JPH03101573U - - Google Patents
Info
- Publication number
- JPH03101573U JPH03101573U JP975290U JP975290U JPH03101573U JP H03101573 U JPH03101573 U JP H03101573U JP 975290 U JP975290 U JP 975290U JP 975290 U JP975290 U JP 975290U JP H03101573 U JPH03101573 U JP H03101573U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- dip treatment
- solder dip
- circuit components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る回路基板の要
部拡大断面図、第２図は回路基板の全体の平面図
、第３図は半田デイツプ層への回路基板の供給を
示す要部斜視図、第４図は半田デイツプ処理を行
なつている状態を示す要部正面図である。
また図面中の主要な部分の名称はつぎの通りで
ある。１０……回路基板、１１……半田レジスト
装置、１２……保護被膜、１５……電子部品、１
６……ＩＣ、１７……半田浴、１８……レール、
１９……たわみ変形防止用治具。
Fig. 1 is an enlarged sectional view of the main parts of a circuit board according to an embodiment of the present invention, Fig. 2 is a plan view of the entire circuit board, and Fig. 3 is a main part showing the supply of the circuit board to the solder dip layer. The perspective view and FIG. 4 are front views of main parts showing a state in which solder dip processing is being performed. The names of the main parts in the drawings are as follows. 10... Circuit board, 11... Solder resist device, 12... Protective film, 15... Electronic component, 1
6...IC, 17...Solder bath, 18...Rail,
19...Jig for preventing deflection and deformation.
Claims (1)
半田デイツプ処理によつて前記回路部品と回路基
板上の配線パターンとが電気的に接続されるよう
になつている回路基板において、 前記半田デイツプ処理の際に変形防止用治具と
接触する部分の半田レジスト層の上に予め印刷に
よつて保護被膜を形成するようにしたことを特徴
とする回路基板。[Scope of claim for utility model registration] Circuit components are mounted on it, and
In a circuit board on which the circuit components and the wiring pattern on the circuit board are electrically connected by solder dip treatment, the parts that come into contact with the deformation prevention jig during the solder dip treatment are A circuit board characterized in that a protective film is formed in advance on a solder resist layer by printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP975290U JPH03101573U (en) | 1990-02-02 | 1990-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP975290U JPH03101573U (en) | 1990-02-02 | 1990-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101573U true JPH03101573U (en) | 1991-10-23 |
Family
ID=31513340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP975290U Pending JPH03101573U (en) | 1990-02-02 | 1990-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101573U (en) |
-
1990
- 1990-02-02 JP JP975290U patent/JPH03101573U/ja active Pending