JPS5931270U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS5931270U JPS5931270U JP12621482U JP12621482U JPS5931270U JP S5931270 U JPS5931270 U JP S5931270U JP 12621482 U JP12621482 U JP 12621482U JP 12621482 U JP12621482 U JP 12621482U JP S5931270 U JPS5931270 U JP S5931270U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed circuit
- circuit board
- copper foil
- perforated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板を示す平面図、第２図は分
離した第１第２基板をプラグを用いて結 線した例を示
す斜視図、第３図は第１図のプリント基板を検査すると
きの様子を示す側面図、第４図は本考案のプリント基板
を示す平面図である。
１０・・・・・・プリント基板、１１．１２・・・・・
・透孔、１３．１５・・・・・・第１第２基板、１７・
・・・・・接続用銅箔部。Figure 1 is a plan view showing a conventional printed circuit board, Figure 2 is a perspective view showing an example in which separated first and second boards are connected using a plug, and Figure 3 is an inspection of the printed circuit board shown in Figure 1. FIG. 4 is a plan view showing the printed circuit board of the present invention. 10... Printed circuit board, 11.12...
-Through hole, 13.15...First and second substrate, 17.
・・・・・・Copper foil part for connection.
Claims (2)
の透孔が形成されたプリント基板に於いて、前記ミシン
目状の透孔間に、前記第１基板及び第２基板の各銅箔部
間を電気的に接続する接続用銅箔部を設けたことを特徴
とするプリント基板。(1) In a printed circuit board in which a perforated through hole for bending and separation is formed between a first substrate and a second substrate, the first substrate and the second substrate are connected between the perforated through hole. A printed circuit board characterized in that a connecting copper foil part is provided for electrically connecting each copper foil part of the board.
なっていることを特徴とする実用新案登録請求の範囲第
１項記載のプリント基板。(2) The printed circuit board according to claim 1, wherein the connection copper foil portion has a narrower width near the perforated hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12621482U JPS5931270U (en) | 1982-08-20 | 1982-08-20 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12621482U JPS5931270U (en) | 1982-08-20 | 1982-08-20 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5931270U true JPS5931270U (en) | 1984-02-27 |
Family
ID=30287076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12621482U Pending JPS5931270U (en) | 1982-08-20 | 1982-08-20 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931270U (en) |
-
1982
- 1982-08-20 JP JP12621482U patent/JPS5931270U/en active Pending
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