JP2528910B2 - Solder bump forming method - Google Patents
Solder bump forming methodInfo
- Publication number
- JP2528910B2 JP2528910B2 JP62288903A JP28890387A JP2528910B2 JP 2528910 B2 JP2528910 B2 JP 2528910B2 JP 62288903 A JP62288903 A JP 62288903A JP 28890387 A JP28890387 A JP 28890387A JP 2528910 B2 JP2528910 B2 JP 2528910B2
- Authority
- JP
- Japan
- Prior art keywords
- solder ball
- solder
- circuit board
- recess
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔概要〕 回路基板の表面にハンダバンプを形成するための方法
に関し、 ハンダバンプを確実に形成せしめることを目的とし、 溶融ハンダに対し非濡れ性であって回路基板の所定部
に対向しハンダボールより小径の第１の透孔を有する第
１の保持板と、溶融ハンダに対し非濡れ性であって該ハ
ンダボールより大径かつ該第１の透孔に連通する第２の
透孔を有する第２の保持板とを重ねたハンダボール保持
具と、 真空装置によって減圧される凹所を有するハンダボー
ルキャリアの該凹所を該第１の保持板が塞ぐように、該
ハンダボールキャリアに該ハンダボール保持具を嵌合さ
せる工程と、 該凹所内の減圧によって該第２の透孔内に該ハンダボ
ールを吸引し保持する工程と、 該回路基板の上面に該ハンダボール保持具が所定の位
置関係で対向するように、所定の台に該ハンダボールキ
ャリアを重ねる工程と、 該真空装置による減圧を解除したのち、該ハンダボー
ル保持具を残して該ハンダボールキャリアを除去する工
程と、 該ハンダボール保持具内のハンダボールを該ハンダボ
ールの溶融温度に加熱したのち常温に冷却する工程とを
有し、 該回路基板の所定部にハンダバンプを被着させる構成
とする。DETAILED DESCRIPTION OF THE INVENTION [Outline] A method for forming solder bumps on the surface of a circuit board, for the purpose of surely forming solder bumps, which is non-wetting with respect to molten solder and has a predetermined portion of the circuit board. And a first holding plate having a first through hole having a diameter smaller than that of the solder ball and a second holding plate which is non-wettable to the molten solder and has a diameter larger than the solder ball and communicates with the first through hole. A solder ball holder on which a second holding plate having a through hole is stacked; and a solder ball carrier having a recess that is decompressed by a vacuum device so that the first holding plate closes the recess. A step of fitting the solder ball holder to a solder ball carrier; a step of sucking and holding the solder ball in the second through hole by reducing the pressure in the recess; and a solder ball on the upper surface of the circuit board. The holder is A step of stacking the solder ball carrier on a predetermined table so as to face each other in a predetermined positional relationship, and a step of removing the solder ball carrier leaving the solder ball holder after releasing the decompression by the vacuum device. A step of heating a solder ball in the solder ball holder to a melting temperature of the solder ball and then cooling it to room temperature, and applying a solder bump to a predetermined portion of the circuit board.
本発明はハンダバンプの形成方法、特に回路基板上の
複数個所にハンダバンプを同時かつ確実に形成させるた
めの改良に関する。The present invention relates to a method for forming solder bumps, and more particularly to an improvement for simultaneously and reliably forming solder bumps at a plurality of locations on a circuit board.
回路基板の表面に回路素子を搭載する等のため形成す
るハンダバンプの形成方法には、めっきを利用した方
法，ハンダペーストを利用した方法，ハンダボールを利
用した方法等があり、数百μｍの厚さのハンダバンプ
は、ハンダペーストまたはハンダボールを利用する。し
かし、ハンダペーストを利用した方法は、ハンダバンプ
の周辺部がだれるという欠点があり、かかる欠点なしに
形成するには、ハンダボールを利用する方法が採られて
いる。There are various methods of forming solder bumps for mounting circuit elements on the surface of a circuit board, including a method using plating, a method using solder paste, and a method using solder balls. For the solder bumps, solder paste or solder balls are used. However, the method using the solder paste has a drawback that the peripheral portion of the solder bump is sagging, and a method using a solder ball is adopted to form the solder bump without such a defect.
第４図はハンダボールを利用した従来のハンダバンプ
形成方法を説明するための図である。FIG. 4 is a diagram for explaining a conventional solder bump forming method using a solder ball.
第４図において、ハンダフラックス３を被着した回路
基板１上の複数個所（図は５ヶ所）の所定部２に、それ
ぞれハンダボール４を搭載し、そのハンダボール４を溶
融させてハンダバンプを形成させる従来方法は、各所定
部２に対向する透孔６を明けたハンダボール搭載板５
と、所定部２に対向しハンダボール４より小径の吸気孔
８を形成したハンダボールキャリヤ７とを利用する。In FIG. 4, solder balls 4 are mounted on predetermined portions 2 at a plurality of places (five in the figure) on the circuit board 1 to which the solder flux 3 is adhered, and the solder balls 4 are melted to form solder bumps. In the conventional method, the solder ball mounting plate 5 having the through holes 6 facing the predetermined portions 2 is formed.
And a solder ball carrier 7 that faces the predetermined portion 2 and has an intake hole 8 having a diameter smaller than that of the solder ball 4.
図示しない真空装置に接続し、該装置の駆動によって
空洞９内の空気が吸引されるキャリヤ７は、回路基板１
の設置位置と多数のハンダボール４を収容した容器（図
示せず）との間を移動し、回路基板１に搭載したハンダ
ボール搭載板５の各透孔６に、ハンダボール４を挿入さ
せる。The carrier 7, which is connected to a vacuum device (not shown) and the air in the cavity 9 is sucked by driving the device, is the circuit board 1.
Then, the solder balls 4 are inserted into the through holes 6 of the solder ball mounting plate 5 mounted on the circuit board 1 by moving the mounting position of the solder ball 4 and a container (not shown) accommodating a large number of solder balls 4.
そこで、回路基板１とハンダボール搭載板５とを重ね
た状態で一緒に加熱し、ハンダボール搭載板５の各透孔
６に挿入されたハンダボール４を溶融させると、回路基
板１の所定部２にはハンダバンプが形成されるようにな
る。Therefore, when the circuit board 1 and the solder ball mounting plate 5 are overlapped and heated together to melt the solder balls 4 inserted into the through holes 6 of the solder ball mounting plate 5, predetermined portions of the circuit board 1 are melted. Solder bumps will be formed on 2.
以上説明したように、ハンダボール４を使用した従来
のハンダバンプ形成方法は、ハンダボール４より小径の
吸気孔８の開口端に、ハンダボール４を吸気力で保持せ
しめて搬送し、吸気力を解除してハンダボール４を落下
せしめ透孔６に挿入させるが、軟質のハンダボール４が
吸気孔８の開口端に食いつき、吸気力を解除するも落下
しないことがあるという問題点があった。As described above, according to the conventional solder bump forming method using the solder ball 4, the solder ball 4 is held by the suction force and conveyed at the opening end of the suction hole 8 having a diameter smaller than that of the solder ball 4, and the suction force is released. Then, the solder ball 4 is dropped and inserted into the through hole 6, but there is a problem that the soft solder ball 4 bites at the opening end of the intake hole 8 and does not drop even if the intake force is released.
上記問題点の除去を目的とした本発明は、第１図の実
施例によれば、溶融ハンダに対し非濡れ性であって回路
基板の所定部に対向しハンダボールより小径の第１の透
孔を有する第１の保持板と、溶融ハンダに対し非濡れ性
であって該ハンダボールより大径かつ該第１の透孔に連
通する第２の透孔を有する第２の保持板とを重ねたハン
ダボール保持具と、 真空装置によって減圧される凹所を有するハンダボー
ルキャリアの該凹所を該第１の保持板が塞ぐように、該
ハンダボールキャリアに該ハンダボール保持具を嵌合さ
せる工程と、 該凹所内の減圧によって該第２の透孔内に該ハンダボ
ールを吸引し保持する工程と、 該回路基板の上面に該ハンダボール保持具が所定の位
置関係で対向するように、所定の台に該ハンダボールキ
ャリアを重ねる工程と、 該真空装置による減圧を解除したのち、該ハンダボー
ル保持具を残して該ハンダボールキャリアを除去する工
程と、 該ハンダボール保持具内のハンダボールを該ハンダボ
ールの溶融温度に加熱したのち常温に冷却する工程とを
有し、 該回路基板の所定部にハンダバンプを被着させること
を特徴としたハンダバンプの形成方法である。According to the embodiment of the present invention for eliminating the above-mentioned problems, according to the embodiment of FIG. 1, there is provided a first transparent plate which is non-wetting with respect to the molten solder and faces a predetermined portion of the circuit board and has a diameter smaller than the solder ball. A first holding plate having holes, and a second holding plate having a second through hole which is non-wetting with respect to the molten solder and has a diameter larger than that of the solder ball and which communicates with the first through hole. The solder ball holder is fitted to the solder ball carrier so that the first holding plate closes the recess of the solder ball carrier having the recess and the recess that is decompressed by the vacuum device. And a step of sucking and holding the solder ball in the second through hole by depressurizing the inside of the recess, so that the solder ball holder faces the upper surface of the circuit board in a predetermined positional relationship. , Stack the solder ball carrier on the designated table The step of removing the reduced pressure by the vacuum device, removing the solder ball carrier leaving the solder ball holder, and heating the solder ball in the solder ball holder to the melting temperature of the solder ball. After that, the method includes a step of cooling to room temperature, and a method of forming a solder bump is characterized in that a solder bump is adhered to a predetermined portion of the circuit board.
本発明によれば、ハンダボール保持板の透孔に該透孔
の一方からの吸気手段でハンダボールを保持せしめ、該
保持板と回路基板とを重ねて加熱して該透孔内のハンダ
ボールを溶かし、回路基板の所定部にハンダバンブを形
成させることで、ハンダボールの移し換えの行われない
ことがあるという従来方法の問題点を除去し、ハンダバ
ンブが確実に形成できるようになる。According to the present invention, the solder balls are held in the through holes of the solder ball holding plate by the suction means from one of the through holes, and the holding plate and the circuit board are superposed and heated so that the solder balls in the through holes are held. By melting the solder and forming a solder bump on a predetermined portion of the circuit board, the problem of the conventional method that the solder balls may not be transferred can be eliminated, and the solder bump can be reliably formed.
以下に、図面を用いて本発明によるハンダバンプの形
成方法を説明する。Hereinafter, a method for forming a solder bump according to the present invention will be described with reference to the drawings.
第１図は本発明方法の一実施例に係わるハンダバンプ
形成装置の主要部を示す側断面図（イ），（ロ），
（ハ）と、ハンダバンプの形成された回路基板の側面図
（ニ）である。FIG. 1 is a side sectional view (a), (b) showing a main part of a solder bump forming apparatus according to an embodiment of the method of the present invention.
FIG. 6C is a side view of the circuit board having solder bumps formed thereon.
第１図において、装置はハンダボールキャリア11と、
ハンダボール保持具12と、回路基板１を搭載する台13を
具えてなる。In FIG. 1, the device comprises a solder ball carrier 11 and
It comprises a solder ball holder 12 and a base 13 on which the circuit board 1 is mounted.
図示しない真空装置に接続し、台13の配設位置と多数
のハンダボールを収容した容器との間を移動し、該移動
端で上下動するハンダボールキャリア11は、下方に開口
する凹所14と保持具12の嵌合する凹所19を具えてなる。The solder ball carrier 11, which is connected to a vacuum device (not shown) and moves between the position where the table 13 is arranged and a container containing a large number of solder balls and moves up and down at the moving end, has a recess 14 that opens downward. And a recess 19 into which the holder 12 fits.
ハンダボール保持具12は、回路基板１の所定部２に対
向しハンダボールの嵌合自在な透孔16をあけた保持板15
とハンダボールより小径の透孔18をあけた吸引板17から
なり、透孔16と18とは同心に形成されている。ただし、
ハンダボールの溶融時にも使用するハンダボール保持具
12は、溶融ハンダに対し非濡れ性であり、従って保持板
15と吸引板17とは、例えばインバーにクロームめっきを
施してなる。The solder ball holder 12 is a holding plate 15 facing a predetermined portion 2 of the circuit board 1 and having a through hole 16 into which a solder ball can be fitted.
And a suction plate 17 having a through hole 18 having a diameter smaller than that of the solder ball, and the through holes 16 and 18 are formed concentrically. However,
Solder ball holder used even when melting the solder balls
12 is non-wettable to the molten solder and therefore the holding plate
The suction plate 17 and the suction plate 17 are made of, for example, chrome-plated Invar.
台13の上面には、上方に突出する少なくとも一対の突
起20と、回路基板１の嵌合する凹部21を設け、周囲にス
ペーサ23を張設してなり、突起20の嵌合する凹所22をキ
ャリア11に形成し、突起20の貫通する貫通孔24が保持具
12に形成されている。At least a pair of protrusions 20 projecting upward and a recess 21 into which the circuit board 1 is fitted are provided on the upper surface of the base 13, and a spacer 23 is stretched around the periphery to form a recess 22 into which the protrusion 20 is fitted. Is formed in the carrier 11, and the through hole 24 through which the protrusion 20 penetrates is a holder.
12 formed.
このようなハンダボールキャリア11,ハンダボール保
持板12,台13を具えた装置を使用し、回路基板１の所定
部２には、ハンダバンプ10が形成される。A solder bump 10 is formed on the predetermined portion 2 of the circuit board 1 by using an apparatus including the solder ball carrier 11, the solder ball holding plate 12, and the base 13.
第２図（イ）〜（ニ）は前述の装置を使用し、ハンダ
バンプを形成させる方法の手順を説明するための図であ
る。FIGS. 2 (A) to 2 (D) are views for explaining the procedure of a method for forming solder bumps using the above-mentioned apparatus.
第２図（イ）において、キャリア11の凹所19にハンダ
ボール保持具12を嵌合せしめ、その保持具12の下面がハ
ンダボール容器のハンダボールと接する状態で、凹所14
内を排気（減圧）させると、保持板15の各透孔16にハン
ダボール４が嵌合，保持されるようになる。In FIG. 2 (a), the solder ball holder 12 is fitted into the recess 19 of the carrier 11, and the recess 14 is held with the lower surface of the holder 12 in contact with the solder ball of the solder ball container.
When the inside is evacuated (decompressed), the solder balls 4 are fitted and held in the through holes 16 of the holding plate 15.
他方、台13の凹所21には第２図（ロ）に示すように、
ハンダバンプを形成すべき所定部２を形成し、ハンダフ
ラックス３の被着された回路基板１を嵌合させる。On the other hand, in the recess 21 of the base 13, as shown in FIG.
A predetermined portion 2 on which a solder bump is to be formed is formed, and the circuit board 1 to which the solder flux 3 is attached is fitted.
そこで第２図（ハ）に示すように、突起20に凹所22を
嵌合せしめて台13にキャリア11を重ね、凹所14の排気を
解除した後、第２図（ニ）に示すように、ハンダボール
保持具12を残してキャリア11をを除去し、ハンダボール
保持具12の搭載された台13をハンダ溶融温度に加熱する
と、各ハンダボール４は溶けて第１図（ニ）示すよう
に、所定部２の上にハンダバンブ10が形成される。Then, as shown in FIG. 2C, the recess 22 is fitted to the protrusion 20 and the carrier 11 is placed on the base 13, and the exhaust of the recess 14 is released. Then, as shown in FIG. When the carrier 11 is removed leaving the solder ball holder 12 and the table 13 on which the solder ball holder 12 is mounted is heated to the solder melting temperature, the solder balls 4 are melted and as shown in FIG. Then, the solder bump 10 is formed on the predetermined portion 2.
以上説明したように本発明によれば、ハンダボール保
持板の透孔に該透孔の一方からの吸気手段でハンダボー
ルを保持せしめ、該保持板と回路基板とを重ねて加熱し
て該透孔内のハンダボールを溶かし、回路基板の所定部
にハンダバンブを形成させることで、ハンダボールを使
用したハンダバンブの形成が従来方法よりが確実とな
り、混成集積回路等においてハンダバンブのチェックお
よび修正の工数を著しく低減させた効果がある。As described above, according to the present invention, the solder balls are held in the through holes of the solder ball holding plate by the suction means from one of the through holes, and the holding plate and the circuit board are superposed and heated to heat the through holes. By melting the solder balls in the holes and forming the solder bumps on the prescribed parts of the circuit board, the solder bumps using the solder balls can be formed more reliably than the conventional method, and the man-hours for checking and correcting the solder bumps in a hybrid integrated circuit can be reduced. There is a significant reduction effect.
第１図は本発明方法の一実施例に係わる装置の主要部と
ハンダバンプを示す図、 第２図は第１図に示す装置を使用したハンダバンプ形成
手順を説明するための図、 第３図はハンダボールを利用した従来のハンダバンプ形
成方法の説明図、 である。 図中において、 １は回路基板、 ２は回路基板の所定部、 ４はハンダボール、 10はハンダバンプ、 11はハンダボールキャリア、 12はハンダボール保持具、 13は台、 15,17はハンダボール保持板、 16,18は透孔、 を示す。FIG. 1 is a diagram showing a main part and a solder bump of an apparatus according to an embodiment of the method of the present invention, FIG. 2 is a diagram for explaining a solder bump forming procedure using the apparatus shown in FIG. 1, and FIG. It is explanatory drawing of the conventional solder bump formation method using a solder ball. In the figure, 1 is a circuit board, 2 is a predetermined part of the circuit board, 4 is a solder ball, 10 is a solder bump, 11 is a solder ball carrier, 12 is a solder ball holder, 13 is a stand, and 15 and 17 are solder ball holders. Plates, 16 and 18 are through holes.
Claims (1)
板の所定部に対向しハンダボールより小径の第１の透孔
を有する第１の保持板と、溶融ハンダに対し非濡れ性で
あって該ハンダボールより大径かつ該第１の透孔に連通
する第２の透孔を有する第２の保持板とを重ねたハンダ
ボール保持具と、 真空装置によって減圧される凹所を有するハンダボール
キャリアの該凹所を該第１の保持板が塞ぐように、該ハ
ンダボールキャリアに該ハンダボール保持具を嵌合させ
る工程と、 該凹所内の減圧によって該第２の透孔内に該ハンダボー
ルを吸引し保持する工程と、 該回路基板の上面に該ハンダボール保持具が所定の位置
関係で対向するように、所定の台に該ハンダボールキャ
リアを重ねる工程と、 該真空装置による減圧を解除したのち、該ハンダボール
保持具を残して該ハンダボールキャリアを除去する工程
と、 該ハンダボール保持具内のハンダボールを該ハンダボー
ルの溶融温度に加熱したのち常温に冷却する工程とを有
し、 該回路基板の所定部にハンダバンプを被着させることを
特徴としたハンダバンプの形成方法。1. A first holding plate, which is non-wetting to molten solder and has a first through hole facing a predetermined portion of a circuit board and having a diameter smaller than that of a solder ball, and non-wetting to molten solder. And a solder ball holder having a second holding plate having a diameter larger than that of the solder ball and having a second through hole communicating with the first through hole, and a recess for reducing the pressure by a vacuum device. A step of fitting the solder ball holder to the solder ball carrier so that the first holding plate closes the recess of the solder ball carrier; and a step of depressurizing the inside of the recess into the second through hole. A step of sucking and holding the solder ball; a step of stacking the solder ball carrier on a predetermined stand so that the solder ball holder faces the upper surface of the circuit board in a predetermined positional relationship; After releasing the reduced pressure, A step of removing the solder ball carrier leaving the solder ball holder, and a step of heating the solder ball in the solder ball holder to a melting temperature of the solder ball and then cooling to room temperature. A method of forming a solder bump, which comprises depositing a solder bump on a predetermined portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62288903A JP2528910B2 (en) | 1987-11-16 | 1987-11-16 | Solder bump forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62288903A JP2528910B2 (en) | 1987-11-16 | 1987-11-16 | Solder bump forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129446A JPH01129446A (en) | 1989-05-22 |
| JP2528910B2 true JP2528910B2 (en) | 1996-08-28 |
Family
ID=17736277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62288903A Expired - Lifetime JP2528910B2 (en) | 1987-11-16 | 1987-11-16 | Solder bump forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528910B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5293072A (en) * | 1990-06-25 | 1994-03-08 | Fujitsu Limited | Semiconductor device having spherical terminals attached to the lead frame embedded within the package body |
| DE69312411T2 (en) * | 1992-09-15 | 1997-11-27 | Texas Instruments Inc | Ball contacting for flip-chip arrangements |
| US5985694A (en) * | 1997-09-29 | 1999-11-16 | Motorola, Inc. | Semiconductor die bumping method utilizing vacuum stencil |
| KR101946719B1 (en) * | 2017-08-04 | 2019-05-08 | 주식회사 프로텍 | Apparatus for Mounting Solder Ball or Solder Paste |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225435A (en) * | 1985-07-25 | 1987-02-03 | Ikeda Jido Kiki Kk | Formation of boding bump |
-
1987
- 1987-11-16 JP JP62288903A patent/JP2528910B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01129446A (en) | 1989-05-22 |
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