JPS59102255U - solder bath - Google Patents

solder bath

Info

Publication number
JPS59102255U
JPS59102255U JP19572582U JP19572582U JPS59102255U JP S59102255 U JPS59102255 U JP S59102255U JP 19572582 U JP19572582 U JP 19572582U JP 19572582 U JP19572582 U JP 19572582U JP S59102255 U JPS59102255 U JP S59102255U
Authority
JP
Japan
Prior art keywords
solder bath
partition plate
abstract
tank
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19572582U
Other languages
Japanese (ja)
Inventor
奥山　森
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to JP19572582U priority Critical patent/JPS59102255U/en
Publication of JPS59102255U publication Critical patent/JPS59102255U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案はんだ槽の一部を破断した平面図、第２
図は第１図■−■線断面図、第３図は第１図ｌｌｌ−１
線断面図である。 １・・・はんだ槽、２，３・・・ノズル、６・・・流通
路、７・・・仕切板、８・・・ダンパー。Figure 1 is a partially cutaway plan view of the solder bath of the present invention;
The figure is a sectional view taken along the line ■-■ in Figure 1, and Figure 3 is a cross-sectional view taken in Figure 1ll-1.
FIG. 1... Solder bath, 2, 3... Nozzle, 6... Distribution path, 7... Partition plate, 8... Damper.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 平行に設置された二本のノズルの下槽が流通路の途中ま
で達する仕切板で仕切られており、該仕切板の端には回
動自在なダンパーが設置されていることを特徴とするは
んだ槽。A soldering device characterized in that the lower tanks of two nozzles installed in parallel are separated by a partition plate that reaches halfway through the flow path, and a rotatable damper is installed at the end of the partition plate. Tank.
JP19572582U 1982-12-27 1982-12-27 solder bath Pending JPS59102255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19572582U JPS59102255U (en) 1982-12-27 1982-12-27 solder bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19572582U JPS59102255U (en) 1982-12-27 1982-12-27 solder bath

Publications (1)

Publication Number Publication Date
JPS59102255U true JPS59102255U (en) 1984-07-10

Family

ID=30420231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19572582U Pending JPS59102255U (en) 1982-12-27 1982-12-27 solder bath

Country Status (1)

Country Link
JP (1) JPS59102255U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267818A (en) * 1975-12-04 1977-06-04 Babcock Hitachi Kk Duct damper
JPS57112094A (en) * 1980-12-29 1982-07-12 Alps Electric Co Ltd Soldering device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267818A (en) * 1975-12-04 1977-06-04 Babcock Hitachi Kk Duct damper
JPS57112094A (en) * 1980-12-29 1982-07-12 Alps Electric Co Ltd Soldering device

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