JPS60146389U - Circuit board for electronic equipment - Google Patents
Circuit board for electronic equipmentInfo
- Publication number
- JPS60146389U JPS60146389U JP3410484U JP3410484U JPS60146389U JP S60146389 U JPS60146389 U JP S60146389U JP 3410484 U JP3410484 U JP 3410484U JP 3410484 U JP3410484 U JP 3410484U JP S60146389 U JPS60146389 U JP S60146389U
- Authority
- JP
- Japan
- Prior art keywords
- electronic equipment
- circuit board
- board
- chassis
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来の方法による基板とシャーシの組み立て
られた断面図、第2図は、本考案の一実施例を示す基板
の主要部の斜視図、第3図は、第2図のA−A線断面を
示すシャーシとの組立て後 −の断面図である。
1・・・チップ部品、2・・・両面基板、3・・・シャ
ーシ、4・・・基板上面パターン、5・・・基板下面パ
ターン、6・・・下面半田フィレット、7・・・上面ア
ース半田、8・・・基板切り込み、9・・・端面スルー
ホールメッキ、10・・・上面半田フィレット。FIG. 1 is a cross-sectional view of the board and chassis assembled by the conventional method, FIG. 2 is a perspective view of the main part of the board showing an embodiment of the present invention, and FIG. 3 is the A of FIG. - It is a cross-sectional view after assembly with the chassis showing a cross section along the A line. DESCRIPTION OF SYMBOLS 1...Chip component, 2...Double-sided board, 3...Chassis, 4...Board top surface pattern, 5...Bottom surface pattern, 6...Bottom surface solder fillet, 7...Top surface ground Solder, 8... Board notch, 9... End surface through-hole plating, 10... Top surface solder fillet.
Claims (1)
電子機器において、基板パターンとシャーシとのアース
半田付けを、同時ディップ半田することにより両面同時
に均一な半田フィレットを形成すべ(、基板端面に直接
、又は切り込みを設けた内端面にスルーホールメッキ処
理等により銅箔等を施したことを特徴とする電子機器用
回路基−板。In an electronic device in which a circuit is configured on a double-sided copper foil board and housed in a chassis, uniform solder fillets can be formed on both sides at the same time by simultaneous dip soldering of the ground solder between the board pattern and the chassis. 1. A circuit board for electronic equipment, characterized in that a copper foil or the like is applied directly to the inner end surface thereof or by through-hole plating or the like on the inner end surface provided with a notch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3410484U JPS60146389U (en) | 1984-03-12 | 1984-03-12 | Circuit board for electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3410484U JPS60146389U (en) | 1984-03-12 | 1984-03-12 | Circuit board for electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60146389U true JPS60146389U (en) | 1985-09-28 |
Family
ID=30537163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3410484U Pending JPS60146389U (en) | 1984-03-12 | 1984-03-12 | Circuit board for electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60146389U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125767A (en) * | 1974-08-27 | 1976-03-02 | Sharp Kk | Denshibuhin no setsuzokuhoho |
JPS527065B2 (en) * | 1974-10-03 | 1977-02-26 |
-
1984
- 1984-03-12 JP JP3410484U patent/JPS60146389U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5125767A (en) * | 1974-08-27 | 1976-03-02 | Sharp Kk | Denshibuhin no setsuzokuhoho |
JPS527065B2 (en) * | 1974-10-03 | 1977-02-26 |
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