JPS6415659U - - Google Patents
Info
- Publication number
- JPS6415659U JPS6415659U JP10914087U JP10914087U JPS6415659U JP S6415659 U JPS6415659 U JP S6415659U JP 10914087 U JP10914087 U JP 10914087U JP 10914087 U JP10914087 U JP 10914087U JP S6415659 U JPS6415659 U JP S6415659U
- Authority
- JP
- Japan
- Prior art keywords
- weir plate
- sectional
- view
- soldering device
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のはんだ付け装置の一実施例を
示す断面図、第２図はその要部の断面図、第３図
はその堰板上での流速と波高との関係を示すグラ
フ、第４図は従来のはんだ付け装置の断面図、第
５図はその堰板上でのはんだ流出過程を示す断面
図、第６図はその従来の堰板上での流速と波高と
の関係を示すグラフ、第７図乃至第１６図は本考
案を従来例との関連で理論的に補足説明するため
の参考図であり、第７図は従来の堰板の上部を示
す断面図、第８図はその部分における流速・波高
の関係を示すグラフ、第９図はプリント配線基板
がはんだ面から離脱する状態を示す断面図、第１
０図はその離脱部分で生ずる弊害を説明するため
の拡大断面図、第１１図は従来のはんだ溜部の断
面図、第１２図はその従来の堰板上での表面張力
の釣合い状態を示す拡大断面図、第１３図は厚さ
零の堰板を仮定した場合の断面図、第１４図は本
考案のナイフエツジ形堰板の上部での表面張力の
釣合い状態を示す拡大断面図、第１５図は従来の
堰板および本考案の堰板のＦ・θ関係を示すグラ
フ、第１６図は本考案に係る堰板の具体例を示す
断面図である。
１４……ノズル、２１……はんだ溜部、３３…
…ナイフエツジ形の堰板。
FIG. 1 is a cross-sectional view showing an embodiment of the soldering device of the present invention, FIG. 2 is a cross-sectional view of the main parts thereof, and FIG. 3 is a graph showing the relationship between flow velocity and wave height on the weir plate. Figure 4 is a sectional view of a conventional soldering device, Figure 5 is a sectional view showing the process of solder flowing out on the weir plate, and Figure 6 is the relationship between the flow velocity and wave height on the conventional weir plate. The graphs shown in FIGS. 7 to 16 are reference views for theoretically supplementing the present invention in relation to the conventional example, and FIG. 7 is a sectional view showing the upper part of the conventional weir plate, The figure is a graph showing the relationship between flow velocity and wave height in that part, Figure 9 is a cross-sectional view showing the state in which the printed wiring board is separated from the solder surface, and Figure 1
Figure 0 is an enlarged sectional view to explain the adverse effects that occur at the detached part, Figure 11 is a sectional view of a conventional solder pool, and Figure 12 shows the balanced state of surface tension on the conventional weir plate. FIG. 13 is an enlarged cross-sectional view assuming a weir plate with zero thickness; FIG. 14 is an enlarged cross-sectional view showing the balanced state of surface tension at the upper part of the knife-edge type weir plate of the present invention; FIG. The figure is a graph showing the F/θ relationship between a conventional weir plate and a weir plate according to the present invention, and FIG. 16 is a sectional view showing a specific example of the weir plate according to the present invention. 14... Nozzle, 21... Solder reservoir, 33...
...knife edge shaped weir plate.
Claims (1)
んだ溜部が設けられ、このはんだ溜部の先端部に
堰板が設けられたはんだ付け装置において、堰板
をナイフエツジ形に形成したことを特徴とするは
んだ付け装置。 (2) 堰板の取付角度が調整可能であることを特
徴とする実用新案登録請求の範囲第１項記載のは
んだ付け装置。[Scope of Claim for Utility Model Registration] (1) In a soldering device in which a solder reservoir is provided on the workpiece delivery side of a molten solder jet nozzle and a weir plate is provided at the tip of this solder reservoir, the weir plate is attached to a knife edge. A soldering device characterized by being formed into a shape. (2) The soldering device according to claim 1, wherein the mounting angle of the weir plate is adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10914087U JPS6415659U (en) | 1987-07-16 | 1987-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10914087U JPS6415659U (en) | 1987-07-16 | 1987-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6415659U true JPS6415659U (en) | 1989-01-26 |
Family
ID=31345116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10914087U Pending JPS6415659U (en) | 1987-07-16 | 1987-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6415659U (en) |
-
1987
- 1987-07-16 JP JP10914087U patent/JPS6415659U/ja active Pending
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