JPS62199261U - - Google Patents
Info
- Publication number
- JPS62199261U JPS62199261U JP8587586U JP8587586U JPS62199261U JP S62199261 U JPS62199261 U JP S62199261U JP 8587586 U JP8587586 U JP 8587586U JP 8587586 U JP8587586 U JP 8587586U JP S62199261 U JPS62199261 U JP S62199261U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- jet
- warpage
- warpage prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案そり防止部材をとりつけた噴流
ノズル部の斜視図、第２図は同上一部切欠側面図
、第３図はそり防止部材の平面図である。
１……噴流ノズル、２……プリント基板、３…
…台板、３ａ……案内長孔、３ｂ……ネジ穴、４
……締付ボルト、５……そり防止部材、５ａ……
円弧面、５ｂ……そり防止板部、５ｃ……案内長
孔、５ｄ……取付板部、６……締付ボルト。
FIG. 1 is a perspective view of a jet nozzle portion to which a warpage prevention member of the present invention is attached, FIG. 2 is a partially cutaway side view of the same, and FIG. 3 is a plan view of the warpage prevention member. 1... Jet nozzle, 2... Printed circuit board, 3...
...Bed plate, 3a...Guide slot, 3b...Screw hole, 4
...Tightening bolt, 5...Warpage prevention member, 5a...
Arc surface, 5b...Warpage prevention plate part, 5c...Guide slot, 5d...Mounting plate part, 6...Tightening bolt.
Claims (1)
だの波を、プリント基板の下面に接触させる噴流
式はんだ槽において、 (b) 上記噴流ノズルの上側に、プリント基板の
進行方向と平行で、かつ、通過するプリント基板
の下面に小さい面積で接触するそり防止部材を配
設したことを特徴とする噴流式はんだ槽における
プリント基板のそり防止機構。 〔第２項〕 そり防止部材が複数である実用新案登録請求の
範囲第１項記載の噴流式はんだ槽におけるプリン
ト基板のそり防止機構。 〔第３項〕 そり防止部材がプリント基板の進行方向にそつ
て移動調節可能で、そり防止部材の高さ調整を可
能とした実用新案登録請求の範囲第１，２項記載
の噴流式はんだ槽におけるプリント基板のそり防
止機構。 〔第４項〕 そり防止部材が、プリント基板の進行方向と直
交する方向に移動調節可能である実用新案登録請
求の範囲第１，２，３項記載の噴流式はんだ槽に
おけるプリント基板のそり防止機構。[Scope of Claim for Utility Model Registration] [Paragraph 1] (a) In a jet type soldering tank in which waves of solder jetted out from a jet nozzle provided in the tank come into contact with the lower surface of a printed circuit board, (b) The jet nozzle described above A warpage prevention mechanism for a printed circuit board in a jet soldering bath, characterized by a warpage prevention member disposed on the upper side, parallel to the traveling direction of the printed circuit board, and in contact with a small area of the lower surface of the printed circuit board passing through. . [Claim 2] A warpage prevention mechanism for a printed circuit board in a jet solder bath according to claim 1, which includes a plurality of warp prevention members. [Claim 3] The jet-flow solder bath according to claims 1 and 2 of the utility model registration claim, in which the warpage prevention member is movable and adjustable along the traveling direction of the printed circuit board, and the height of the warp prevention member can be adjusted. Warpage prevention mechanism for printed circuit boards. [Claim 4] Preventing warpage of a printed circuit board in a jet solder bath according to claims 1, 2, and 3 of the utility model registration claim, wherein the warpage prevention member is movable and adjustable in a direction perpendicular to the traveling direction of the printed circuit board. mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8587586U JPS62199261U (en) | 1986-06-04 | 1986-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8587586U JPS62199261U (en) | 1986-06-04 | 1986-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199261U true JPS62199261U (en) | 1987-12-18 |
Family
ID=30941675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8587586U Pending JPS62199261U (en) | 1986-06-04 | 1986-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199261U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57130764A (en) * | 1981-02-02 | 1982-08-13 | Sony Corp | Jet type automatic soldering device |
| JPS5916765B2 (en) * | 1978-06-14 | 1984-04-17 | 松下電器産業株式会社 | juicer spinner |
-
1986
- 1986-06-04 JP JP8587586U patent/JPS62199261U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5916765B2 (en) * | 1978-06-14 | 1984-04-17 | 松下電器産業株式会社 | juicer spinner |
| JPS57130764A (en) * | 1981-02-02 | 1982-08-13 | Sony Corp | Jet type automatic soldering device |