JPS57112094A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS57112094A
JPS57112094A JP55185429A JP18542980A JPS57112094A JP S57112094 A JPS57112094 A JP S57112094A JP 55185429 A JP55185429 A JP 55185429A JP 18542980 A JP18542980 A JP 18542980A JP S57112094 A JPS57112094 A JP S57112094A
Authority
JP
Japan
Prior art keywords
soldering device
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55185429A
Other languages
Japanese (ja)
Other versions
JPS6040947B2 (en
Inventor
Takeshi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP55185429A priority Critical patent/JPS6040947B2/en
Priority to KR1019810003262A priority patent/KR850000167B1/en
Publication of JPS57112094A publication Critical patent/JPS57112094A/en
Publication of JPS6040947B2 publication Critical patent/JPS6040947B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP55185429A 1980-12-29 1980-12-29 soldering equipment Expired JPS6040947B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP55185429A JPS6040947B2 (en) 1980-12-29 1980-12-29 soldering equipment
KR1019810003262A KR850000167B1 (en) 1980-12-29 1981-08-31 Equipment for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55185429A JPS6040947B2 (en) 1980-12-29 1980-12-29 soldering equipment

Publications (2)

Publication Number Publication Date
JPS57112094A true JPS57112094A (en) 1982-07-12
JPS6040947B2 JPS6040947B2 (en) 1985-09-13

Family

ID=16170624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55185429A Expired JPS6040947B2 (en) 1980-12-29 1980-12-29 soldering equipment

Country Status (2)

Country Link
JP (1) JPS6040947B2 (en)
KR (1) KR850000167B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58178593A (en) * 1982-04-13 1983-10-19 横田機械株式会社 Method and device for soldering printed board
JPS59102255U (en) * 1982-12-27 1984-07-10 千住金属工業株式会社 solder bath
JPS60106192A (en) * 1983-11-14 1985-06-11 松下電器産業株式会社 Method of soldering printed board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58178593A (en) * 1982-04-13 1983-10-19 横田機械株式会社 Method and device for soldering printed board
JPH0373156B2 (en) * 1982-04-13 1991-11-20 Yokota Kikai Kk
JPS59102255U (en) * 1982-12-27 1984-07-10 千住金属工業株式会社 solder bath
JPS60106192A (en) * 1983-11-14 1985-06-11 松下電器産業株式会社 Method of soldering printed board

Also Published As

Publication number Publication date
KR850000167B1 (en) 1985-02-28
JPS6040947B2 (en) 1985-09-13
KR830007034A (en) 1983-10-12

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