KR100618308B1 - Solder ball absorbing apparatus and absorbing method - Google Patents

Abstract

The present invention relates to a solder ball adsorption device, wherein the solder ball adsorption device includes a ball tool having two or more space sections formed therein and separated from each other by a vacuum adsorption unit for vacuum adsorption of the solder ball, and disposed on one side of the ball tool. Including vacuum providing means for sequentially providing a vacuum force to each of the space portion in accordance with the vacuum conditions, by sequentially providing a vacuum force to each space portion to adsorb the solder ball, vacuum adsorption under the same capacity of the vacuum source Even if the diameter of the ball decreases or the area of the vacuum suction hole increases, the solder ball can be effectively absorbed.

BGA, Solder Ball, Sequential, Mounting

Description

Solder ball absorbing apparatus and adsorption method {Solder ball absorbing apparatus and absorbing method}

1 and 2 are vertical cross-sectional views showing a sectional view of the solder ball adsorption device according to the first embodiment of the present invention,

3A and 3B are vertical cross-sectional views showing an operating state of the solder ball adsorption device shown in FIG.

Figure 4 is a vacuum and pneumatic flow diagram of the solder ball adsorption apparatus shown in Figure 1,

FIG. 5 is a block diagram showing an adsorption step using the solder ball adsorption device shown in FIG. 1;

6 and 7 are vertical cross-sectional views showing a sectional view of a solder ball adsorption device according to a second embodiment of the present invention,

8 is a vacuum and pneumatic flow chart of the solder ball adsorption apparatus shown in FIG.

9 is a vertical sectional view showing a sectional view of a solder ball adsorption device according to a third embodiment of the present invention;

10 is a vacuum and pneumatic flow chart of the solder ball adsorption apparatus shown in FIG.

11 and 12 are vertical cross-sectional views showing a sectional view of a solder ball adsorption device according to a fourth embodiment of the present invention,

13 is a vacuum and pneumatic flow chart of the solder ball adsorption apparatus shown in FIG.

14 is a vertical sectional view showing a sectional view of a solder ball adsorption device in accordance with a fifth embodiment of the present invention;

15 is a vacuum and pneumatic flow chart of the solder ball adsorption device shown in FIG.

* Description of the symbols for the main parts of the drawings *

100: ball tool 110: tool body

120: tool cover 122: vacuum suction unit

130: space portion 200: vacuum providing means

210: vacuum source 220: pneumatic block

222: main through hole 224: sub through hole

230: tool up down plate 232: tool through hole

240: vacuum sensor 250: opening and closing means

252: opening and closing rod 256: opening and closing cylinder

258: pneumatic solenoid valve 259: pneumatic source

260: vacuum pump 270: vacuum solenoid valve

300: control device 400: transfer means

500: ball box 600: eject means

610: eject pin 620: pin housing

630: pin fixing plate 640: guide shaft

650: guide plate 660: working cylinder

670: elastic means

The present invention relates to a solder ball adsorption device, and more particularly, to a solder ball adsorption device for adsorbing solder balls to a flux-coated semiconductor substrate and a solder ball adsorption method using the same.

In general, a semiconductor component is manufactured by attaching a semiconductor chip on which a highly integrated circuit such as a transistor or a capacitor is formed on a semiconductor substrate made of silicon, and then molding it with resin paper or the like. Among the semiconductor components, a solder ball, which serves as a lead frame, is adhered to a lower surface of the semiconductor substrate so as to be energized with a chip, called a solder ball type package (BGA Package). Meanwhile, in order to manufacture such a solder ball type package, an apparatus for absorbing a small solder ball made of spherical lead and supplying it to a flux-coated semiconductor substrate is required. Such a device is a solder ball adsorption device or a solder ball supply device.

The conventional solder ball adsorption device is composed of a single space portion in which a vacuum suction hole is formed and a vacuum providing means for providing a vacuum force to the space portion. In this way, when the vacuum pressure is provided to the space by the vacuum providing means, the outside air flows quickly from the outside through the vacuum adsorption hole, and the solder ball placed in the ball box is supplied to the vacuum adsorption hole by the high speed air flow. Is adsorbed.

However, when a plurality of small diameter solder balls are distributed over a large area using a vacuum source of the same capacity, there is a problem in that the vacuum suction force is reduced and the solder balls cannot be smoothly absorbed. That is, if the diameter of the solder ball is smaller, the diameter of the vacuum suction hole is also smaller, and if the diameter of the vacuum suction hole is smaller, there is a problem that the flow resistance increases and the speed of the air flowing in from the outside is reduced, thereby reducing the suction force.

The present invention has been made to solve the above problems, an object of the present invention is to provide two or more space parts independently partitioned so that the vacuum pressure is sequentially provided to each space portion to reliably absorb the solder ball. It is to provide a solder ball adsorption apparatus and a solder ball adsorption method.

In order to achieve the above object, the solder ball adsorption device according to the present invention is a solder ball adsorption device for supplying a vacuum to the solder ball to the semiconductor substrate, the vacuum adsorption unit is formed by vacuum suction of the solder ball is two or more partitioned independently from each other A ball tool having a space part, and a vacuum sensor connected to each space part to sense a vacuum state of each space part, the vacuum providing means being provided on one side of the ball tool to provide a vacuum force to the space parts; It is connected to the vacuum sensor, characterized in that it comprises a control device for controlling the vacuum providing means to provide a vacuum force to the other space portion when the vacuum degree of the one space portion by the detection signal of the vacuum sensor is more than the set value. .

The vacuum providing means includes a vacuum source providing a vacuum force, a pneumatic block in which a main through hole connected to the vacuum source is formed, and a tool through hole connected to the main through hole and independently connected to each of the spaces. And a tool up-down plate, a vacuum sensor connected to the tool through-hole and detecting a vacuum state of each space part, and opening / closing means for opening and closing the tool through-hole according to a detection signal of the vacuum sensor. do.

The opening and closing means is inserted into the tool through-hole retractable insertion, opening and closing rods for opening and closing the tool through the hole in accordance with whether or not, and an opening and closing cylinder coupled to one end of the opening and closing rods to provide an actuation force to the opening and closing rods; It is characterized by.

The vacuum providing means is a vacuum pump independently connected to each of the space portion, a vacuum sensor for detecting the vacuum state of each of the space portion is installed in the tool through-hole connecting the vacuum pump and the respective space portion; It is connected to the vacuum pump, characterized in that it comprises a pneumatic solenoid valve for providing a pneumatic pressure to the vacuum pump to form a vacuum in the vacuum pump according to the detection signal of the vacuum sensor.

In addition, the vacuum providing means is provided in a vacuum source for providing a vacuum force, a tool through-hole connecting the vacuum source and the respective space portion, the vacuum sensor for detecting the vacuum state of the respective space portion, and the vacuum And a vacuum solenoid valve installed between the circle and each of the space parts to control whether or not the vacuum force is supplied from the vacuum source to the space part according to the detection signal of the vacuum sensor.

Each of the spaces may further include an ejecting means for ejecting the solder ball adsorbed in the vacuum adsorption unit.

The ejecting means may include an actuating cylinder, a guide plate provided at an upper end of the ball tool to be lowered by an actuation force provided from the actuating cylinder, an elastic means installed at an upper end of the ball tool to elastically support the guide plate in an upward direction, A pin fixing plate fixed to the guide shaft coupled to the guide plate, the pin fixing plate interlocked with the guide plate, and a pin fixing plate fixed to the pin fixing plate, and ejecting solder balls adsorbed to the vacuum suction unit. do.

On the other hand, the solder ball adsorption apparatus according to the present invention is a solder ball adsorption device for supplying the vacuum suction ball solder ball to the semiconductor substrate, two or more spaces are connected to each other, each space portion is vacuum adsorption in which the solder ball is vacuum adsorption An additionally formed ball tool, and installed to operate independently of each of the space units, opening and closing the vacuum adsorption unit, ejecting means for ejecting a solder fire adsorbed to the vacuum adsorption unit, and connected to the respective space units. A single vacuum sensor for detecting a vacuum state of each space portion, and is connected to the vacuum sensor, the sensor so as to open one of the vacuum adsorption portion when the vacuum degree of one space portion is greater than a set value by the detection signal of the vacuum sensor It characterized in that it comprises a control device for controlling each ejection means.

The ejecting means may include an actuating cylinder, a guide plate provided at an upper end of the ball tool to be lowered by an actuation force provided from the actuating cylinder, an elastic means installed at an upper end of the ball tool to elastically support the guide plate in an upward direction, A pin fixing plate fixed to the guide shaft coupled to the guide plate, the pin fixing plate interlocked with the guide plate, and a pin fixing plate fixed to the pin fixing plate, and ejecting solder balls adsorbed to the vacuum suction unit. do.

It is connected to the space portion is characterized in that it further comprises a single vacuum sensor for detecting the vacuum state of the space portion.

On the other hand, the solder ball adsorption method according to the present invention comprises the steps of adsorbing the solder ball by providing a vacuum force to any one of the two or more spaces partitioned independently, and the degree of vacuum of the space portion is provided with a vacuum force or more than a set value And detecting whether or not it is recognized, and adsorbing solder balls by providing a vacuum force to another space part when the vacuum degree of the space part is detected to be greater than or equal to a set value.

On the other hand, the solder ball adsorption method according to the present invention is to provide a vacuum force to any one of the two or more vacuum adsorption portion to suck the solder ball, and to detect whether the vacuum degree of the space portion of the ball tool is more than the set value And, if it is detected that the vacuum degree of the space portion is greater than the set value, characterized in that it comprises the step of adsorbing the solder ball by providing a vacuum force to the other vacuum adsorption unit.

Hereinafter, the solder ball adsorption apparatus and the adsorption method according to the first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In describing the embodiments according to the present disclosure, the same names and the same reference numerals will be given to the components corresponding to the components of the embodiments described above. In addition, symmetrically arranged or a plurality of components will be described with reference numerals to only one of them.

1 and 2 are vertical cross-sectional views showing a sectional view of the solder ball adsorption apparatus according to the first embodiment of the present invention.

As shown in Figure 1 and Figure 2, the solder ball adsorption apparatus according to the first embodiment of the present invention is largely composed of a ball tool 100 and a vacuum providing means (200).

The ball tool 100 is an element to which the solder ball is directly adsorbed, and is composed of a tool body 110 and a tool cover 120. The tool body 110 and the tool cover 120 form four space portions 130 that are partitioned independently of each other. In addition, a vacuum suction part 122 is formed on a lower surface of each space part 130 of the tool cover 120, and a plurality of vacuum suction holes (not shown) are penetrated through the vacuum suction part 122. . These spaces 130 are partitioned independently, the vacuum is also configured to be controlled independently of each other.

Meanwhile, in the present embodiment, the ball tool 100 having four space parts 130 is disclosed, but the number of space parts 130 may be variously selected according to design conditions. In addition, the formation position and the diameter of the vacuum adsorption unit 122 and the vacuum adsorption hole may also be variously changed according to the diameter of the solder ball.

On the other hand, although not shown in the present embodiment, the ejection pin for ejecting the vacuum-adsorbed solder ball may be additionally installed in the space 130.

The vacuum providing means 200 is an element for providing a vacuum force to the respective space portion 130 according to the set vacuum conditions, the vacuum source 210, pneumatic block 220, tool-up down plate 230, vacuum It is composed of a sensor 240 and the opening and closing means (250).

The vacuum source 210 is a component that provides a vacuum force, is coupled to the upper portion of the pneumatic block 220. The pneumatic block 220 has a main through hole 222 connected to the vacuum source 210 and a sub through hole 224 connected to the main through hole 222. In addition, both sides of the pneumatic block 220 is tightly coupled to the sealing cover 226 for sealing both ends of the main through hole 222.

The tool up-down plate 230 is an element for raising and lowering the ball tool 100. The tool up-down plate 230 has a tool through-hole 232 connected to the sub-through hole 224 and independently connected to the respective space portions 130. That is, the vacuum force provided by the vacuum source 210 is designed to be transmitted to the space 130 through the main through hole 222, the sub through hole 224, and the tool through hole 232.

The vacuum sensor 240 is an element for detecting the vacuum state of each of the space portion 130. The vacuum sensor 240 is connected to the pressure check hole 242 connected to the tool through-hole 232 to check the vacuum state of the tool through-hole 232 connected to each space 130, each space It is configured to detect the vacuum state of the unit 130. Meanwhile, the vacuum state information detected by the vacuum sensor 240 is transmitted to the control device 300 to control the vacuum state of each space 130.

The opening and closing means 250 is an element that opens and closes the tool through hole 232 according to the detection signal of the vacuum sensor 240. The opening and closing means 250 of the opening and closing rod 252 is inserted into the tool through hole 232 to be inserted and retracted, the opening and closing cylinder 256 and the opening and closing cylinder 256 to provide an operating force to the opening and closing rod 252 It is composed of a cylinder joint 254 coupled to one end to operate the opening and closing rod 252. In other words, the opening and closing of the opening and closing rod 252 is configured to control the opening and closing of the tool through hole 232. In addition, the opening and closing cylinder 256 is connected to the pneumatic solenoid valve 258 connected to the external pneumatic source 259 is controlled.

The operating state of the opening and closing means 250 is shown in Figures 3a and 3b. 3A and 3B are vertical cross-sectional views showing an operating state of the solder ball adsorption device shown in FIG. As shown in FIG. 3A, when the opening / closing rod 252 is advanced by the opening / closing cylinder 256, the sub through hole 224 is closed. As shown in FIG. 3B, the opening / closing cylinder ( In the state in which the opening / closing rod 252 is retracted by 256, the sub through hole 224 is opened to provide a vacuum force to the space 130.

On the other hand, in the present embodiment is designed to control the vacuum state of the space 130 by performing the opening and closing of the tool through-hole 232 by the combination of the opening and closing rod 252 and the opening and closing cylinder 256, the space portion ( Any structure capable of controlling the supply of vacuum force to 130 may be employed. In addition, the shape of the pneumatic block 220 and the tool-up down plate 230 or the installation position of the vacuum sensor 240 may be variously changed depending on the design conditions if the same operation.

Meanwhile, reference numeral 400 denotes a transfer means for moving the solder ball adsorption apparatus of the present embodiment, and 500 denotes a ball box in which solder balls are accommodated.

Hereinafter, the operation of the solder ball adsorption apparatus according to the present embodiment will be described.

Figure 4 is a vacuum and pneumatic flow chart of the solder ball adsorption apparatus according to the embodiment, Figure 5 is a block diagram showing the adsorption step using such a solder ball adsorption apparatus. For reference, in FIG. 4, the solid line represents the flow of pneumatic and vacuum, and the dotted line represents the flow of an electrical signal. In addition, the four components are divided into first, second, third, and fourth from the left side for convenience of description.

As shown in FIG. 4, the control device 300 is connected to the first, second, third and fourth vacuum sensors 240 and the first, second, third and fourth pneumatic solenoid valves 258. The control device 300 sequentially opens and closes the first, second, third and fourth pneumatic solenoid valves 258 according to the vacuum state signals transmitted from the first, second, third and fourth vacuum sensors 240. The first, second, third and fourth open / close cylinders 256 are configured to operate sequentially. In addition, the vacuum source 210 is connected to the first, second, third and fourth space 130, respectively, via the first, second, third and fourth tool through holes 232, and the first , 2, 3 and 4 tool through hole 232 is opened or closed by the operation of the first, second, third and fourth opening and closing cylinder 256.

Hereinafter, the adsorption step using the solder ball adsorption device will be described.

4 and 5, first, when the first pneumatic solenoid valve 258 is opened by the control device 300, the first opening and closing cylinder 256 is operated by pneumatic to the first tool through hole As 232 is opened, the vacuum force provided from the vacuum source 210 is transmitted to the first space 130 (see FIG. 3B). At this time, the solder ball is adsorbed to the first vacuum adsorption part 122 while a rapid air flow occurs in the first vacuum adsorption part 122 of the ball tool 100.

At this time, when all the solder balls are adsorbed to the first vacuum adsorption unit 122, the first vacuum adsorption unit 122 is sealed by the solder balls and the degree of vacuum of the first space 130 is increased. As such, when the degree of vacuum of the first space unit 130 becomes higher than the set value, the first vacuum sensor 240 detects this and sends a detection signal to the control device 300, and the control device 300 has a second pneumatic solenoid. The valve 258 is opened to open the second tool through hole 232 so that the vacuum force is provided to the second space 130. At this time, while a fast air flow occurs in the second vacuum suction part 122 of the ball tool 100, the solder ball is adsorbed to the second vacuum suction part 122.

When all of the solder balls are adsorbed to the first, second, third and fourth vacuum adsorption units 122 by repeating this operation, the solder ball adsorption device is moved toward the semiconductor substrate to which the solder balls are provided by the transfer means 400.

As such, in the present embodiment, since the solder balls are adsorbed while sequentially providing the vacuum force to the space parts 130 which are independently partitioned, the vacuum efficiency is significantly improved compared to the same capacity.

Hereinafter, a solder ball adsorption apparatus and a adsorption method according to a second embodiment of the present invention will be described with reference to the accompanying drawings.

6 and 7 are vertical cross-sectional views showing a sectional view of the solder ball adsorption apparatus according to the second embodiment of the present invention.

The solder ball adsorption apparatus according to the second embodiment basically has the same configuration as that of the first embodiment. However, the second embodiment uses a vacuum pump 260 as a means for providing vacuum force, unlike that of the first embodiment, and the opening and closing means of the space 130 is configured differently. The following description mainly focuses on the configuration that differs from that of the first embodiment.

6 and 7, the solder ball adsorption apparatus according to the second embodiment is largely composed of a ball tool 100 and a vacuum providing means 200.

Like the first embodiment, the ball tool 100 is composed of a tool body 110 and a tool cover 120. The tool body 110 and the tool cover 120 are divided into four spaces independently of each other. The part 130 is formed.

The vacuum providing means 200 is composed of a vacuum pump 260, a pneumatic solenoid valve 258, a pneumatic block 220, a tool-up down plate 230 and a vacuum sensor 240.

The vacuum pump 260 is an element that provides a vacuum force to each space portion 130, and is independently connected to each space portion 130. The vacuum pump 260 uses the fact that a vacuum force is generated by Bernoulli's principle when inducing a rapid air flow, and uses the principle of a venturi tube that is commonly used.

The pneumatic solenoid valve 258 is an element for providing pneumatic pressure to the vacuum pump 260, and is connected to an external pneumatic source 259. The pneumatic pressure provided from the pneumatic solenoid valve 258 passes through the vacuum pump 260 and is discharged to the atmosphere. At this time, a vacuum force is generated in the vacuum pump 260 by the rapid air flow.

The vacuum pump 260 and the vacuum sensor 240 is installed in the pneumatic block 220, the tool-up down plate 230 has a tool through-hole 232 independently connected to each space portion 130 It is formed to be connected to each vacuum pump 260.

As such, in the second embodiment, whether the vacuum force is provided to each of the space portions 130 is controlled by the pneumatic solenoid valve 258 controlled by the control device 300 unlike that of the first embodiment.

Hereinafter, the operation of the solder ball adsorption apparatus according to the second embodiment will be described.

8 is a vacuum and pneumatic flow chart of the solder ball adsorption apparatus according to the second embodiment.

As shown in FIG. 8, the control device 300 is connected to the first, second, third and fourth vacuum sensors 240 and the first, second, third and fourth pneumatic solenoid valves 258. The control device 300 sequentially opens and closes the first, second, third and fourth pneumatic solenoid valves 258 according to the vacuum state signals transmitted from the first, second, third and fourth vacuum sensors 240. The first, second, third and fourth vacuum pumps 260 are configured to operate sequentially.

In this manner, first, when the first pneumatic solenoid valve 258 is opened by the control device 300, high-pressure air is discharged to the atmosphere through the first vacuum pump 260. At this time, a vacuum force is generated in the first vacuum pump 260, and the vacuum force is transmitted to the first space 130 through the first tool through hole 232. At this time, the solder ball is adsorbed to the first vacuum adsorption part 122 while a rapid air flow occurs in the first vacuum adsorption part 122 of the ball tool 100.

In this state, when all of the solder balls are adsorbed on the first vacuum adsorption unit 122 and the vacuum degree of the first space 130 is higher than a set value, the first vacuum sensor 240 detects this and sends the same to the control device 300. Sending a detection signal, the control device 300 opens the second pneumatic solenoid valve 258 to generate a vacuum force on the second vacuum pump 260. At this time, while a fast air flow occurs in the second vacuum suction part 122 of the ball tool 100, the solder ball is adsorbed to the second vacuum suction part 122.

When all of the solder balls are adsorbed to the first, second, third and fourth vacuum adsorption units 122 by repeating this operation, the solder ball adsorption device is moved toward the semiconductor substrate to which the solder balls are provided by the transfer means 400.

As described above, in the present embodiment, the vacuum efficiency is significantly improved compared to the same capacity, and the vacuum of each space part is controlled with a simple structure as compared with the first embodiment.

Hereinafter, a solder ball adsorption apparatus and a adsorption method according to a third embodiment of the present invention will be described with reference to the accompanying drawings.

9 is a vertical cross-sectional view showing a sectional view of a solder ball adsorption device according to a third embodiment of the present invention, Figure 10 is a vacuum and pneumatic flow diagram of the solder ball adsorption device shown in FIG.

The solder ball adsorption apparatus according to the third embodiment basically has the same configuration as that of the second embodiment. However, the third embodiment employs a vacuum solenoid valve 270 connected to the vacuum source 210 instead of employing the vacuum pump 260 and the pneumatic solenoid valve 258, unlike that of the second embodiment.

As shown in FIG. 10, the control device 300 is connected to the first, second, third and fourth vacuum sensors 240 and the first, second, third and fourth vacuum solenoid valves 270. The control device 300 sequentially opens and closes the first, second, third and fourth vacuum solenoid valves 270 according to the vacuum state signals transmitted from the first, second, third and fourth vacuum sensors 240. The first, second, third and fourth space portions 130 are configured to be sequentially vacuumed.

Thus constructed, first, when the first vacuum solenoid valve 270 is opened by the control device 300, the vacuum force provided from the vacuum source 210 is transferred to the first space through the first tool through hole 232. Delivered to 130. At this time, the solder ball is adsorbed to the first vacuum adsorption part 122 while a rapid air flow occurs in the first vacuum adsorption part 122 of the ball tool 100.

In this state, when all the solder balls are adsorbed to the first vacuum adsorption unit 122 and the vacuum degree of the first space 130 is higher than a set value, the first vacuum sensor 240 detects this and the control device 300. The detection signal is transmitted to the control device 300, and the control unit 300 opens the second vacuum solenoid valve 270 to provide a vacuum force to the second space 130. At this time, while a fast air flow occurs in the second vacuum suction part 122 of the ball tool 100, the solder ball is adsorbed to the second vacuum suction part 122.

When all of the solder balls are adsorbed to the first, second, third and fourth vacuum adsorption units 122 by repeating this operation, the solder ball adsorption device is moved toward the semiconductor substrate to which the solder balls are provided by the transfer means 400.

As described above, in the present embodiment, the vacuum efficiency is significantly improved compared to the same capacity, and the vacuum of each space part is controlled in a simple structure compared to the first and second embodiments.

Hereinafter, a solder ball adsorption apparatus and a adsorption method according to a fourth embodiment of the present invention will be described with reference to the accompanying drawings.

11 and 12 are vertical cross-sectional views showing a sectional view of the solder ball adsorption apparatus according to the fourth embodiment of the present invention.

The solder ball adsorption apparatus according to the fourth embodiment basically has the same configuration as that of the first embodiment. However, the fourth embodiment differs from that of the first embodiment in that the ejection means 600 for ejecting the solder ball adsorbed to the vacuum adsorption portion 122 is further provided in each space 130. . Therefore, a description will be given focusing on the configuration associated with such an ejecting means 600.

The ejection means 600 is composed of a guide plate 650, a pin fixing plate 630, a pin housing 620, a plurality of eject pins 610, the operation cylinder 660 and the elastic means 670.

The guide plate 650 is installed on the upper end of the tool body 110 to move up and down. The pin fixing plate 630 is installed to be lifted and lowered in each space 130 by a guide shaft 640 fixed to the guide plate 650, the pin housing 620 is the pin fixing plate ( 630 is fastened to the bottom. The eject pin 610 is an element for ejecting a vacuum-adsorbed solder ball while being inserted into the vacuum suction hole (not shown) formed through the vacuum suction part 122. The eject pin 610 is fixedly supported by the pin fixing plate 630 and the pin housing 620.

The actuating cylinder 660 is an element for imparting a descending actuation force to the ejection means 300. The working cylinder 660 is fixed to the tool body 110, and the tool body 110 is separated from the system body 202 by the fastening ring 710 and the fastener 720 at the time of conversion. On the other hand, the meaning of the cylinder in the working cylinder 660 in this embodiment is used in a broad sense, any driving means may be used if it can apply the operating force to the guide plate 650. The elastic means 670 is an element for moving the guide plate 650 upward. That is, the lowering of the guide plate 650 is made by the operating force of the operation cylinder 660, the rise of the guide plate 650 is made by the elastic return force of the elastic means 670.

On the other hand, in the present embodiment, but the elastic means 670 is composed of a compression coil spring, if the guide plate 650 can move upward, various elastic means and driving means can be used.

Hereinafter, the operation of the solder ball adsorption apparatus according to the fourth embodiment will be described.

13 is a vacuum and pneumatic flow chart of the solder ball adsorption device shown in FIG.

As shown in FIG. 13, the control device 300 is connected to the first, second, third and fourth vacuum sensors 240 and the first, second, third and fourth pneumatic solenoid valves 258. The control device 300 sequentially opens and closes the first, second, third and fourth pneumatic solenoid valves 258 according to the vacuum state signals transmitted from the first, second, third and fourth vacuum sensors 240, The ejection means 600 is sequentially raised to provide a vacuum force to the first, second, third and fourth vacuum suction units 122.

In more detail, all the eject pins 610 are lowered before the solder balls are adsorbed. In this state, since the pin housing 620 is in contact with the tool cover 220, a vacuum pressure is formed in the space 130, but a vacuum pressure is not formed in the vacuum suction hole of the vacuum adsorption unit 122. Therefore, the solder ball is not adsorbed to the vacuum adsorption part 122. At this time, when the first pin housing 620 is raised by the first operation cylinder 660, a gap is formed between the first pin housing 620 and the tool cover 620, so that the vacuum pressure is increased in the first vacuum suction unit 122. It is delivered to the vacuum suction hole of). Therefore, the solder ball is adsorbed to the first vacuum adsorption unit 122.

In this state, when all of the solder balls are adsorbed on the first vacuum adsorption unit 122 and the vacuum degree of the first space 130 is higher than a set value, the first vacuum sensor 240 detects this and sends the same to the control device 300. Send a detection signal. The control device 300 opens the second pneumatic solenoid valve 258, and when the second operation cylinder 660 raises the second pin housing 620, the second pin housing 620 and the tool cover ( A gap is formed between the 620 and the vacuum pressure is transmitted to the vacuum suction hole of the second vacuum suction part 122. Therefore, the solder ball is adsorbed to the second vacuum adsorption unit 122.

When all of the solder balls are adsorbed to the first, second, third and fourth vacuum adsorption units 122 by repeating this operation, the solder ball adsorption device is moved toward the semiconductor substrate to which the solder balls are provided by the transfer means 400. In this state, when the pin housing 620 is lowered by the control means 300, the pin housing 620 is in close contact with the tool cover 120 to release the vacuum and the eject pin 610 ejects the solder ball. Alternatively, the eject pin 610 may descend after the ball is dropped by blocking the vacuum in the vacuum source 210 itself.

As described above, in the present embodiment, the vacuum efficiency is significantly improved compared to the same capacity, and the ejection means is provided so that the solder balls can be quickly lowered onto the semiconductor substrate.

Hereinafter, a solder ball adsorption apparatus and a adsorption method according to a fifth embodiment of the present invention will be described with reference to the accompanying drawings.

14 is a vertical sectional view showing a sectional view of the solder ball adsorption device according to the fifth embodiment of the present invention, and FIG. 15 is a vacuum and pneumatic flow diagram of the solder ball adsorption device shown in FIG.

The solder ball adsorption apparatus according to the fifth embodiment basically has the same configuration as that of the fourth embodiment. However, in the fifth embodiment, unlike the fourth embodiment, each of the space parts 130 is in communication with each other, and only one vacuum sensor is provided.

As shown in FIG. 15, the control device 300 is connected to a single vacuum sensor 240 and first, second, third and fourth pneumatic solenoid valves 258. The control device 300 sequentially opens and closes the first, second, third and fourth pneumatic solenoid valves 258 according to the vacuum state signal transmitted from the single vacuum sensor 240, thereby opening the ejection means 600. Ascending in order to provide a vacuum force to the first, second, third and fourth vacuum suction unit 122.

In more detail, all the eject pins 610 are lowered before the solder balls are adsorbed. In this state, since the pin housing 620 is in contact with the tool cover 220, a vacuum pressure is formed in the space 130, but a vacuum pressure is not formed in the vacuum suction hole of the vacuum adsorption unit 122. Therefore, the solder ball is not adsorbed to the vacuum adsorption part 122. At this time, when the first pin housing 620 is raised by the first operation cylinder 660, a gap is formed between the first pin housing 620 and the tool cover 620, so that the vacuum pressure is increased in the first vacuum suction unit 122. It is delivered to the vacuum suction hole of). Therefore, the solder ball is adsorbed to the first vacuum adsorption unit 122.

In this state, when all the solder balls are adsorbed to the first vacuum adsorption unit 122 and the vacuum degree of the space unit 130 becomes higher than a set value, a single vacuum sensor 240 detects this and detects the signal to the control device 300. Send it. The control device 300 opens the second pneumatic solenoid valve 258, and when the second operation cylinder 660 raises the second pin housing 620, the second pin housing 620 and the tool cover ( A gap is formed between the 620 and the vacuum pressure is transmitted to the vacuum suction hole of the second vacuum suction part 122. Therefore, the solder ball is adsorbed to the second vacuum adsorption unit 122.

When all of the solder balls are adsorbed to the first, second, third and fourth vacuum adsorption units 122 by repeating this operation, the solder ball adsorption device is moved toward the semiconductor substrate to which the solder balls are provided by the transfer means 400. In this state, the eject pin 610 is lowered by the control means 300 to eject the solder.

Thus, in this embodiment, while performing the same operation as that of the fourth embodiment, since only one vacuum sensor is provided and each space portion is in communication with each other, the structure of the system is simplified.

In addition, in the present embodiment, when there is a defective unit in the semiconductor substrate, the operation cylinder corresponding to the same may not be operated, thereby preventing the ball from adsorbing. This control saves balls.

Meanwhile, in the present exemplary embodiments, only a technical configuration of adsorbing solder balls while controlling one of four space parts 130 to be vacuumed sequentially is disclosed, but two space parts 130 are sequentially vacuumed according to design conditions. This may be controlled or at the same time all the space portion 130 may be controlled to be a vacuum.

As in the above example, the present invention may be variously applied using the same principle by appropriately modifying the above embodiments. Therefore, it should be interpreted that the above description does not limit the scope of the present invention, which is defined by the limits of the following claims.

As described above, the present invention solves the problem that the vacuum adsorption force is reduced when a plurality of small diameter solder balls are distributed over a large area using a vacuum source of the same capacity as in the prior art, so that the solder balls cannot be adsorbed smoothly. It provides solder ball adsorption system and adsorption method with new structure.                     

Solder ball adsorption apparatus and adsorption method according to the present invention is provided with two or more spaced parts divided by the vacuum force in each of the space by sequentially providing a vacuum force, so that the diameter of the vacuum suction hole under the same capacity of the vacuum source Even if this decreases or the area of the vacuum suction hole is increased, the solder balls can be absorbed effectively. That is, the vacuum adsorption force is increased because it has the same effect as providing a vacuum source of the same capacity to the area of 1 / n (number of space portions) of the total vacuum adsorption portion area.

In addition, in the present embodiment, the vacuum efficiency is significantly improved compared to the same capacity, and at the same time, the ejection means is provided so that the solder balls can be quickly lowered onto the semiconductor substrate.

Claims (12)

In the solder ball adsorption device that vacuum-supply the solder balls to the semiconductor substrate, A ball tool having a vacuum adsorption part in which the solder balls are vacuum adsorbed and having at least two space parts separated from each other; A vacuum sensor connected to each of the spaces and detecting a vacuum state of each of the spaces, and disposed on one side of the ball tool to provide a vacuum force to each of the spaces; The solder ball is connected to the vacuum sensor, and includes a control device for controlling the vacuum providing means to provide a vacuum force to the other space portion when the vacuum degree of the one space portion by the detection signal of the vacuum sensor more than the set value; Adsorption device. The method of claim 1, The vacuum providing means, A vacuum source providing a vacuum force, A pneumatic block having a main through hole connected to the vacuum source; A tool up-down plate connected to the main through hole and simultaneously formed with a tool through hole independently connected to the respective space parts; A vacuum sensor connected to the tool through hole and detecting a vacuum state of each space part; Solder ball adsorption device comprising an opening and closing means for opening and closing the tool through hole in accordance with the detection signal of the vacuum sensor. The method of claim 2, The opening and closing means, An opening / closing rod which is inserted into the tool through-hole so as to move forward and backward, and opens and closes the tool through-hole according to whether or not it moves forward, Solder ball adsorption device, characterized in that it comprises an opening and closing cylinder coupled to one end of the opening and closing rod to provide an operating force to the opening and closing rod. The method of claim 1, The vacuum providing means, A vacuum pump independently connected to each of the spaces; A vacuum sensor installed in a tool through-hole connecting the vacuum pump and the respective space parts to detect a vacuum state of each of the space parts; And a pneumatic solenoid valve connected to the vacuum pump and providing pneumatic pressure to the vacuum pump to form a vacuum in the vacuum pump according to a detection signal of the vacuum sensor. The method of claim 1, The vacuum providing means, A vacuum source providing a vacuum force, A vacuum sensor installed in a tool through-hole connecting the vacuum source and the respective space parts to detect a vacuum state of each of the space parts; And a vacuum solenoid valve installed between the vacuum source and each of the space parts, and configured to control whether the vacuum force is supplied from the vacuum source to the space part according to a detection signal of the vacuum sensor. Device. The method of claim 1, Solder ball adsorption apparatus, characterized in that each space portion is further provided with ejecting means for ejecting the solder ball adsorbed in the vacuum adsorption unit. The method of claim 6, The eject means, With working cylinder, A guide plate installed at an upper end of the ball tool to be lowered by an operating force provided from the operating cylinder, An elastic means installed at an upper end of the ball tool to elastically support the guide plate in an upward direction; A pin fixing plate fixed to the guide shaft coupled to the guide plate and interlocked with the guide plate; The solder ball adsorption device is fixed to the pin fixing plate, and comprises a plurality of eject pins for ejecting the solder ball adsorbed on the vacuum adsorption unit. In the solder ball adsorption device that vacuum-sucks the solder ball to the semiconductor substrate, A ball tool having two or more spaces communicating with each other, each of which has a vacuum adsorption portion for vacuum suction of the solder balls; Eject means is installed so as to operate independently from each other, the opening and closing the vacuum adsorption unit, ejecting the solder fire adsorbed to the vacuum adsorption unit; A single vacuum sensor connected to each space unit and detecting a vacuum state of each space unit; It is connected to the vacuum sensor, characterized in that it comprises a control device for controlling the respective ejection means to open one of the vacuum suction unit when the vacuum degree of one of the space portion by the detection signal of the vacuum sensor more than a set value Solder ball adsorption device. The method of claim 8, The eject means, With working cylinder, A guide plate installed at an upper end of the ball tool to be lowered by an operating force provided from the operating cylinder, An elastic means installed at an upper end of the ball tool to elastically support the guide plate in an upward direction; A pin fixing plate fixed to the guide shaft coupled to the guide plate and interlocked with the guide plate; The solder ball adsorption device is fixed to the pin fixing plate, and comprises a plurality of eject pins for ejecting the solder ball adsorbed on the vacuum adsorption unit. The method of claim 8, Solder ball adsorption apparatus is connected to the space portion is further provided with a single vacuum sensor for detecting the vacuum state of the space portion. Adsorbing a solder ball by providing a vacuum force to any one of two or more spaces independently partitioned; Detecting whether the vacuum degree of the space portion provided with the vacuum force is equal to or greater than a set value; And if the vacuum degree of the space portion is detected to be greater than or equal to a set value, adsorbing the solder ball by providing a vacuum force to the other space portion. Adsorbing solder balls by providing a vacuum force to any one of the two or more vacuum adsorption units, Detecting whether the vacuum degree of the space part of the ball tool is greater than or equal to a set value; And if the vacuum degree of the space part is detected to be greater than or equal to a set value, adsorbing solder balls by providing a vacuum force to another vacuum adsorption part.

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