JPS59155758U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS59155758U
JPS59155758U JP4820883U JP4820883U JPS59155758U JP S59155758 U JPS59155758 U JP S59155758U JP 4820883 U JP4820883 U JP 4820883U JP 4820883 U JP4820883 U JP 4820883U JP S59155758 U JPS59155758 U JP S59155758U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
sealed
resin
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4820883U
Other languages
Japanese (ja)
Inventor
敏行 山口
達彦 入江
Original Assignee
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電工株式会社 filed Critical 松下電工株式会社
Priority to JP4820883U priority Critical patent/JPS59155758U/en
Publication of JPS59155758U publication Critical patent/JPS59155758U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来例を示す斜視図、第３図及び第
４図はこの考案の一実施例を示す斜視図である。1 and 2 are perspective views showing a conventional example, and FIGS. 3 and 4 are perspective views showing an embodiment of this invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面に回路形成し、その両面をスルホール部にて接続し
、一方の回路面に半導体素子を実装すると共に樹脂封止
を行なう印刷配線板において、印刷配線板の樹脂封止を
しない面のスルホール部にソルダーレジストを塗布して
成る印刷配線板。In a printed wiring board in which circuits are formed on both sides, both sides are connected by through-holes, and a semiconductor element is mounted on one circuit side and resin-sealed, the through-holes on the side of the printed wiring board that is not resin-sealed. A printed wiring board made by applying solder resist to the surface.
JP4820883U 1983-03-31 1983-03-31 printed wiring board Pending JPS59155758U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4820883U JPS59155758U (en) 1983-03-31 1983-03-31 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4820883U JPS59155758U (en) 1983-03-31 1983-03-31 printed wiring board

Publications (1)

Publication Number Publication Date
JPS59155758U true JPS59155758U (en) 1984-10-19

Family

ID=30178748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4820883U Pending JPS59155758U (en) 1983-03-31 1983-03-31 printed wiring board

Country Status (1)

Country Link
JP (1) JPS59155758U (en)

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