JPS63102274U - - Google Patents
Info
- Publication number
- JPS63102274U JPS63102274U JP19782486U JP19782486U JPS63102274U JP S63102274 U JPS63102274 U JP S63102274U JP 19782486 U JP19782486 U JP 19782486U JP 19782486 U JP19782486 U JP 19782486U JP S63102274 U JPS63102274 U JP S63102274U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- surface mount
- hole
- pads
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂは本考案の一実施例のパツド部近
傍の平面図及びＡ―Ａ線断面斜視図、第２図は従
来の印刷配線板のパツド部近傍の平面図である。
１……貫通孔、２……パツド、１０……基板。
FIGS. 1a and 1b are a plan view and a cross-sectional perspective view taken along the line A--A of an embodiment of the present invention near the pad, and FIG. 2 is a plan view near the pad of a conventional printed wiring board. 1... Through hole, 2... Pad, 10... Board.
Claims (1)
田付けするパツドを有する印刷配線板において、
前記表面実装用部品を装着する部位の表裏の回路
パターンに接触しない位置に貫通孔を設けたこと
を特徴とする印刷配線板。 In printed wiring boards that have pads for soldering multiple leads of surface mount components using a jet method,
A printed wiring board, characterized in that a through hole is provided at a position that does not contact circuit patterns on the front and back sides of a portion where the surface mount component is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19782486U JPS63102274U (en) | 1986-12-22 | 1986-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19782486U JPS63102274U (en) | 1986-12-22 | 1986-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63102274U true JPS63102274U (en) | 1988-07-02 |
Family
ID=31157942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19782486U Pending JPS63102274U (en) | 1986-12-22 | 1986-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102274U (en) |
-
1986
- 1986-12-22 JP JP19782486U patent/JPS63102274U/ja active Pending