JPS5965564U

JPS5965564U - Printed board

Info

Publication number: JPS5965564U
Application number: JP16045282U
Authority: JP
Inventors: 忍加藤
Original assignee: 松下電器産業株式会社
Priority date: 1982-10-22
Filing date: 1982-10-22
Publication date: 1984-05-01

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は一般的なチップ部品固定用銅箔パターンの形状
を示す図、第２図、第３図はおのおの従来のプリント基
板の平面図、第４図は本考案の一実施例におけるプリン
ト基板の平面図である。１．１′・・・・・・チップ部品固定用銅箔パターン、
２・・・・・・チップ部品、３・・・・・・広面積銅箔
パターン、４・・・・・・第１の銅箔パターン、５・・
・・・・第２の銅箔パターン。Figure 1 is a diagram showing the shape of a common copper foil pattern for fixing chip components, Figures 2 and 3 are plan views of conventional printed circuit boards, and Figure 4 is a printed circuit board according to an embodiment of the present invention. FIG. 1.1'...Copper foil pattern for fixing chip components,
2... Chip component, 3... Wide area copper foil pattern, 4... First copper foil pattern, 5...
...Second copper foil pattern.

Claims

[Scope of utility model registration request]

forming a first copper foil pattern for fixing a chip component integrally within the wide-area copper foil pattern; removing a portion of the wide-area copper foil pattern that is in contact with three sides of the copper foil pattern for chip components;
The second copper foil pattern facing the first chip component fixing copper foil pattern
The wide-area copper foil pattern between the copper foil pattern for fixing chip components is completely removed, and the side of the first copper foil pattern for fixing chip components opposite to the second copper foil pattern for fixing chip components is removed. Continuously form a first copper foil pattern narrower in width than the copper foil pattern for fixing chip components, and then form a first copper foil pattern narrower in width between the ends of the wide area copper foil patterns located on both sides of the first copper foil pattern for fixing chip components. A printed circuit board formed by connecting a first copper foil pattern with a second copper foil turn having approximately the same width and connecting an end of the first copper foil pattern to a second copper foil pattern.