JPH0342368U - - Google Patents
Info
- Publication number
- JPH0342368U JPH0342368U JP10112289U JP10112289U JPH0342368U JP H0342368 U JPH0342368 U JP H0342368U JP 10112289 U JP10112289 U JP 10112289U JP 10112289 U JP10112289 U JP 10112289U JP H0342368 U JPH0342368 U JP H0342368U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- solders
- lead wires
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示すもの
で、第１図ａは反り防止装置の概略を示す斜視図
、第１図ｂは、第１図ａの要部を示す斜視図、第
２図は、第１図のワイヤとローラの他の形状を示
す側面図、第３図はプリント基板の形状を示す平
面図、第４図ａ，ｂは噴流式はんだ槽におけるプ
リント基板の反り防止機構の従来例を示す側面図
と要部の斜視図、第５図は、第４図ａをプリント
基板の底面側からみた要部の説明図である。
図中、１……プリント基板、１ａ……下面、２
……チツプ部品、１１……反り防止装置、１２…
…はんだ槽、１３……ワイヤ、１４……基台、１
５〜２６……ローラである。
Figures 1a and 1b show an embodiment of this invention; Figure 1a is a perspective view schematically showing a warp prevention device, and Figure 1b is a perspective view showing the main parts of Figure 1a. , FIG. 2 is a side view showing another shape of the wire and roller in FIG. 1, FIG. 3 is a plan view showing the shape of the printed circuit board, and FIGS. 4 a and b are views of the printed circuit board in the jet soldering bath. A side view and a perspective view of the main parts of a conventional warp prevention mechanism, and FIG. 5 is an explanatory diagram of the main parts of FIG. 4a viewed from the bottom side of the printed circuit board. In the figure, 1...Printed circuit board, 1a...bottom surface, 2
...Chip parts, 11...Warpage prevention device, 12...
...Solder bath, 13...Wire, 14...Base, 1
5 to 26...Rollers.
Claims (1)
子部品を装着したプリント基板にはんだ付けを行
うはんだ付け装置に用いるプリント基板の反り防
止装置であつて、前記プリント基板の走行方向と
同一方向で、かつ電気プリント基板の走行速度と
同一速度で走行する無端状のワイヤを前記プリン
ト基板の下面に接触するように張架したことを特
徴とするプリント基板の反り防止装置。 A printed circuit board warping prevention device used in a soldering device that solders a printed circuit board on which chip components and/or electronic components having lead wires are mounted, the device being used in a soldering device that solders a printed circuit board on which chip components and/or electronic components having lead wires are attached. A device for preventing warpage of a printed circuit board, characterized in that an endless wire running at the same speed as the running speed of the printed circuit board is stretched so as to be in contact with the lower surface of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10112289U JPH0342368U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10112289U JPH0342368U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0342368U true JPH0342368U (en) | 1991-04-22 |
Family
ID=31650089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10112289U Pending JPH0342368U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0342368U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002240920A (en) * | 2001-02-20 | 2002-08-28 | Tamura Seisakusho Co Ltd | Carrying device and heating device |
-
1989
- 1989-08-31 JP JP10112289U patent/JPH0342368U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002240920A (en) * | 2001-02-20 | 2002-08-28 | Tamura Seisakusho Co Ltd | Carrying device and heating device |
| JP4596660B2 (en) * | 2001-02-20 | 2010-12-08 | 株式会社タムラ製作所 | Conveying device and heating device |
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