JPS592176U - printed board - Google Patents
printed boardInfo
- Publication number
- JPS592176U JPS592176U JP9792382U JP9792382U JPS592176U JP S592176 U JPS592176 U JP S592176U JP 9792382 U JP9792382 U JP 9792382U JP 9792382 U JP9792382 U JP 9792382U JP S592176 U JPS592176 U JP S592176U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- outer frame
- printed board
- copper foil
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来から用いられているプリント板の斜視図、
第2図は第1図の■−■線に沿った断面図、第3図は本
考案のプリント板の断面図、及び第4図は第3図のプリ
ント板の整形工程を示す断面図である。
11・・・絶縁基板、12・・・外枠部、13・・・配
線部、14・・・カッティング面、15.16・・・銅
箔ランド、17・・・エツジ。Figure 1 is a perspective view of a conventionally used printed board.
Figure 2 is a sectional view taken along the line ■-■ in Figure 1, Figure 3 is a sectional view of the printed board of the present invention, and Figure 4 is a sectional view showing the shaping process of the printed board in Figure 3. be. DESCRIPTION OF SYMBOLS 11... Insulating board, 12... Outer frame part, 13... Wiring part, 14... Cutting surface, 15.16... Copper foil land, 17... Edge.
Claims (1)
境界部分に銅箔ランドを被着して成り、これら各部をカ
ッティング面で互に係留保持させ配線部側の回路部品の
半田処理後に前記配線部を前記外枠部からプツシ解放す
るプリント配線体において、前記外枠部はその内接側の
銅ランドエツジを丸め加工し、前記配線部の銅箔ランド
と切離させたことを特徴とするプリント板。The insulating board is punched out and divided into an outer frame part and a wiring part, and a copper foil land is attached to the boundary part, and these parts are held together by the cutting surface, and after the circuit components on the wiring part side are soldered. In the printed wiring body in which the wiring portion is pushed and released from the outer frame portion, the outer frame portion has a copper land edge on the inscribed side rounded and separated from the copper foil land of the wiring portion. printed board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9792382U JPS592176U (en) | 1982-06-28 | 1982-06-28 | printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9792382U JPS592176U (en) | 1982-06-28 | 1982-06-28 | printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS592176U true JPS592176U (en) | 1984-01-09 |
Family
ID=30232718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9792382U Pending JPS592176U (en) | 1982-06-28 | 1982-06-28 | printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS592176U (en) |
-
1982
- 1982-06-28 JP JP9792382U patent/JPS592176U/en active Pending
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