JPS6415659U - - Google Patents

Info

Publication number
JPS6415659U
JPS6415659U JP10914087U JP10914087U JPS6415659U JP S6415659 U JPS6415659 U JP S6415659U JP 10914087 U JP10914087 U JP 10914087U JP 10914087 U JP10914087 U JP 10914087U JP S6415659 U JPS6415659 U JP S6415659U
Authority
JP
Japan
Prior art keywords
weir plate
sectional
view
soldering device
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10914087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10914087U priority Critical patent/JPS6415659U/ja
Publication of JPS6415659U publication Critical patent/JPS6415659U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のはんだ付け装置の一実施例を
示す断面図、第2図はその要部の断面図、第3図
はその堰板上での流速と波高との関係を示すグラ
フ、第4図は従来のはんだ付け装置の断面図、第
5図はその堰板上でのはんだ流出過程を示す断面
図、第6図はその従来の堰板上での流速と波高と
の関係を示すグラフ、第7図乃至第16図は本考
案を従来例との関連で理論的に補足説明するため
の参考図であり、第7図は従来の堰板の上部を示
す断面図、第8図はその部分における流速・波高
の関係を示すグラフ、第9図はプリント配線基板
がはんだ面から離脱する状態を示す断面図、第1
0図はその離脱部分で生ずる弊害を説明するため
の拡大断面図、第11図は従来のはんだ溜部の断
面図、第12図はその従来の堰板上での表面張力
の釣合い状態を示す拡大断面図、第13図は厚さ
零の堰板を仮定した場合の断面図、第14図は本
考案のナイフエツジ形堰板の上部での表面張力の
釣合い状態を示す拡大断面図、第15図は従来の
堰板および本考案の堰板のF・θ関係を示すグラ
フ、第16図は本考案に係る堰板の具体例を示す
断面図である。 14……ノズル、21……はんだ溜部、33…
…ナイフエツジ形の堰板。
FIG. 1 is a cross-sectional view showing an embodiment of the soldering device of the present invention, FIG. 2 is a cross-sectional view of the main parts thereof, and FIG. 3 is a graph showing the relationship between flow velocity and wave height on the weir plate. Figure 4 is a sectional view of a conventional soldering device, Figure 5 is a sectional view showing the process of solder flowing out on the weir plate, and Figure 6 is the relationship between the flow velocity and wave height on the conventional weir plate. The graphs shown in FIGS. 7 to 16 are reference views for theoretically supplementing the present invention in relation to the conventional example, and FIG. 7 is a sectional view showing the upper part of the conventional weir plate, The figure is a graph showing the relationship between flow velocity and wave height in that part, Figure 9 is a cross-sectional view showing the state in which the printed wiring board is separated from the solder surface, and Figure 1
Figure 0 is an enlarged sectional view to explain the adverse effects that occur at the detached part, Figure 11 is a sectional view of a conventional solder pool, and Figure 12 shows the balanced state of surface tension on the conventional weir plate. FIG. 13 is an enlarged cross-sectional view assuming a weir plate with zero thickness; FIG. 14 is an enlarged cross-sectional view showing the balanced state of surface tension at the upper part of the knife-edge type weir plate of the present invention; FIG. The figure is a graph showing the F/θ relationship between a conventional weir plate and a weir plate according to the present invention, and FIG. 16 is a sectional view showing a specific example of the weir plate according to the present invention. 14... Nozzle, 21... Solder reservoir, 33...
...knife edge shaped weir plate.

Claims (1)

【実用新案登録請求の範囲】 (1) 溶融はんだ噴流ノズルのワーク搬出側には
んだ溜部が設けられ、このはんだ溜部の先端部に
堰板が設けられたはんだ付け装置において、堰板
をナイフエツジ形に形成したことを特徴とするは
んだ付け装置。 (2) 堰板の取付角度が調整可能であることを特
徴とする実用新案登録請求の範囲第1項記載のは
んだ付け装置。
[Scope of Claim for Utility Model Registration] (1) In a soldering device in which a solder reservoir is provided on the workpiece delivery side of a molten solder jet nozzle and a weir plate is provided at the tip of this solder reservoir, the weir plate is attached to a knife edge. A soldering device characterized by being formed into a shape. (2) The soldering device according to claim 1, wherein the mounting angle of the weir plate is adjustable.
JP10914087U 1987-07-16 1987-07-16 Pending JPS6415659U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10914087U JPS6415659U (en) 1987-07-16 1987-07-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10914087U JPS6415659U (en) 1987-07-16 1987-07-16

Publications (1)

Publication Number Publication Date
JPS6415659U true JPS6415659U (en) 1989-01-26

Family

ID=31345116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10914087U Pending JPS6415659U (en) 1987-07-16 1987-07-16

Country Status (1)

Country Link
JP (1) JPS6415659U (en)

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