KR100944372B1 - Semiconductor chip pickup apparatus - Google Patents

Semiconductor chip pickup apparatus Download PDF

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KR100944372B1
KR100944372B1 KR1020080041289A KR20080041289A KR100944372B1 KR 100944372 B1 KR100944372 B1 KR 100944372B1 KR 1020080041289 A KR1020080041289 A KR 1020080041289A KR 20080041289 A KR20080041289 A KR 20080041289A KR 100944372 B1 KR100944372 B1 KR 100944372B1
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vacuum
valve
semiconductor chip
knob
guide
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KR20090115430A (en
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이상근
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

트레이에 횡으로 적치된 다수의 칩을 한번에 흡착하여 다른 트레이로 이송할 수 있으며, 중간에 하나의 칩 또는 그 이상의 칩이 빠져있어도 트레이에 적치된 다른 칩들을 무리 없이 흡착할 수 있어 작업의 효율성을 높일 수 있고, 이송 중 칩을 떨어뜨리는 실패율을 최소화할 수 있는 반도체 칩 픽업장치가 개시되어 있다. 본 발명에 따른 반도체 칩 픽업장치, 작동스위치가 내장된 노브와, 노브의 하부에 일체로 형성되고 내부에 챔버가 형성되는 케이스를 가지는 작동부; 케이스의 하부에 상부가 결합되고 일단에서부터 내부를 따라 타단에 인접한 위치까지 연장되는 수평진공유로 및 수평진공유로에서 하부로 연장되는 다수의 수직진공유로가 형성된 흡착블록과, 각각의 수직진공유로에 장착되어 반도체 칩을 흡착하는 다수의 진공흡착기를 가지는 흡착부; 및 통상의 진공이젝터와, 챔버 내에 배치되고 진공이젝터 및 수평진공유로와 연결되어 진공압의 형성을 제어하는 통상의 온오프 밸브와, 진공이젝터와 온오프 밸브를 연결하는 제 1 진공안내라인과, 수평진공유로와 온오프 밸브를 연결하는 제 2 진공안내라인을 가지는 진공안내부; 로 이루어진다.It can absorb multiple chips stacked on the tray at once and transfer them to another tray. Even if one chip or more chips are missing in the middle, other chips stacked on the tray can be adsorbed without difficulty. Disclosed is a semiconductor chip pick-up apparatus that can be increased and minimizes the failure rate of dropping chips during transfer. According to the present invention, there is provided a semiconductor chip pick-up apparatus, an operating part having a knob in which an operation switch is built and a case integrally formed at a lower part of the knob and in which a chamber is formed; An adsorption block having an upper part coupled to the lower part of the case and having a plurality of vertical true shared passages extending from one end to a position adjacent to the other end along the inside, and having a plurality of vertical true shared passages extending downward from the horizontal true shared passage, respectively. An adsorption unit having a plurality of vacuum adsorbers configured to adsorb the semiconductor chips; And a conventional vacuum ejector, a conventional on-off valve disposed in the chamber and connected to the vacuum ejector and the horizontal vacuum sharing path to control the formation of vacuum pressure, and a first vacuum guide line connecting the vacuum ejector and the on-off valve; A vacuum guide part having a second vacuum guide line connecting the horizontal vacuum path and the on-off valve; Is made of.

Description

반도체 칩 픽업장치{SEMICONDUCTOR CHIP PICKUP APPARATUS}Semiconductor Chip Pickup Device {SEMICONDUCTOR CHIP PICKUP APPARATUS}

본 발명은 반도체 칩 픽업장치에 관한 것으로서, 더욱 상세하게는 트레이(tray)에 횡으로 적치된 다수의 칩을 한번에 흡착하여 다른 트레이로 이송할 수 있으며, 중간에 하나의 칩 또는 그 이상의 칩이 빠져있어도 트레이에 적치된 다른 칩들을 무리 없이 흡착할 수 있어 작업의 효율성을 높일 수 있고, 이송 중 칩을 떨어뜨리는 실패율을 최소화할 수 있는 반도체 칩 픽업장치에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip pick-up apparatus, and more particularly, a plurality of chips stacked laterally on a tray may be absorbed at a time and transferred to another tray, and one chip or more chips may be missing. The present invention relates to a semiconductor chip pick-up device capable of adsorbing other chips loaded on a tray without any difficulty, thereby improving work efficiency and minimizing a failure rate of dropping chips during transfer.

일반적으로, 반도체 패키지 제조공정은 크게 FAB(Fabrication)공정과, 어셈블리(Assembly)공정으로 이루어진다.In general, a semiconductor package manufacturing process is mainly composed of a FAB (fabrication) process and an assembly process.

FAB공정에서는 실리콘 웨이퍼 상에 집적회로를 설계하여 반도체 칩을 형성하고, 어셈블리공정에서는 반도체 칩에 리드프레임부착, 반도체 칩과 리드프레임간의 통전을 위한 와이어 본딩(Wire bonding) 혹은 솔더볼(Solder ball)을 형성하는 솔더링 공정, 그리고 에폭시 등의 레진(Resin) 등을 이용한 몰딩 공정 등을 차례로 진행하여 반도체 스트립(Strip)을 만든다. In the FAB process, an integrated circuit is designed on a silicon wafer to form a semiconductor chip.In the assembly process, a wire bonding or solder ball is used to attach a lead frame to the semiconductor chip and to conduct electricity between the semiconductor chip and the lead frame. A soldering process to be formed and a molding process using a resin such as epoxy are sequentially performed to form a semiconductor strip.

이렇게 제작된 반도체 스트립은 절단장치로 이송되어 잘단날에 의해 개별적인 패키지 형태로 절단되며, 절단된 각각의 패키지는 세척 및 건조된 후 비젼검사 장치로 이송된다. The semiconductor strip thus manufactured is transferred to a cutting device and cut into individual packages by cutting edges. Each cut package is washed and dried and then transferred to a vision inspection device.

전술한 FAB공정에서 형성된 반도체 칩은 통상의 트레이(tray)에 적치되었다가 다음 공정을 위해 또 다른 트레이(tray)로 이송된다. 통상의 트레이(tray)에는 횡 방향으로 최대 10개의 반도체 칩이 적치되며, 반도체 칩은 통상의 진공피커에 의해 이송된다. The semiconductor chip formed in the aforementioned FAB process is placed in a conventional tray and then transferred to another tray for the next process. Up to 10 semiconductor chips are stacked on a conventional tray in the transverse direction, and the semiconductor chips are transferred by a conventional vacuum picker.

그런데, 종래 반도체 칩을 이송하는 진공피커는 하나의 반도체 칩만을 흡착하여 이송하기 때문에 작업시간이 지연되어 작업의 효율성이 떨어지는 문제점이 있었다. However, the conventional vacuum picker for transporting a semiconductor chip has a problem in that the work efficiency is reduced because work time is delayed because only one semiconductor chip is absorbed and transported.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위해 안출된 것으로, 본 발명의 목적은 트레이(tray)에 횡으로 적치된 다수의 칩을 한번에 흡착하여 다른 트레이로 이송할 수 있으며, 중간에 하나의 칩 또는 그 이상의 칩이 빠져있어도 트레이에 적치된 다른 칩들을 무리 없이 흡착할 수 있어 작업의 효율성을 높일 수 있고, 이송 중 칩을 떨어뜨리는 실패율을 최소화할 수 있는 반도체 칩 픽업장치를 제공하는데 있다. The present invention has been made to solve the conventional problems as described above, an object of the present invention is to adsorb a plurality of chips stacked laterally on a tray at a time to transfer to another tray, one in the middle Even if a chip or more chips are missing, it is possible to adsorb other chips stacked on the tray without difficulty, thereby improving work efficiency and providing a semiconductor chip pickup device capable of minimizing a failure rate of dropping chips during transfer.

상기와 같은 본 발명의 목적을 달성하기 위해서 본 발명은,In order to achieve the object of the present invention as described above, the present invention,

반도체 칩 픽업장치에 있어서, In a semiconductor chip pickup device,

작동스위치가 내장된 노브와, 노브의 하부에 일체로 형성되고 내부에 챔버가 형성되는 케이스를 가지는 작동부;An operation part having a knob in which an operation switch is built and a case integrally formed at a lower part of the knob and in which a chamber is formed;

케이스의 하부에 상부가 결합되고 일단에서부터 내부를 따라 타단에 인접한 위치까지 연장되는 수평진공유로 및 수평진공유로에서 하부로 연장되는 다수의 수직진공유로가 형성된 흡착블록과, 각각의 수직진공유로에 장착되어 반도체 칩을 흡착하는 다수의 진공흡착기를 가지는 흡착부; 및An adsorption block having an upper part coupled to the lower part of the case and having a plurality of vertical true shared passages extending from one end to a position adjacent to the other end along the inside, and having a plurality of vertical true shared passages extending downward from the horizontal true shared passage, respectively. An adsorption unit having a plurality of vacuum adsorbers configured to adsorb the semiconductor chips; And

통상의 진공이젝터와, 챔버 내에 배치되고 진공이젝터 및 수평진공유로와 연결되어 진공압의 형성을 제어하는 통상의 온오프 밸브와, 진공이젝터와 온오프 밸브를 연결하는 제 1 진공안내라인과, 수평진공유로와 온오프 밸브를 연결하는 제 2 진공안내라인을 가지는 진공안내부; 로 이루어진 반도체 칩 픽업장치를 제공한다.A conventional vacuum ejector, a conventional on-off valve disposed in the chamber and connected to the vacuum ejector and the horizontal vacuum sharing path to control the formation of the vacuum pressure, a first vacuum guide line connecting the vacuum ejector and the on-off valve, and horizontal A vacuum guide part having a second vacuum guide line connecting the vacuum flow path and the on-off valve; Provided is a semiconductor chip pickup device.

이상에서 설명한 바와 같이, 본 발명에 따른 반도체 칩 픽업장치는 트레이에 횡으로 적치된 반도체 칩을 수와 동일한 개수를 가지는 다수의 진공흡착기를 장착함으로써, 다수의 반도체 칩을 한번의 흡착으로 이송시킬 수 있기 때문에 작업의 효율성을 높일 수 있는 이점이 있다. As described above, the semiconductor chip pick-up apparatus according to the present invention can transfer a plurality of semiconductor chips by one adsorption by mounting a plurality of vacuum adsorbers having the same number as the number of semiconductor chips stacked laterally on a tray. This has the advantage of increasing the efficiency of the work.

또한, 다수의 진공흡착기에 각각 통상의 진공효율밸브를 장착함으로써, 어느 하나의 진공흡착기가 반도체 칩을 흡착하지 않더라도 다른 진공흡착기는 진공압이 손실되지 않아 반도체 칩을 흡착할 수 있는 이점이 있다. In addition, by attaching a conventional vacuum efficiency valve to each of the plurality of vacuum adsorption, even if any one of the vacuum adsorber does not adsorb the semiconductor chip, the other vacuum adsorber has the advantage that the vacuum pressure is not lost can adsorb the semiconductor chip.

이하, 첨부된 도면들을 참조하여 본 발명의 바람직한 일 실시예에 따른 반도체 칩 픽업장치에 대해 설명한다. Hereinafter, a semiconductor chip pickup apparatus according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명에 따른 반도체 칩 픽업장치를 나타낸 사시도이며, 그리고 도 2는 도 1의 선 A-A를 따라 도시된 단면도이다. 1 is a perspective view showing a semiconductor chip pickup device according to the present invention, and FIG. 2 is a cross-sectional view taken along the line A-A of FIG.

도 1을 참조하면, 본 발명에 따른 반도체 칩 픽업장치(100)는, 작동부(110)와, 작동부(110)에 장착되는 흡착부(130)와, 작동부(110)의 작동에 의해서 흡착부(130)에 진공을 안내하는 진공안내부(150)로 이루어진다. Referring to FIG. 1, the semiconductor chip pick-up apparatus 100 according to the present invention includes an operation unit 110, an adsorption unit 130 mounted on the operation unit 110, and an operation of the operation unit 110. It consists of a vacuum guide unit 150 for guiding the vacuum to the adsorption unit 130.

먼저, 작동부(110)는 작동스위치(114)가 내장된 노브(112)와, 노브(112)의 하부에 일체로 형성되는 케이스(122)를 구비한다. First, the operation unit 110 includes a knob 112 in which the operation switch 114 is built, and a case 122 formed integrally with the lower part of the knob 112.

노브(112)는 상부 및 하부가 개방되고 내부가 빈 수직한 관 형상을 가진다. 이러한 노브(112)에는 작동스위치(114)가 내장되는데, 작동스위치(114)는 노브(112)의 수직한 길이방향을 따라 연장된다. 이러한 노브(112)의 개방된 상부 내주면 상에는 작동스위치(114)가 노브(112)의 상부 외측으로 이탈되는 것을 방지할 수 있도록 환형의 이탈방지플랜지(116)가 일체로 형성된다. 그리고 작동스위치(114)의 상부에 인접하게는 상부면이 이탈방지플랜지(116)의 하부에 밀착되는 환형의 이탈방지돌기(118)가 일체로 형성된다. 이때, 이탈방지돌기(118)의 하부에는 노브(112)의 하부까지 연장되는 압축스프링(120)이 배치된다. 즉, 작동스위치(114)의 상부 연장단은 이탈방지돌기(118)를 밀고 있는 압축스프링(120)에 의해서 노브(112)의 상부 외측으로 노출된 상태를 유지한다. The knob 112 has a vertical tubular shape with open top and bottom and empty interior. The knob 112 has a built-in operation switch 114, the operation switch 114 extends along the vertical length of the knob 112. On the open upper inner circumferential surface of the knob 112, an annular release preventing flange 116 is integrally formed to prevent the operation switch 114 from escaping to the upper outer side of the knob 112. And adjacent to the upper portion of the operation switch 114, the annular departure prevention projections 118, the upper surface is in close contact with the bottom of the separation prevention flange 116 is integrally formed. At this time, the compression spring 120 extending to the lower portion of the knob 112 is disposed below the departure prevention protrusion 118. That is, the upper extension end of the operation switch 114 maintains the state exposed to the upper outer side of the knob 112 by the compression spring 120 pushing the release prevention protrusion 118.

한편, 케이스(122)는 사각 함체 형상을 가진다. 이러한 케이스(122)는 하부가 개방되고 내부가 중공된 형상을 가지며, 중공된 내부에 노브(112)의 개방된 하부와 연결되는 챔버(124)를 형성한다. 즉, 챔버(124)와 노브(112)의 중공된 내측으 로 서로 연통한다. On the other hand, the case 122 has a rectangular enclosure shape. The case 122 has a shape in which the lower part is opened and the inside is hollow, and forms a chamber 124 connected to the open bottom of the knob 112 in the hollow inside. That is, the chamber 124 and the knob 112 communicate with each other inside the hollow.

이와 같이 형성된 작동부(110)에는 흡착부(130) 및 진공안내부()가 배치된다. The suction unit 130 and the vacuum guide unit () are disposed in the operating unit 110 formed as described above.

흡착부(130)는 흡착블록(132)과, 흡착블록(132)에 장착되고 통상의 트레이(tray; 도시되지 않음)에 적치된 반도체 칩(도시되지 않음)을 흡착하는 다수의 진공흡착기(138)를 구비한다.The adsorption part 130 adsorbs the adsorption block 132 and a plurality of vacuum adsorption devices 138 mounted on the adsorption block 132 and adsorbing semiconductor chips (not shown) placed in a conventional tray (not shown). ).

흡착블록(132)은 일단에서 타단으로 수평하게 연장되는 수평 바아(bar) 형상을 가진다. 흡착블록(132)에는 일단에서부터 내부를 따라 타단에 인접한 위치까지 연장되는 수평진공유로(134) 및 수평진공유로(134)에서 흡착블록(132)의 하부로 연장되는 다수의 수직진공유로(136)가 형성된다. 이러한 흡착블록(132)의 상부는 케이스(122)의 하부에 나사 결합된다. The adsorption block 132 has a horizontal bar shape extending horizontally from one end to the other end. The adsorption block 132 includes a horizontal true shared passage 134 extending from one end to a position adjacent to the other end and a plurality of vertical true shared passages 136 extending from the horizontal true shared passage 134 to the lower portion of the adsorption block 132. ) Is formed. The upper portion of the adsorption block 132 is screwed to the lower portion of the case 122.

한편, 진공흡착기(138)는 각각의 수직진공유로(136)에 상부가 장착되는 통상의 진공효율밸브(140)와, 진공효율밸브(140)의 하부에 장착되는 통상의 진공패드(142)를 구비한다. 누구나 알 수 있듯이 진공효율밸브(140)는 내부에 부유체(도시되지 않음)가 내장되는 것으로, 진공패드(142)에 반도체 칩이 부착되었을 때는 부유체가 진공효율밸브(140)의 내부에 형성된 유로를 개방하여 반도체 칩을 흡착하게 하고, 반대로 진공패드(142)에 반도체 칩이 부착되지 않을 경우에는 부유체가 진공효율밸브(140)의 내부에 형성된 유로를 폐쇄하는 구조를 가진다. 바람직하게는 진공효율밸브(140)는 FESTO사(社)에서 제조된 (모델명; ISV-M5) 진공효율밸브(140)를 채택한다. On the other hand, the vacuum adsorber 138 is a conventional vacuum efficiency valve 140, the upper portion is mounted to each vertical vacuum sharing path 136, and the conventional vacuum pad 142 is mounted to the lower portion of the vacuum efficiency valve 140 It is provided. As anyone knows, the vacuum efficiency valve 140 has a floating body (not shown) embedded therein, and when the semiconductor chip is attached to the vacuum pad 142, the floating body has a flow path formed inside the vacuum efficiency valve 140. To adsorb the semiconductor chip and, on the contrary, when the semiconductor chip is not attached to the vacuum pad 142, the floating body closes the flow path formed inside the vacuum efficiency valve 140. Preferably, the vacuum efficiency valve 140 adopts a vacuum efficiency valve 140 (model name: ISV-M5) manufactured by FESTO.

더욱 바람직하게는, 흡착블록(132)에 장착되는 진공흡착기(138)는 통상의 트레이(tray)에 횡으로 적치된 10개의 반도체 칩에 대응하는 개수로 장착되며, 이로 인해 흡착블록(132)에는 10개의 수직진공유로(136)가 형성된다. More preferably, the vacuum adsorber 138 mounted on the adsorption block 132 is mounted in a number corresponding to 10 semiconductor chips laterally stacked on a conventional tray, so that the adsorption block 132 Ten vertical shared paths 136 are formed.

한편, 진공안내부(150)는 통상의 진공이젝터(152)와, 케이스(122)의 챔버(124) 내에 배치되고 진공이젝터(152) 및 수평진공유로(134)와 연결되어 진공압의 형성을 제어하는 통상의 온오프 밸브(154)를 구비하는데, 누구나 알 수 있듯이 진공이젝터(152)는 통상의 컴프레서(도시되지 않음)와 연결되고 컴프레서에서 공급되는 압축공기를 이용하여 진공압을 형성한다. On the other hand, the vacuum guide unit 150 is disposed in the conventional vacuum ejector 152 and the chamber 124 of the case 122 and connected to the vacuum ejector 152 and the horizontal vacuum sharing path 134 to form the vacuum pressure. A conventional on / off valve 154 is provided, which, as will be appreciated by anyone, is connected to a conventional compressor (not shown) and creates a vacuum pressure using compressed air supplied from the compressor.

온오프 밸브(154)는 일단에 돌출되게 형성되는 제 1 안내관(156) 및 제 2 안내관(158)과, 온오프 밸브(154)의 내부에 형성되어 제 1 안내관(156) 및 제 2 안내관(158)을 연결하는 내부유로(도시되지 않음)와, 온오프 밸브(154)의 상부에 돌출되게 형성되어 내부유로를 개폐함과 아울러 상기 작동스위치(114)의 작동에 의해 작동하는 개폐버튼(160)을 구비한다. 이때, 개폐버튼(160)은 작동스위치(114)의 하부와 마주보게 배치됨과 아울러 온오프 밸브(154)의 상부는 압축스프링(120)의 하부가 밀착되고, 제 1 안내관(156) 및 제 2 안내관(158)은 케이스(122)의 일단 외부로 노출된다. 이를 위해서 케이스(122)의 일단에는 제 1 안내관(156) 및 제 2 안내관(158)이 노출될 수 있도록 관통장공(126)이 형성된다. The on-off valve 154 is formed in the first guide pipe 156 and the second guide pipe 158 protruded at one end, and the on-off valve 154 is formed in the first guide pipe 156 and 2 is an inner flow path (not shown) for connecting the guide pipe 158 and protrudes on the on-off valve 154 to open and close the inner flow path and operate by operation of the operation switch 114. The opening and closing button 160 is provided. At this time, the opening and closing button 160 is disposed to face the lower portion of the operation switch 114, and the upper portion of the on-off valve 154 is in close contact with the lower portion of the compression spring 120, the first guide tube 156 and the first The two guide tubes 158 are exposed to the outside of the case 122. To this end, a through hole 126 is formed at one end of the case 122 so that the first guide tube 156 and the second guide tube 158 are exposed.

한편, 케이스(122)의 외부로 노출된 제 1 안내관(156)과 진공이젝터(152)는 제 1 진공안내라인(162)에 의해 연결되고, 케이스(122)의 외부로 노출된 제 2 안내관(158)과 흡착블록(132)에 형성된 수평진공유로(134)는 제 2 진공안내라인(164)에 의해서 연결된다. 즉, 온오프 밸브(154)를 개방할 때만 진공압이 형성되고, 온오프 밸브(154)를 폐쇄할 때는 온오프 밸브(154)와 진공흡착기(138) 사이에는 진공압이 형성되지 않는다. Meanwhile, the first guide tube 156 exposed to the outside of the case 122 and the vacuum ejector 152 are connected by the first vacuum guide line 162 and the second guide exposed to the outside of the case 122. The horizontal vacuum sharing path 134 formed in the pipe 158 and the adsorption block 132 is connected by the second vacuum guide line 164. That is, vacuum pressure is formed only when the on-off valve 154 is opened, and no vacuum pressure is formed between the on-off valve 154 and the vacuum absorber 138 when the on-off valve 154 is closed.

하기에는 전술한 바와 같이 형성된 반도체 칩 픽업장치(100)의 작동상태를 간략하게 설명한다.Hereinafter, an operating state of the semiconductor chip pickup device 100 formed as described above will be briefly described.

먼저, 통상의 트레이(tray; 도시되지 않음)에 횡으로 적치된 10개의 반도체 칩(도시되지 않음)을 흡착하여 또 다른 트레이(도시되지 않음)로 이송시키기 위해서는, 우선 이송하고자 하는 트레이에 적치된 반도체 칩의 상부에 진공패드(142)를 밀착시킨 상태 하에서 작동스위치(114)를 가압하면, 작동스위치(114)는 개폐버튼(160)을 가압하게 되고, 그 결과 온오프 밸브(154)는 개방된 상태를 유지하게 된다. First, in order to adsorb ten semiconductor chips (not shown) laterally stacked in a conventional tray (not shown) and transfer them to another tray (not shown), first, they are placed in the tray to be transferred. When the operation switch 114 is pressed while the vacuum pad 142 is in close contact with the upper portion of the semiconductor chip, the operation switch 114 presses the opening / closing button 160, and as a result, the on / off valve 154 is opened. Will remain intact.

이렇게 온오프 밸브(154)가 개방되면, 진공안내부(150)에는 진공압이 형성되어 반도체 칩을 흡착하게 되고, 흡착된 반도체 칩을 다음 공정을 위해 대기 중에 또 다른 트레이의 상부로 이송시킨 상태에서 다시 작동스위치(114)를 가압하면, 온오프 밸브(154)와 진공패드(142) 사이에는 진공압이 손실되어 진공패드(142)에 흡착되어 있던 반도체 칩은 또 다른 트레이에 적치된다.When the on-off valve 154 is opened in this way, a vacuum pressure is formed in the vacuum guide part 150 to adsorb the semiconductor chip, and the adsorbed semiconductor chip is transferred to the upper portion of another tray in the atmosphere for the next process. When the operation switch 114 is pressed again, the vacuum pressure is lost between the on-off valve 154 and the vacuum pad 142 so that the semiconductor chip adsorbed on the vacuum pad 142 is placed in another tray.

한편, 흡착블록(132)에 장착된 10개의 진공흡착기(138)가 10개미만의 반도체 칩을 흡착하지 않더라도 진공효율밸브(140)에 의해서 진공압이 형성된다. On the other hand, even if the ten vacuum adsorber 138 mounted on the adsorption block 132 does not adsorb less than 10 semiconductor chips, the vacuum pressure is formed by the vacuum efficiency valve 140.

상기에서는 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당기술 분야의 숙련된 당업자는 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims. You will understand.

도 1은 본 발명에 따른 반도체 칩 픽업장치를 나타낸 사시도이며, 그리고 1 is a perspective view showing a semiconductor chip pickup device according to the present invention, and

도 2는 도 1의 선 A-A를 따라 도시된 단면도이다. 2 is a cross-sectional view taken along the line A-A of FIG.

<도면의주요부분에대한부호의설명>Explanation of symbols on the main parts of the drawing

100 : 반도체 칩 픽업장치 110 : 작동부100: semiconductor chip pickup device 110: operating part

112 : 노브 114 : 작동스위치112: Knob 114: Operation Switch

112 : 케이스 130 : 흡착부112 case 130 adsorption unit

132 : 흡착블록 134 : 수평진공유로132: adsorption block 134: horizontal vacuum share

136 : 수직진공유로 138 : 진공흡착기136: vertical vacuum share 138: vacuum adsorber

140 : 진공효율밸브 142 : 진공패드140: vacuum efficiency valve 142: vacuum pad

150 : 진공안내부 152 : 진공이젝터150: vacuum guide unit 152: vacuum ejector

154 : 온오프 밸브 162 : 제 1 진공안내라인154: on-off valve 162: first vacuum guide line

164 : 제 2 진공안내라인164: second vacuum guidance line

Claims (6)

반도체 칩 픽업장치에 있어서, In a semiconductor chip pickup device, 작동스위치가 내장된 노브와, 상기 노브의 하부에 일체로 형성되고 내부에 챔버가 형성되는 케이스를 가지는 작동부;An operation part having a knob in which an operation switch is built and a case integrally formed at a lower part of the knob and in which a chamber is formed; 상기 케이스의 하부에 상부가 결합되고 일단에서부터 내부를 따라 타단에 인접한 위치까지 연장되는 수평진공유로 및 상기 수평진공유로에서 하부로 연장되는 다수의 수직진공유로가 형성된 흡착블록과, 각각의 상기 수직진공유로에 장착되어 반도체 칩을 흡착하는 다수의 진공흡착기를 가지는 흡착부; 및An adsorption block having an upper portion coupled to a lower portion of the case and extending from one end to a position adjacent to the other end and a plurality of vertical vacuum passages extending downward from the horizontal vacuum passage, respectively; An adsorption unit mounted to the flow path and having a plurality of vacuum adsorbers configured to adsorb the semiconductor chips; And 통상의 진공이젝터와, 상기 챔버 내에 배치되고 상기 진공이젝터 및 상기 수평진공유로와 연결되어 진공압의 형성을 제어하는 통상의 온오프 밸브와, 상기 진공이젝터와 상기 온오프 밸브를 연결하는 제 1 진공안내라인과, 상기 수평진공유로와 상기 온오프 밸브를 연결하는 제 2 진공안내라인을 가지는 진공안내부; 로 이루어진 것을 특징으로 하는 반도체 칩 픽업장치.A conventional vacuum ejector, a normal on-off valve disposed in the chamber and connected to the vacuum ejector and the horizontal vacuum sharing path to control the formation of vacuum pressure, and a first vacuum connecting the vacuum ejector and the on-off valve. A vacuum guide part having a guide line and a second vacuum guide line connecting the horizontal vacuum sharing path and the on-off valve; Semiconductor chip pickup device, characterized in that consisting of. 제 1 항에 있어서, 상기 노브는 상부 및 하부가 개방되고 내부가 빈 수직한 관 형상을 가지며, 상기 작동스위치는 상기 노브의 수직한 길이방향을 따라 연장되고, 상기 노브의 개방된 상부 내주면 상에는 환형의 이탈방지플랜지가 일체로 형성되며, 상기 작동스위치의 상부에 인접하게는 상부면이 상기 이탈방지플랜지의 하부에 밀착되는 환형의 이탈방지돌기가 일체로 형성되고, 상기 이탈방지돌기의 하부에 는 상기 노브의 하부까지 연장되어 상기 온오프 밸브의 상부와 밀착되는 압축스프링이 배치되는 것을 특징으로 하는 반도체 칩 픽업장치.2. The knob according to claim 1, wherein the knob has a vertical tubular shape of which the top and bottom are open and the inside is hollow, and the operation switch extends along a vertical longitudinal direction of the knob, and is annular on the open upper inner circumferential surface of the knob. The anti-separation flange of the integrally formed, the upper surface is adjacent to the upper portion of the annular escape prevention projection is formed integrally to the lower portion of the escape prevention flange integrally formed, the lower portion of the separation prevention projection And a compression spring extending to a lower portion of the knob and in close contact with an upper portion of the on / off valve. 제 1 항에 있어서, 상기 케이스는 하부가 개방되고 내부가 중공된 사각 함체 형상을 가지며, 중공된 내부에 상기 노브의 개방된 하부와 연결되는 상기 챔버가 형성되는 것을 특징으로 하는 반도체 칩 픽업장치. The semiconductor chip pick-up apparatus of claim 1, wherein the case has a rectangular box shape having an open bottom and a hollow inside, and the chamber is connected to the open bottom of the knob. 제 1 항에 있어서, 상기 진공흡착기는 각각의 상기 수직진공유로에 상부가 장착되는 통상의 진공효율밸브와, 상기 진공효율밸브의 하부에 장착되는 통상의 진공패드로 이루어지는 것을 특징으로 하는 반도체 칩 픽업장치.2. The semiconductor chip pickup of claim 1, wherein the vacuum adsorber comprises a normal vacuum efficiency valve mounted on an upper portion of each of the vertical vacuum paths, and a normal vacuum pad mounted on a lower portion of the vacuum efficiency valve. Device. 제 1 항에 있어서, 상기 온오프 밸브는 일단에 돌출되게 형성되는 제 1 안내관 및 제 2 안내관과, 상기 온오프 밸브의 내부에 형성되어 상기 제 1 안내관 및 상기 제 2 안내관을 연결하는 내부유로와, 상기 온오프 밸브의 상부에 돌출되게 형성되어 상기 내부유로를 개폐함과 아울러 상기 작동스위치의 하부와 마주보게 배치되어 상기 작동스위치에 의해 작동되는 개폐버튼을 구비하며, 상기 제 1 안내관 및 상기 제 2 안내관은 상기 케이스의 일단 외부로 노출되고, 상기 케이스의 일단에는 상기 제 1 안내관 및 상기 제 2 안내관이 노출될 수 있도록 관통장공이 형성된 것을 특징으로 하는 반도체 칩 픽업장치.According to claim 1, The on-off valve is formed in the first guide pipe and the second guide pipe protruding at one end, and formed in the on-off valve to connect the first guide pipe and the second guide pipe And an opening and closing button formed to protrude from an upper portion of the on-off valve to open and close the inner passage and face the lower portion of the operating switch, the opening and closing button operated by the operating switch. The guide tube and the second guide tube is exposed to the outside of one end of the case, the semiconductor chip pickup, characterized in that the through hole is formed so that the first guide tube and the second guide tube is exposed at one end of the case Device. 제 5 항에 있어서, 상기 제 1 안내관과 상기 진공이젝터는 상기 제 1 진공안내라인에 의해 연결되고, 상기 제 2 안내관과 상기 수평진공유로는 상기 제 2 진공안내라인에 의해서 연결되는 것을 특징으로 하는 반도체 칩 픽업장치. The method of claim 5, wherein the first guide tube and the vacuum ejector are connected by the first vacuum guide line, the second guide tube and the horizontal vacuum path is connected by the second vacuum guide line. A semiconductor chip pickup device.
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