JPS57112094A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS57112094A JPS57112094A JP55185429A JP18542980A JPS57112094A JP S57112094 A JPS57112094 A JP S57112094A JP 55185429 A JP55185429 A JP 55185429A JP 18542980 A JP18542980 A JP 18542980A JP S57112094 A JPS57112094 A JP S57112094A
- Authority
- JP
- Japan
- Prior art keywords
- soldering device
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55185429A JPS6040947B2 (en) | 1980-12-29 | 1980-12-29 | soldering equipment |
KR1019810003262A KR850000167B1 (en) | 1980-12-29 | 1981-08-31 | Equipment for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55185429A JPS6040947B2 (en) | 1980-12-29 | 1980-12-29 | soldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57112094A true JPS57112094A (en) | 1982-07-12 |
JPS6040947B2 JPS6040947B2 (en) | 1985-09-13 |
Family
ID=16170624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55185429A Expired JPS6040947B2 (en) | 1980-12-29 | 1980-12-29 | soldering equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6040947B2 (en) |
KR (1) | KR850000167B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58178593A (en) * | 1982-04-13 | 1983-10-19 | 横田機械株式会社 | Method and device for soldering printed board |
JPS59102255U (en) * | 1982-12-27 | 1984-07-10 | 千住金属工業株式会社 | solder bath |
JPS60106192A (en) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | Method of soldering printed board |
-
1980
- 1980-12-29 JP JP55185429A patent/JPS6040947B2/en not_active Expired
-
1981
- 1981-08-31 KR KR1019810003262A patent/KR850000167B1/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58178593A (en) * | 1982-04-13 | 1983-10-19 | 横田機械株式会社 | Method and device for soldering printed board |
JPH0373156B2 (en) * | 1982-04-13 | 1991-11-20 | Yokota Kikai Kk | |
JPS59102255U (en) * | 1982-12-27 | 1984-07-10 | 千住金属工業株式会社 | solder bath |
JPS60106192A (en) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | Method of soldering printed board |
Also Published As
Publication number | Publication date |
---|---|
KR850000167B1 (en) | 1985-02-28 |
JPS6040947B2 (en) | 1985-09-13 |
KR830007034A (en) | 1983-10-12 |
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