JPS5834771U - automatic soldering equipment - Google Patents

automatic soldering equipment

Info

Publication number
JPS5834771U
JPS5834771U JP13020281U JP13020281U JPS5834771U JP S5834771 U JPS5834771 U JP S5834771U JP 13020281 U JP13020281 U JP 13020281U JP 13020281 U JP13020281 U JP 13020281U JP S5834771 U JPS5834771 U JP S5834771U
Authority
JP
Japan
Prior art keywords
automatic soldering
soldering equipment
solder
jet devices
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13020281U
Other languages
Japanese (ja)
Other versions
JPS6113157Y2 (en
Inventor
白石 潔
稔 佐藤
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP13020281U priority Critical patent/JPS5834771U/en
Publication of JPS5834771U publication Critical patent/JPS5834771U/en
Application granted granted Critical
Publication of JPS6113157Y2 publication Critical patent/JPS6113157Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は共に本考案実施例を示す斜視図お
よび上面図である。 1・・・平面デツプ槽、2A、  2B・・・半田噴流
装置、3A、  3B・・・半田噴流口、6・・・半田
流動路、7・・・部品通過方向。
1 and 2 are both a perspective view and a top view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Flat depth tank, 2A, 2B...Solder jet device, 3A, 3B...Solder jet port, 6...Solder flow path, 7...Component passage direction.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 二つの半田噴流装置を対向して設置し、これら二つの半
田噴流装置から噴流される半田によって形成される半田
流動路表面を部品を通過させることにより半田付けを行
わせるように構成したことを特徴とする自動半田付は装
置。
Two solder jet devices are installed facing each other, and soldering is performed by passing the component through the solder flow path surface formed by the solder jetted from these two solder jet devices. and automatic soldering equipment.
JP13020281U 1981-09-01 1981-09-01 automatic soldering equipment Granted JPS5834771U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13020281U JPS5834771U (en) 1981-09-01 1981-09-01 automatic soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13020281U JPS5834771U (en) 1981-09-01 1981-09-01 automatic soldering equipment

Publications (2)

Publication Number Publication Date
JPS5834771U true JPS5834771U (en) 1983-03-07
JPS6113157Y2 JPS6113157Y2 (en) 1986-04-23

Family

ID=29923843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13020281U Granted JPS5834771U (en) 1981-09-01 1981-09-01 automatic soldering equipment

Country Status (1)

Country Link
JP (1) JPS5834771U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50126546A (en) * 1974-03-27 1975-10-04
JPS5149738U (en) * 1974-10-15 1976-04-15
JPS5671576A (en) * 1979-11-14 1981-06-15 Matsushita Electric Ind Co Ltd Jet type soldering device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50126546A (en) * 1974-03-27 1975-10-04
JPS5149738U (en) * 1974-10-15 1976-04-15
JPS5671576A (en) * 1979-11-14 1981-06-15 Matsushita Electric Ind Co Ltd Jet type soldering device

Also Published As

Publication number Publication date
JPS6113157Y2 (en) 1986-04-23

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