps the state where the tapered flow path 61 is shielded (shielding position). The spring 64
Is set so that the above-described operation can be performed.

By operating the valve mechanism 6A as described above, only the flow path to the suction hole opening 24 which is not in contact with the work 12 and is opened is automatically blocked, so that air leakage is prevented. And the loss of suction power is small.

As a result, the suction force at the suction hole opening 24 that is in contact with and sucking the work 12 is increased, and the suction device 1A is a work having a shape that does not contact all of the plurality of suction hole openings 24. Can be surely adsorbed. For this reason, the suction device 1A can surely suction any of various semiconductor wafers having different diameters and the like.

In addition, since the suction device 1A does not use an electric mechanism for the valve mechanism 6A, the structure can be simplified. Further, since electric and electronic parts are not used in the valve mechanism 6A, the valve mechanism 6A is not easily affected by water.

FIGS. 7 and 8 are partial sectional side views showing a valve mechanism 6B in a second embodiment of the suction device of the present invention.

Hereinafter, the structure of the second embodiment of the suction apparatus of the present invention will be described with reference to these drawings. The description will be focused on differences from the above-described embodiment, and the same items will be described.
The description is omitted. In the following description, the upper side in FIGS. 7 and 8 is referred to as “upper”, and the lower side is referred to as “lower”.

The suction device of the second embodiment has a valve mechanism 6
Except that the configuration of B is different, it is the same as the adsorption device 1A of the first embodiment.

The valve mechanism 6 B according to this embodiment includes a tapered flow channel 61, a plurality of granular materials 65, and a frame member 67.

The structure of the tapered flow channel 61 is the same as that of the first embodiment, and a plurality of particles 65 are accommodated in the tapered flow channel 61. Here, in the present embodiment, the flow path of the portion that stores the plurality of granular bodies 65 is:
The configuration need not be a tapered shape and may have a constant inner diameter.

Each granular body 65 is made of an elastic material, and its outer diameter in its natural state (state where no external force is applied) is set smaller than the minimum inner diameter of the tapered flow channel 61. Further, the outer diameter of each granular body 65 in the natural state is preferably larger than the inner diameter of the suction hole 23 so as not to pass through the suction hole 23 or clog the suction hole 23.

At the boundary between the tapered flow channel 61 and the connection hole 27, a frame member (or mesh) 67 is provided. The frame member 67 has a lattice shape, and the mesh of the lattice is so fine that at least each of the granular bodies 65 does not pass through. Thereby, each granular body 65 does not escape from the tapered flow channel 61.

Next, the operation of the valve mechanism 6B of the suction device according to the second embodiment will be described. [Sealing Location of Suction Hole Opening 24] FIG. 7 shows a state of the valve mechanism 6B at a location where the suction hole opening 24 is sealed by the work 12 when the suction pump 3 is operated. In this state, as in the first embodiment, the flow of air from the suction hole opening 24 is small and the airflow impinging on the upper part of each granular body 65 is slow, so that the pressure increase near the upper part of each granular body 65 is small. (Small pressure change). Therefore, the force of pressing each granular body 65 downward is small, and each granular body 65 maintains a shape almost in a natural state. For this reason, a flow path for air is ensured through a gap formed between the granular bodies 65.

[Opening Location of Suction Hole Opening 24] FIG. 8 shows a state of the valve mechanism 6B at a location where the suction hole opening 24 is opened without contacting the work 12 when the suction pump 3 is operated. I have. In this state, since a large amount of air flows in from the suction hole opening 24, the airflow hitting the upper part of each granular body 65 is fast, and the pressure increase near the upper part of each granular body 65 is large (the pressure change is large). Therefore, each granular material 6
5 is strongly pressed downward. Thereby, the granular material 6
5 are pressed toward each other below the tapered flow channel 61 and are compressed while elastically deforming each other. For this reason, the gap between the granular bodies 65 decreases or disappears, and the granular bodies 65 block the tapered flow channel 61 (the state shown in FIG. 8), and the inflow of air stops.

Thereafter, due to the downward force exerted by the pressure difference between the pressure below the granular material 65 in the depressurized state by the operation of the suction pump 3 and the external air pressure above, the granular material 65 is formed into a tapered flow path. The posture in which 61 is shielded is maintained.

As described above, the valve mechanism 6B in the suction device of the second embodiment automatically blocks only the flow path to the suction hole opening 24 which is not in contact with the work 12 and is open, thereby preventing air leakage. Exhibits the function of preventing.

In the suction device of this embodiment, the valve mechanism 6
By using a granular material made of an elastic material for B, the accuracy required for the member can be reduced, and therefore, the production is easy and the production cost can be further reduced.

FIGS. 9 and 10 are partial sectional side views showing a valve mechanism 6C in a third embodiment of the suction device of the present invention.

Hereinafter, the structure of the third embodiment of the suction apparatus of the present invention will be described with reference to these drawings, but the description will focus on the differences from the above-described embodiment.
The description is omitted. In the following description, the upper side in FIGS. 9 and 10 is referred to as “upper”, and the lower side is referred to as “lower”.

The suction device of the third embodiment has a valve mechanism 6
Except that the configuration of C is different, it is the same as the adsorption device 1A of the first embodiment.

The valve mechanism 6 C according to this embodiment includes a tapered flow path 61, a porous body 66, and a frame member 67.

The structure of the tapered flow channel 61 is the same as that of the first embodiment. A porous body 66 is accommodated in the tapered flow channel 61. Here, in the present embodiment, the flow path of the portion for storing the porous body 66 does not have to be tapered, and may have a constant inner diameter.

The porous body 66 is made of an elastic material (for example, a foamed material such as foamed polyurethane).
In a natural state, the tapered flow channel 61 has a shape occupying almost the entire area of the internal space.

At the boundary between the tapered flow channel 61 and the connection hole 27, a lattice-shaped frame member 67 is provided. The grid of the frame member 67 has at least the porous body 66 formed in the connection hole 2.
It is so fine that it does not protrude.

Next, the operation of the valve mechanism 6C of the suction device according to the third embodiment will be described. [Sealing Location of Suction Hole Opening 24] FIG. 9 shows a state of the valve mechanism 6C at a location where the suction hole opening 24 is sealed by the work 12 when the suction pump 3 is operated. In this state, as in the first embodiment, the flow of air from the suction hole opening 24 is small and the airflow impinging on the upper part of the porous body 66 is slow, so the pressure increase near the upper part of the porous body 66 is small. (Small pressure change). Therefore, the force for pressing the porous body 66 downward is small, and the porous body 66 maintains a shape almost in a natural state. Therefore, air can flow through the pores of the porous body 66, and a flow path for air is secured.

[Opening Location of Suction Hole Opening 24] FIG.
When the suction pump 3 is operated, the valve mechanism 6 </ b> C at a position where the suction hole opening 24 is opened without contacting the work 12.
The state of is shown. In this state, since a large amount of air flows in from the suction hole opening 24, the airflow hitting the upper part of the porous body 66 is fast, and the pressure increase near the upper part of the porous body 66 is large (the pressure change is large). Therefore, the porous body 66 is strongly pressed downward. As a result, the porous body 66 is pressed toward the lower portion of the tapered flow channel 61 while being compressed to reduce the volume. Finally, FIG.
In this state, the pores of the porous body 66 are reduced or eliminated, the tapered flow channel 61 is blocked, and the inflow of air is stopped.

Thereafter, the porous body 66 is acted upon by the downward force exerted by the pressure difference between the lower pressure of the porous body 66 in a reduced pressure state by the operation of the suction pump 3 and the upper atmospheric pressure.
Maintains the posture in which the tapered flow channel 61 is shielded.

In this way, the valve mechanism 6C in the suction device of the third embodiment automatically blocks only the flow path to the suction hole opening 24 which is not in contact with the work 12 and is open, thereby preventing air leakage. Exhibits the function of preventing.

In the suction device of this embodiment, the valve mechanism 6
By using a porous body made of an elastic material for C, the accuracy required for the member can be reduced, and therefore, the manufacturing is easy and the manufacturing cost can be further reduced.

FIG. 11 is a plan view showing a fourth embodiment of the suction apparatus of the present invention, and FIGS. 12 and 13 are partial cross-sectional side views each showing a part of the suction apparatus 1B shown in FIG.

Hereinafter, the structure of the fourth embodiment of the suction apparatus of the present invention will be described with reference to these drawings. The description will be focused on differences from the above-described embodiment, and the same items will be described.
The description is omitted. In the following description, the upper side in FIGS. 12 and 13 is referred to as “upper”, and the lower side is referred to as “lower”.

The suction device 1B shows a case where the suction device of the present invention is applied to a work suction device in a processing machine. The suction device 1 </ b> B includes a base 7, a plurality of contact parts 8 and suction parts 9, a suction pump 3, a main pipe 4 connected to the suction pump 3, and a pneumatic drive source 10.

The base 7 has a quadrangular (square) disk shape, and its upper surface 71 and lower surface are flat. A plurality of contact portions 8 and suction portions 9 are provided on the base upper surface 71, respectively.
Is erected.

Each of the contact portions 8 has a columnar shape. Further, as shown in FIG. 11, the contact portions 8 are arranged in a matrix (lattice) at equal intervals, and a total of 49 rows and 7 columns are provided.
It is installed individually. Further, each contact portion 8 is provided with an adjacent 4
It is positioned so that the distances to the two suction units 9 are all equal.

Since all the contact portions 8 have the same structure and the same height from the base upper surface 71, the upper end 81 of each contact portion 8 causes a predetermined height from the base upper surface 71. Are formed (see FIG. 12). Each contact portion 8 plays a role in positioning the work 12 (the suction target) placed on the suction device 1B such that the lower surface thereof has the height of the level 82.

Each of the suction portions 9 has a substantially columnar shape. As shown in FIG. 11, the suction units 9 are arranged in a matrix (lattice) at equal intervals, and a total of 6 in 8 rows and 8 columns.
Four are installed. Since each suction unit 9 has the same configuration, one of the suction units 9 will be representatively described below.

As shown in FIG. 12, the suction section 9 includes a pneumatic cylinder 91, a suction pad mounting body 95, and a suction pad 96.

The lower side of the suction section 9 is a pneumatic cylinder 91. The pneumatic cylinder 91 includes a cylinder body 92
And a piston rod 93. Cylinder body 9
2 is fixed to the base upper surface 71 with the opening part facing upward. A piston rod 93 is inserted into the cylinder body 92 so as to be slidable in the vertical direction. The piston rod 93 projects / retracts from an opening of the cylinder body 92. The piston rod 93 is
In contrast, the cylinder can slide while maintaining the airtightness inside the cylinder. The pneumatic cylinder 91 expands and contracts when the piston rod 93 projects / retracts by pneumatic driving, and constitutes a displacement means for vertically displacing the suction pad 96 so as to project / retreat toward the work. It is.

A pneumatic connection port 94 for supplying pneumatic pressure for driving the pneumatic cylinder 91 is provided on a side surface of the cylinder body 92. A pneumatic connection port 94 of each pneumatic cylinder 91 is appropriately connected by a connection pipe 97 and
And are connected to the pneumatic drive source 10.

The pneumatic drive source 10 includes a pneumatic cylinder 91
Both a positive pressure and a negative pressure can be generated inside, and the pneumatic cylinder 91 can be expanded and contracted. Switching between the positive pressure and the negative pressure is performed by a switching valve 11 provided in the pneumatic drive source 10.

At the upper end of the piston rod 93, a suction pad mounting body 95 is fixed. Suction pad mounting body 95
Has a cylindrical shape, and a valve mechanism 6A similar to that shown in the first embodiment is provided therein.

A suction pad 96 is provided at the upper end of the suction pad mounting body 95. The suction pad 96 constitutes a suction port for sucking the work 12 and has a bowl shape. Even if all or a part of the suction pad 96 is made of an elastic material such as various rubbers,
It may be made of a hard material with small elastic deformation. Since the suction port is the suction pad 96, the work 12 can be more airtightly contacted with the work 12 and a larger suction force can be applied.

The height of the suction section 9 up to the tip of the suction pad 96 (hereinafter referred to as "height of the suction section 9") is the same as the level 82 when the pneumatic cylinder 91 is extended to the maximum.
Alternatively, it is set to be slightly higher and lower than the level 82 when the pneumatic cylinder 91 contracts to the minimum.

[0099] The installation interval of the suction unit 9 is not particularly limited. However, in the suction device of a processing machine (machine tool), both the row interval (row direction pitch) and the column interval (column direction pitch) are 100 mm. It is preferred that: When the installation interval of the suction units 9 is within such a range, the number of the suction units 9 in contact with the work 12 becomes sufficiently large with respect to the size of the work 12, and the work 12 can be more reliably sucked. .

A connection port 73 is formed in the side surface 72 of the base 7, and the main pipe 4 is connected to the connection port 73. Thus, the flow path from the suction pump 3 is guided to the inside of the base 7. Base 7
Is divided from the main pipe 4 into a plurality of first branch pipes 5.
1B is formed parallel to the upper and lower surfaces of the base 7. The first branch pipe 51B is appropriately formed so as to reach below all locations where the suction unit 9 is installed.

The first branch pipe 51 located below each suction section 9
From B, the second branch pipes 52B branch upward toward the respective suction portions 9 respectively. The second branch pipe 52B further includes a pneumatic cylinder body 92 and a piston rod 93.
And is formed to extend inside the suction pad mounting body 95 and communicate with the suction pad 96. Second branch pipe 52
Part B has a double structure portion 54 in the middle thereof, which can be expanded and contracted in accordance with expansion and contraction of the pneumatic cylinder 91 by sliding in an airtight manner.

Next, an example (operation) of a method of using the suction device 1B will be described with reference to FIGS.

[1] Before attempting to adsorb an object to be adsorbed, the suction pump 3 is brought into an inoperative state (stop state) and the pneumatic drive source 10 is brought into a positive pressure generating state. In this state, FIG.
As shown in FIG. 2, the internal pressure of the pneumatic cylinder 91 is increased by the pneumatic drive source 10, and the cylinder 91 is extended to the maximum. As a result, the height of all the suction portions 9 becomes the level 8
Same as 2, or slightly higher. The ball 63 of the valve mechanism 6A is at the initial position.

[2] Next, the work 12 having a shape as shown in FIG. 11 is placed on the suction device 1B. At this time, the work 12 contacts the suction unit 9 on the left side in FIGS. 12 and 13, but does not contact the suction unit 9 on the right side in FIGS. 12 and 13. Since the lower surface of the work 12 is located at the level 82,
The suction unit 9 at a position in contact with the work 12 has a level 82
If it is slightly higher, it is pressed by the work 12 and becomes the same height as the level 82. The suction unit 9 at a position not in contact with the work 12 maintains the same height as [1].

[3] After the work 12 is placed, the suction pump 3 is brought into a suction force generating state. Then, in the suction section 9 in which the suction pad 96 is sealed in contact with the work 12, the ball 63 becomes the neutral position, and the suction pad 96 sucks the work 12. In the suction section 9 in which the suction pad 96 is open without contacting the work 12, the ball 63 is in the shielding position, and air leakage is prevented. In addition, all the suction units 9 maintain the same height as [2].

[4] After the work 12 is attracted, the switching valve 11 of the pneumatic drive source 10 is switched so that the pneumatic drive source 10 generates a negative pressure instead of a positive pressure. Then, the inside of the pneumatic cylinder 91 is depressurized, and a force for contracting acts on the pneumatic cylinder 91. As a result, in the suction section 9 that is not sucking the work 12, the pneumatic cylinder 91 contracts and the height is reduced, and the suction pad 9
6 retracts downward (see the suction section 9 on the right side in FIG. 13). On the other hand, in the suction unit 9 that suctions the work 12,
Since the force of the suction pad 96 adsorbing to the work 12 exceeds the force of the pneumatic cylinder 91 to contract, the suction pad 96 does not separate from the work 12 and the height of the suction unit 9 is
It does not change (see the suction section 9 on the left side in FIG. 13). Thus, the suction unit 9 continues to suck the work 12.

[5] After the suction unit 9 that is not sucking the work 12 is retracted, the pneumatic drive source 10 may maintain the negative pressure generation state or may stop. When the negative pressure generation state is maintained, the suction unit 9 that is sucking the work 12
Since the force of the pneumatic cylinder 91 to contract continues to work, the suction force increases.

By the operation described above, in the suction device 1B, the unnecessary suction pads 96 that have not sucked the work 12 are automatically retracted downward. Accordingly, a tool for processing the work 12 does not interfere with the suction pad 96, and is suitable for a suction device of a processing machine.

In the retracted suction pad 96, since the valve mechanism 6A provided inside the suction pad mounting body 95 acts in the same manner as in the first embodiment to block the flow path, no air leakage occurs. Therefore, the suction force of the suction pad 96 that suctions the work 12 increases, and the suction device 1B
Reliably adsorbs and absorbs all types of workpieces with different shapes
Can be held.

Further, since the suction section 9 and the contact section 8 are arranged in a matrix at equal intervals, the suction section 9 and the contact section 8 are not limited to the work 12 of any shape and the position where the work 12 is placed. And the suction part 9 and the contact part 8 are uniformly
Touch 2. With this, the workpieces 12 of various shapes can be suctioned with a suitable suction force, and the whole can be uniformly pressed.
Suction can be performed, and work 12 can be easily set.

As described above, the suction device of the present invention has been described with reference to the illustrated embodiment. However, the present invention is not limited to this, and each part constituting the suction device may have any function capable of exhibiting the same function. It can be replaced with that of the configuration.

For example, the shielding member capable of shielding the tapered flow channel 61 is not limited to the configuration like the ball 63.
It may be in the shape of a cone (cone base) (poppet).

Further, the suction pads 96 are not limited to the independent ones as in the above-described fourth embodiment.
It may be a continuous one in which a plurality of suction pads are formed on a single sheet.

Further, the present invention is not limited to the embodiment in which the suction target placed on the suction device as shown in the embodiment is suctioned from below. It may be adsorbed.

The object to be adsorbed is not limited to a plate-like object, and may have, for example, a certain degree of curved surface or unevenness. Further, by appropriately arranging the suction ports, an object having a more complicated outer shape can be adsorbed.

The suction device of the present invention is not limited to the suction device of a manufacturing machine or a processing machine, but can be applied to, for example, a suction device used for assembling, transporting, inspecting, measuring, and the like.

[0117]

As described above, according to the suction apparatus of the present invention, the flow path to the suction port which is opened without being sealed by the object to be suctioned is automatically blocked, and the air leaks. Is prevented. Thereby, since the suction force can be reduced and the suction can be performed with high efficiency, the suction target can be reliably suctioned.

Since the opening and closing of the flow path to the suction port is automatically selected (set) in accordance with the shape of the suction object, the above-described effect can be obtained for each of various suction objects having different shapes and the like. Can be demonstrated.

Further, the above effect can be achieved by an automatic valve mechanism having a simple structure without using an electric mechanism. For this reason, the structure does not become complicated and large.

Further, since electric and electronic parts which dislike water are not used in the valve mechanism, they are hardly affected by water. Therefore, they are suitable for, for example, an adsorption device of a processing machine used while flowing washing water or the like. .

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional side view showing a first embodiment of a suction device of the present invention.

FIG. 2 is a plan view showing a first embodiment of the suction device of the present invention.

FIG. 3 is a bottom view showing the first embodiment of the suction device of the present invention.

FIG. 4 is an enlarged partial cross-sectional side view showing a valve mechanism of the suction device of the first embodiment.

5 is a partial cross-sectional side view showing an operating state (a suction hole opening sealing portion) of the valve mechanism shown in FIG. 4;

FIG. 6 is a partial cross-sectional side view showing an operating state of the valve mechanism shown in FIG.

FIG. 7 is a partial sectional side view showing a configuration and an operation state (a suction hole opening sealing portion) of a valve mechanism in a second embodiment of the suction device of the present invention.

FIG. 8 is a partial cross-sectional side view showing a configuration and an operation state (a suction hole opening open portion) of a valve mechanism in a second embodiment of the suction device of the present invention.

FIG. 9 is a partial cross-sectional side view showing a configuration and an operating state (a suction hole opening sealing portion) of a valve mechanism in a third embodiment of the suction device of the present invention.

FIG. 10 shows a configuration and an operating state of a valve mechanism according to a third embodiment of the suction device of the present invention (locations where suction holes are opened).
FIG.

FIG. 11 is a plan view showing a fourth embodiment of the suction device of the present invention.

FIG. 12 is an enlarged partial cross-sectional side view showing a part (before workpiece suction) of a fourth embodiment of the suction apparatus of the present invention.

FIG. 13 is an enlarged partial cross-sectional side view showing a part (during work suction) of a fourth embodiment of the suction device of the present invention.

DESCRIPTION OF SYMBOLS 1A, 1B Suction device 2 Suction table 21 Suction table upper surface 22 Suction table lower surface 23 Suction hole 24 Suction hole opening 25 Suction hole opening corner 26 Suction hole lower opening 27 Connection hole 3 Suction pump 4 Main pipe 5 Branch pipe 51A, 51B First branch pipe 52A, 52B Second branch pipe 53 Joint 54 Double structure 6A, 6B, 6C Valve mechanism 61 Tapered flow path 62 Tapered flow path inner surface 63 Ball 64 Spring 65 Granular body 66 Porous Body 67 Frame member 7 Base 71 Base top surface 72 Base side surface 73 Connection port 8 Contact section 81 Contact section upper end 82 Level 9 Suction section 91 Pneumatic cylinder 92 Cylinder main body 93 Piston rod 94 Pneumatic connection port 95 Suction pad mounting Body 96 Suction pad 97 Connecting pipe 10 Pneumatic drive source 11 Switching valve 12 Work

Claims (15)

[Claims] A suction unit provided with a plurality of suction ports for sucking an object to be suctioned; a suction force generation source for generating suction force at each of the suction ports; and a suction force generation source connected to the suction force generation source. A main pipe, and a branch pipe that branches off from the main pipe and communicates with each of the suction ports. The branch pipe receives a force due to a pressure change generated by opening the suction port, and blocks a flow path to the suction port. An adsorption device comprising an actuated valve mechanism. 2. The suction mechanism according to claim 2, wherein the valve mechanism includes a flow path having a tapered inner surface, a shielding member capable of shielding the flow path, and an urging member for urging the shielding member. In the operating state of the above, when the suction port is sealed,
The said shielding member is in the position which does not block the said flow path, and when the said suction opening is open, the said shielding member contacts the said tapered inner surface and operates so that the said flow path may be blocked. The adsorption device according to the above. 3. In a state where the suction force generating source is inactive,
The suction device according to claim 2, wherein the shielding member closes the suction port by an urging force of the urging member. 4. The suction device according to claim 2, wherein the shielding member is a ball, and the urging member is a spring. 5. The valve mechanism is housed in a flow path,
When the suction port is sealed in the operating state of the suction force generating source, air flows through gaps between the granules, and the flow path is formed by a plurality of granules made of an elastic material. The suction device according to claim 1, wherein when the air is allowed to pass and the suction port is open, the granular material is compressed to reduce or eliminate a gap therebetween, and the flow path is shielded. . 6. The valve mechanism is housed in a flow path,
When the suction port is sealed in the operating state of the suction force generating source, the flow path is formed by flowing air through the pores of the porous body. The suction device according to claim 1, wherein when the air is allowed to pass and the suction port is open, the porous body is compressed to reduce or eliminate its pores, and the flow path is shielded. apparatus. 7. The suction device according to claim 1, wherein the suction port is a suction pad. 8. The suction device according to claim 1, wherein the suction unit is a suction table having a plurality of suction holes formed in a surface that contacts the suction target. 9. The suction device according to claim 8, wherein the openings of the suction holes are radially arranged on a surface of the suction table that contacts the suction target. 10. The suction device according to claim 8, wherein the surface that contacts the suction target is a flat surface. 11. The adsorption apparatus according to claim 1, wherein the object to be adsorbed is a flat plate material. 12. The suction device according to claim 11, wherein the flat plate material is a semiconductor wafer. 13. The suction unit further includes: a displacement unit that displaces each of the suction ports so as to protrude / retreat toward the suction target object; and a plurality of contact portions that contact the suction target object. The suction device according to any one of claims 1 to 7, further comprising: a suction port that does not suck the suction target is retracted when the suction target is being sucked. 14. The suction device according to claim 13, wherein the displacement means is constituted by a pneumatic cylinder. 15. The suction device according to claim 13, wherein the suction ports are arranged in a matrix.