JPS592176U - printed board - Google Patents

printed board

Info

Publication number
JPS592176U
JPS592176U JP9792382U JP9792382U JPS592176U JP S592176 U JPS592176 U JP S592176U JP 9792382 U JP9792382 U JP 9792382U JP 9792382 U JP9792382 U JP 9792382U JP S592176 U JPS592176 U JP S592176U
Authority
JP
Japan
Prior art keywords
wiring
outer frame
printed board
copper foil
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9792382U
Other languages
Japanese (ja)
Inventor
西村 武志
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP9792382U priority Critical patent/JPS592176U/en
Publication of JPS592176U publication Critical patent/JPS592176U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来から用いられているプリント板の斜視図、
第2図は第1図の■−■線に沿った断面図、第3図は本
考案のプリント板の断面図、及び第4図は第3図のプリ
ント板の整形工程を示す断面図である。 11・・・絶縁基板、12・・・外枠部、13・・・配
線部、14・・・カッティング面、15.16・・・銅
箔ランド、17・・・エツジ。
Figure 1 is a perspective view of a conventionally used printed board.
Figure 2 is a sectional view taken along the line ■-■ in Figure 1, Figure 3 is a sectional view of the printed board of the present invention, and Figure 4 is a sectional view showing the shaping process of the printed board in Figure 3. be. DESCRIPTION OF SYMBOLS 11... Insulating board, 12... Outer frame part, 13... Wiring part, 14... Cutting surface, 15.16... Copper foil land, 17... Edge.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板を打抜いて外枠部と配線部に区分するとともに
境界部分に銅箔ランドを被着して成り、これら各部をカ
ッティング面で互に係留保持させ配線部側の回路部品の
半田処理後に前記配線部を前記外枠部からプツシ解放す
るプリント配線体において、前記外枠部はその内接側の
銅ランドエツジを丸め加工し、前記配線部の銅箔ランド
と切離させたことを特徴とするプリント板。
The insulating board is punched out and divided into an outer frame part and a wiring part, and a copper foil land is attached to the boundary part, and these parts are held together by the cutting surface, and after the circuit components on the wiring part side are soldered. In the printed wiring body in which the wiring portion is pushed and released from the outer frame portion, the outer frame portion has a copper land edge on the inscribed side rounded and separated from the copper foil land of the wiring portion. printed board.
JP9792382U 1982-06-28 1982-06-28 printed board Pending JPS592176U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9792382U JPS592176U (en) 1982-06-28 1982-06-28 printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9792382U JPS592176U (en) 1982-06-28 1982-06-28 printed board

Publications (1)

Publication Number Publication Date
JPS592176U true JPS592176U (en) 1984-01-09

Family

ID=30232718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9792382U Pending JPS592176U (en) 1982-06-28 1982-06-28 printed board

Country Status (1)

Country Link
JP (1) JPS592176U (en)

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