JPS5954163U - soldering equipment - Google Patents

soldering equipment

Info

Publication number
JPS5954163U
JPS5954163U JP14861282U JP14861282U JPS5954163U JP S5954163 U JPS5954163 U JP S5954163U JP 14861282 U JP14861282 U JP 14861282U JP 14861282 U JP14861282 U JP 14861282U JP S5954163 U JPS5954163 U JP S5954163U
Authority
JP
Japan
Prior art keywords
soldering
soldering equipment
jet
solder
jet surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14861282U
Other languages
Japanese (ja)
Inventor
隆夫 橋本
浩二 大西
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP14861282U priority Critical patent/JPS5954163U/en
Publication of JPS5954163U publication Critical patent/JPS5954163U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案になる噴流口を設置した溶融はんだ槽の斜視
図、なお図において、 １・・・溶融はんだ槽、２・・・噴流口、３・・・フォ
ーマ−１４・・・フォーマ−１Ａ・・・噴流口最上部で
ある。The figure is a perspective view of a molten solder tank in which a jet port according to the present invention is installed. In the figure, 1... molten solder tank, 2... jet port, 3... former-14... former-1A ...This is the top of the jet orifice.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気部品を搭載した印刷基板等の被はんだ付は部品を噴
流はんだ面に浸すことによりはんだ付けするはんだ付は
装置において、前記噴流面の溶融はんだ流速を可変させ
るための噴流口最上部に縁を中心に可動するフォーマ−
を有することを特徴とするはんだ付は装置。For soldering of printed circuit boards, etc. on which electrical components are mounted, parts are soldered by dipping them into the solder jet surface.In the soldering equipment, a lip is placed at the top of the jet port to vary the flow rate of the molten solder on the jet surface. Former that moves in the center
A soldering device characterized by having:
JP14861282U 1982-09-30 1982-09-30 soldering equipment Pending JPS5954163U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14861282U JPS5954163U (en) 1982-09-30 1982-09-30 soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14861282U JPS5954163U (en) 1982-09-30 1982-09-30 soldering equipment

Publications (1)

Publication Number Publication Date
JPS5954163U true JPS5954163U (en) 1984-04-09

Family

ID=30330127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14861282U Pending JPS5954163U (en) 1982-09-30 1982-09-30 soldering equipment

Country Status (1)

Country Link
JP (1) JPS5954163U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539326B2 (en) * 1974-01-07 1978-04-05
JPS57142766A (en) * 1981-02-26 1982-09-03 Sony Corp Jet type automatic soldering device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539326B2 (en) * 1974-01-07 1978-04-05
JPS57142766A (en) * 1981-02-26 1982-09-03 Sony Corp Jet type automatic soldering device

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