JPS58102260U - Solder supply device - Google Patents

Solder supply device

Info

Publication number
JPS58102260U
JPS58102260U JP19337081U JP19337081U JPS58102260U JP S58102260 U JPS58102260 U JP S58102260U JP 19337081 U JP19337081 U JP 19337081U JP 19337081 U JP19337081 U JP 19337081U JP S58102260 U JPS58102260 U JP S58102260U
Authority
JP
Japan
Prior art keywords
drive device
solder
turned
limit switch
supply device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19337081U
Other languages
Japanese (ja)
Other versions
JPS6235572Y2 (en
Inventor
近藤 権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP19337081U priority Critical patent/JPS58102260U/en
Publication of JPS58102260U publication Critical patent/JPS58102260U/en
Application granted granted Critical
Publication of JPS6235572Y2 publication Critical patent/JPS6235572Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例を示す一部破断側面図、第
2図は第1図のA−A線による断面図、第3図は第1図
のB−E3線による断面図、第4図は第3図のすべり台
が傾斜した状態を示す断面図、第5図はこの考案のはん
だ補給装置のシステムの一例を示す回路図である。 図中、1ははんだ補給装置、2は固形はんだ、3はホッ
パ、−4は補給口、5.16は駆動装置、6.17はシ
リンダ、7,18はロッド、8は押出板、9は接触片、
10.20はリミットスイッチ、11は傾斜面、12は
すべ′り台、13は長孔、14は支持軸、15は軸受、
19はピン、21ははんに槽、22は溶融はんだ、23
はフロート、24はフロートスイッチ、25はリレー、
26゜27はリレー接点、28.30はタイマ、29.
   ”31はタイマ接点である。
FIG. 1 is a partially cutaway side view showing an embodiment of this invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. 3 is a sectional view taken along line B-E3 in FIG. 1. FIG. 4 is a sectional view showing the slide shown in FIG. 3 in an inclined state, and FIG. 5 is a circuit diagram showing an example of the system of the solder replenishing device of this invention. In the figure, 1 is a solder supply device, 2 is solid solder, 3 is a hopper, -4 is a supply port, 5.16 is a drive device, 6.17 is a cylinder, 7 and 18 are rods, 8 is an extrusion plate, and 9 is a contact piece,
10.20 is a limit switch, 11 is an inclined surface, 12 is a slide, 13 is a long hole, 14 is a support shaft, 15 is a bearing,
19 is a pin, 21 is a solder tank, 22 is a molten solder, 23
is a float, 24 is a float switch, 25 is a relay,
26°27 is a relay contact, 28.30 is a timer, 29.
"31 is a timer contact.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] はんだ糟内の溶融はんだの液面上にあるフ、ロートが所
定液位でオンするフロートスイッチと、このフロートス
イッチがオンしたときにホッパ内の固形はんだを押し出
して落下させる第1の駆動装置と、この第1の駆動装置
の動作によりオンされる第1のリミットスイッチと、こ
の第1のリミットスイッチのオンによりすべり台を回動
傾斜させる第2の駆動装置と、前記すべり台が回動傾斜
している間は前記第1の駆動装置を作動させないように
オフする第2のリミットスイッチとを設けたことを特徴
とするはんだ補給装置。
A float switch that turns on the float above the molten solder in the solder pot when the funnel is at a predetermined liquid level, and a first drive device that pushes out the solid solder in the hopper and drops it when the float switch is turned on. , a first limit switch that is turned on by the operation of the first drive device; a second drive device that rotates and tilts the slide when the first limit switch is turned on; and a second drive device that rotates and tilts the slide when the first limit switch is turned on. and a second limit switch that turns off the first drive device so as not to operate it while the solder supply device is in use.
JP19337081U 1981-12-28 1981-12-28 Solder supply device Granted JPS58102260U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19337081U JPS58102260U (en) 1981-12-28 1981-12-28 Solder supply device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19337081U JPS58102260U (en) 1981-12-28 1981-12-28 Solder supply device

Publications (2)

Publication Number Publication Date
JPS58102260U true JPS58102260U (en) 1983-07-12
JPS6235572Y2 JPS6235572Y2 (en) 1987-09-10

Family

ID=30106731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19337081U Granted JPS58102260U (en) 1981-12-28 1981-12-28 Solder supply device

Country Status (1)

Country Link
JP (1) JPS58102260U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182766U (en) * 1984-11-02 1986-05-31

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5257967A (en) * 1975-11-07 1977-05-12 Matsushita Electric Ind Co Ltd Automatic solder supplying device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5257967A (en) * 1975-11-07 1977-05-12 Matsushita Electric Ind Co Ltd Automatic solder supplying device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6182766U (en) * 1984-11-02 1986-05-31

Also Published As

Publication number Publication date
JPS6235572Y2 (en) 1987-09-10

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