JPS6246181U - - Google Patents
Info
- Publication number
- JPS6246181U JPS6246181U JP13684085U JP13684085U JPS6246181U JP S6246181 U JPS6246181 U JP S6246181U JP 13684085 U JP13684085 U JP 13684085U JP 13684085 U JP13684085 U JP 13684085U JP S6246181 U JPS6246181 U JP S6246181U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- nozzle
- circuit board
- printed circuit
- solder tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Description
第１図は本考案の第１実施例の第１ノズル部を
示す図で、Ａは平面図、Ｂは側面図、第２図は本
考案の第２実施例の第１ノズル部を示す図で、Ａ
は平面図、Ｂは側面図、第３図は噴流式自動ハン
ダ付装置の動作を説明する図、第４図〜第７図は
従来の第１ノズル部の構造例を示す図で、各図の
Ａは平面図、Ｂは側面図である。
１……第１ハンダ槽、２……第２ハンダ槽、４
……第２ノズル、５……チツプ型電子部品、６…
…プリント基板、７……溶融ハンダ、２１……第
１ノズル、２１ａ……噴口部、２２……第１ガイ
ド部材、２３……角棒、２４……整流板、２５…
…第２ガイド部材、３１……丸棒、３２……整流
板、３３……ガイド部材。
Fig. 1 is a diagram showing the first nozzle part of the first embodiment of the present invention, A is a plan view, B is a side view, and Fig. 2 is a diagram showing the first nozzle part of the second embodiment of the invention. So, A
is a plan view, B is a side view, FIG. 3 is a diagram explaining the operation of the jet type automatic soldering device, and FIGS. 4 to 7 are diagrams showing structural examples of the conventional first nozzle part. A is a plan view, and B is a side view. 1...First solder tank, 2...Second solder tank, 4
...Second nozzle, 5...Chip type electronic component, 6...
... Printed circuit board, 7 ... Molten solder, 21 ... First nozzle, 21a ... Spout part, 22 ... First guide member, 23 ... Square bar, 24 ... Current plate, 25 ...
...Second guide member, 31... Round bar, 32... Current plate, 33... Guide member.
Claims (1)
隣接して配置し、第１ハンダ槽にフラツクスガス
除去用の第１ノズルを、第２ハンダ槽にハンダ仕
上処理用の第２ノズルを、それぞれハンダ液面よ
り突出させて設け、電子部品を取り付けたプリン
ト基板を第１ハンダ槽側から第２ハンダ槽側に向
けて各ノズルより噴出する溶融ハンダ中に浸漬さ
せて搬送することにより自動的にハンダ付を行う
噴流式自動ハンダ付装置において、前記第１ノズ
ルの噴口部に、少なくとも上部にプリント基板の
進行方向に対して斜めに板部材を列設した整流手
段を設けたことを特徴とする噴流式自動ハンダ付
装置。 First and second solder tanks that store molten solder are arranged adjacently, and the first solder tank is equipped with a first nozzle for removing flux gas, and the second solder tank is equipped with a second nozzle for finishing solder. The printed circuit board protrudes from the liquid surface and is automatically soldered by immersing and transporting the printed circuit board with electronic components attached to it from the first solder tank to the second solder tank sprayed from each nozzle. A jet-type automatic soldering device for soldering, characterized in that the spout of the first nozzle is provided with a rectifying means in which plate members are arranged obliquely with respect to the traveling direction of the printed circuit board at least in the upper part. Automatic soldering device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13684085U JPS6246181U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13684085U JPS6246181U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6246181U true JPS6246181U (en) | 1987-03-20 |
Family
ID=31040330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13684085U Pending JPS6246181U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6246181U (en) |
-
1985
- 1985-09-09 JP JP13684085U patent/JPS6246181U/ja active Pending
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