JPS5985669U - Jet soldering device - Google Patents

Jet soldering device

Info

Publication number
JPS5985669U
JPS5985669U JP18142382U JP18142382U JPS5985669U JP S5985669 U JPS5985669 U JP S5985669U JP 18142382 U JP18142382 U JP 18142382U JP 18142382 U JP18142382 U JP 18142382U JP S5985669 U JPS5985669 U JP S5985669U
Authority
JP
Japan
Prior art keywords
jet
solder
soldering
soldering device
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18142382U
Other languages
Japanese (ja)
Inventor
前　利明
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP18142382U priority Critical patent/JPS5985669U/en
Publication of JPS5985669U publication Critical patent/JPS5985669U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の噴流式半田付は装置の一実施例を示
す概略構成図、第２図はその噴流高さ制御手段の一実施
例を示す回路構成図である。 １・・・噴流式半田付は装置、２・・・ヒータ付きの半
田槽、３・・・半田、４・・・噴流ノズル、５・・・物
体、６・・・プロペラ式攪拌機、６ａ・・・プロペラ、
７ａ・・・変速機、７・・・モータ、８・・・物体検出
器、９・・・タイマ回路。FIG. 1 is a schematic diagram showing an embodiment of the jet soldering apparatus of the present invention, and FIG. 2 is a circuit diagram showing an embodiment of the jet height control means. 1... Equipment for jet soldering, 2... Solder tank with heater, 3... Solder, 4... Jet nozzle, 5... Object, 6... Propeller type stirrer, 6a. ··propeller,
7a...Transmission, 7...Motor, 8...Object detector, 9...Timer circuit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田槽内の溶融半田を噴流ノズルから上方に噴出せしめ
、半田付けしようとする物体の下面に半田付けを行なう
噴流式半田付は装置において、前記噴流ノズルから所定
距離間させて設けられ、前記半田付けしようにとする物
体の到来を検知する検知器と、該検知器の検知出力によ
って作動し、前記噴流ノズルから噴出する半田の噴流高
さを半田付けに適した高さに高める噴流高さ制御手段と
を設けてなる噴流式半田付は装置。In a jet type soldering device, molten solder in a solder tank is jetted upward from a jet nozzle to solder the bottom surface of an object to be soldered. a detector that detects the arrival of an object to be attached; and a jet height control that is activated by the detection output of the detector and increases the height of the solder jet spouted from the jet nozzle to a height suitable for soldering. Jet soldering is a device comprising means and means.
JP18142382U 1982-11-30 1982-11-30 Jet soldering device Pending JPS5985669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18142382U JPS5985669U (en) 1982-11-30 1982-11-30 Jet soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18142382U JPS5985669U (en) 1982-11-30 1982-11-30 Jet soldering device

Publications (1)

Publication Number Publication Date
JPS5985669U true JPS5985669U (en) 1984-06-09

Family

ID=30393136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18142382U Pending JPS5985669U (en) 1982-11-30 1982-11-30 Jet soldering device

Country Status (1)

Country Link
JP (1) JPS5985669U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6238763A (en) * 1985-08-13 1987-02-19 Hitachi Ltd Method and device for controlling wave height of jet solder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6238763A (en) * 1985-08-13 1987-02-19 Hitachi Ltd Method and device for controlling wave height of jet solder

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